This article describes the general aspects of and practical problems of failure analysis of creep, stress relaxation, and yielding for homogeneous polymers. The effect of temperature and strain rate on the relationship between yield point and elastic modulus and the aging effect that polymers often undergo at room temperature are also discussed.

A typical mobile processor die may contain, among other things, a variety of high-performance as well as low-power processing cores along with 5G modems, Wi-Fi modules, image processors, GPUs, and security modules, with a total transistor count exceeding 10 billion. Such designs pose many challenges for yield ramp and diagnostics. This chapter examines these challenges and the growing demand for innovative solutions to help failure analysts quickly and accurately isolate faults. It also assesses the capabilities and future potential of ATPG scan diagnostics, streaming scan networks, and advanced fault models for diagnosing embedded memory.