This appendix provides a brief introduction to Thermo-Calc, explains what it is, and lists its uses. Instructions for accessing a demonstration version of the software are also provided.

Quantifying a fault-tree analysis is a useful tool for assessing the most likely causes of a system failure. This chapter addresses fault-tree analysis event probabilities and ranking of failure causes based on these probabilities. Failure rates, failure-rate sources, probability determinations, mean times between failure, and related topics are also discussed. The discussion covers the practices observed in fault-tree analysis quantification and processes involved in calculating the probability of the top undesired event.

This chapter explains how to prepare material samples for optical microscopy, the most common method for characterizing the microstructure of cast iron and steel. It provides information on sectioning, mounting, polishing, etching, and recording. It describes the nature of surface roughness, the factors that contribute to it, and its effect on image quality. It discusses the use of fixturing and holding devices, includes photographic examples of polishing defects and drying marks, and provides an overview of micrographic etchants and the features they reveal. It also describes the steps involved in replicating part surfaces.

This article provides an overview of how to use the scanning electron microscope (SEM) for imaging integrated circuits. The discussion covers the principles of operation and practical techniques of the SEM. The techniques include sample mounting, sample preparation, sputter coating, sample tilt and image composition, focus and astigmatism correction, dynamic focus and image correction, raster alignment, and adjusting brightness and contrast. The article also provides information on achieving ultra-high resolution in the SEM. It concludes with information on the general characteristics and applications of environmental SEM.

This chapter provides a general overview of titanium and its versatility as an engineering material.

The hidden factory refers to the activities associated with scrap and rework. This chapter presents a rudimentary understanding of what sorts of things the hidden factory is doing, focusing on how to get one's arms around the rejections that occur most frequently or have the highest cost. It provides information on the use of Pareto analyses from both frequency-of-occurrence and cost perspectives to target specific areas for improvement.

Failure mode assessment and assignment (FMA&A) is a tool designed to help organize the evaluation of hypothesized failure modes. This chapter begins by describing the process of preparing an FMA&A. It then describes the follow-on activities to evaluate the hypothesized failure cause. The chapter also provides information on evaluating the hypothesized potential causes.

This chapter describes the procedures and processes used to chemically analyze beryllium samples. It discusses gravimetric, volumetric, colorimetric, and fluorometric techniques, radiochemical separation and assay, and the use of emission spectrometry and polarographic methods.

This article discusses the molecular mechanism, environmental criteria, and material optimization of environmental stress crazing (ESC) in glassy thermoplastics, polyethylenes, and nylons. In addition, it provides information on various tests used to determine relative susceptibility to ESC, namely constant tensile load testing and constant-strain testing.

This chapter covers special fault-tree analysis topics, including the use of transfer symbols, INHIBIT gates, sequential AND gates, state-of-the-part versus state-of-the-system considerations, and the fault tree to identify redundancy-defeating failures.

This chapter targets areas that determine if a change occurred and if the change induced the failure: change or what's different analysis. It describes the different sources of changes that induce process deficiencies: design, process, test and inspection, environmental, supplier lot, aging, and supplier changes. The chapter presents an example of a cluster bomb failure to explain how the failure analysis team found and corrected the failure cause.

This chapter describes some common pitfalls encountered in failure investigations and provides guidance to help engineers recognize processes and “quick fixes” that companies often try to substitute for failure analysis. It discusses three important skills and characteristics that a professional engineer must improve to conduct an effective and successful failure investigation, namely technical skills, communication skills, and technical integrity. The chapter also provides information on the additional basic tools available for failure investigation and root cause determination: the Kepner-Tregoe structured problem-solving method, PROACT software for root cause analysis developed by the Reliability Center, Inc., and other processes and methods developed by the Failsafe Network, Inc., and Shainin LLC.

After the fault-tree, a failure-cause identification method has identified potential failure causes and the failure analysis team has prepared a failure mode assessment and assignment (FMA&A). The team knows specifically what to search for when examining components and subassemblies from the failed system. There are numerous techniques and technologies available for examining and analyzing components and subassemblies, which are categorized as follows: optical approaches, dimensional inspection and related approaches, nondestructive test approaches, mechanical and environmental approaches, and chemical and composition analysis for assessing material characteristics. This chapter is a detailed account of the working principle and the steps involved in these techniques and technologies.

Titanium is a lightweight metal with a density approximately 60% that of steel and, through alloying and deformation processing, it can be just as strong. It is readily available in many grades and forms and can be further processed using standard methods and techniques. This chapter provides a concise review of the capabilities of titanium and its design advantages over other materials. It includes information on properties and selection factors as well as applications.

This chapter provides a detailed analysis of the cyclic stress-strain behavior of materials under uniaxial stress and strain cycling. It first considers the case of a stable material under constant-amplitude strain cycling then broadens the discussion to materials that harden or soften with continued strain reversals. It compares and contrasts the response patterns of such materials, explaining how the movement of dispersed particles and dislocations influences their behavior. It then examines the behavior of materials under uniaxial strain reversals of varying amplitude and explains how to construct double-amplitude stress-strain curves that account for complex straining histories. For special cases, those involving complex materials such as gray cast iron or highly complex straining patterns, the chapter presents other methods of analysis, including the rainflow cycle counting method, mechanical modeling based on displacement-limited elements, Wetzel’s method, and deformation modeling. It also explains the difference between force cycling and stress cycling and presents alternate techniques for predicting whether a material will become harder or softer in response to strain cycling.

This appendix provides supplemental information on the metallurgical aspects of atomic structure, the use of dislocation theory, heat treatment processes and procedures, important engineering materials and strengthening mechanisms, and the nature of elastic, plastic, and creep strain components. It also provides information on mechanical property and fatigue testing, the use of hysteresis energy to analyze fatigue, a procedure for inverting equations to solve for dependent variables, and a method for dealing with the statistical nature of failure.

Parts of machines and equipment that have previously been designed as wrought or fabricated parts, or as cast parts of metals other than steel, are often reconsidered as steel castings. This chapter presents bending test data for several junction designs of L and box sections and discusses redesign from fabrication, forgings, and cast iron. The chapter also includes the benefits of redesign.

This chapter discusses the concept of mean stress and explains how it is used in fatigue analysis and design. It begins by examining the stress-strain response of test samples subjected to cyclic forces and strains, noting important features and what they reveal about materials and their fatigue behaviors. It then discusses the challenge of developing hysteresis loops for complex loading patterns and accounting for effects such as ratcheting and stress relaxation. The sections that follow provide a summary of the various ways mean stress is described in the literature and the methods used to calculate or predict its effect on the fatigue life of machine components. The discussion also sheds light on why tensile mean stress is detrimental to both fatigue life and ductility, while compressive mean stress is highly beneficial.

Cross-sectioning refers to the process of exposing the internal layers and printed devices below the surface by cleaving through the wafer. This article discusses in detail the steps involved in common cross-sectioning methods. These include sample preparation, scribing, indenting, and cleaving. The article also provides information on options for mounting, handling, and cleaning of samples during and after the cleaving process. The general procedures, tools required, and considerations that need to be taken into account to perform these techniques are considered.

This chapter presents an overview of microprocessor and application specific integrated circuit (IC) testing. It begins with a description of key industry trends that will impact how ICs will be tested in the future. Next, it provides a brief description of the most common tests applied in the IC industry, where technical issues that are causing methodology changes are emphasized. These include functional testing, structural testing, scan-based delay testing, built-in self-testing, memory testing, analog circuit testing, system-on-a-chip testing, and reliability testing. Trends discussed have driven the development of novel focus areas in test and the chapter discusses several of those areas, including test data volume containment, test power containment, and novel methods of defect-based test.