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Image
Published: 01 November 2010
Image
Published: 01 November 2019
Figure 10 3D excavation visualization collected via Ne + SIMS. The volume dimensions are 1.2 μm x 1.2 μm x 320 nm.
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Published: 01 November 2019
Figure 7 Electron beam – sample interaction volume and interaction products.
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Image
Published: 01 November 2019
Figure 5 Electron beam – sample interaction volume and interaction products.
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Published: 01 November 2019
Figure 25 Comparison interaction volume in thin section of TEM sample and bulk material in SEM (not drawn to scale). The electrons can penetrate as deep as 8 μm in to the bulk sample at 30 keV [36] and degrade spatial resolution. In a thin TEM section, the interaction volume is limited
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in X-Ray Imaging Tools for Electronic Device Failure Analysis[1]
> Microelectronics Failure Analysis: Desk Reference
Published: 01 November 2019
Figure 7 (a) Volume rendering of a flip chip packaging with voxel size of 7 um. (b) Volume rendering of two neighboring BGA solder joints with cross sectional images to show solder contact with pad.
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in X-Ray Imaging Tools for Electronic Device Failure Analysis[1]
> Microelectronics Failure Analysis: Desk Reference
Published: 01 November 2019
Figure 9 Stacked die interconnect analysis. Projection image of extracted volume (center); 3D image of 25 μm diameter Cu-pillar microbump and virtual cross section (left); 3D image and virtual plan-view slice (right) of BEOL metal 6 interconnect (28 nm Si node). [14] .
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in Magnetic Field Imaging for Electrical Fault Isolation[1]
> Microelectronics Failure Analysis: Desk Reference
Published: 01 November 2019
Figure 30 Plasma FIB large-volume removal of the three-stack TSV sample with short. Left top inset is zoom-in into the Chip 1/Chip 2 area. Top right inset is further magnification into the shorted structures, as indicated by red arrows.
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Image
Published: 01 November 2019
Figure 84 Cross section simplified view of the e-beam penetration volume and interactions with the sample. The primary e-beam creates (1) secondary electrons, (2) absorbed current, (3) heating throughout the penetration volume, and if the e-beam reaches the silicon layer, (4) EBIC currents
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in Sources of Failures in Carburized and Carbonitrided Components
> Failure Analysis of Heat Treated Steel Components
Published: 01 September 2008
Fig. 28 Variation of the specific phase volume of different steel transformation phases as a function of temperature. Source: Ref 69
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in Steel Heat Treatment Failures due to Quenching
> Failure Analysis of Heat Treated Steel Components
Published: 01 September 2008
Fig. 6 Specific volume (DV/V) of carbon steels relative to room temperature. Source: Ref 7
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in Steel Heat Treatment Failures due to Quenching
> Failure Analysis of Heat Treated Steel Components
Published: 01 September 2008
Fig. 13 Volume increase of 90MnV8 and 15CrV6 steels as a function of austenitizing temperature and specimen dimensions. Source: Ref 13
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in Steel Failures due to Tempering and Isothermal Heat Treatment
> Failure Analysis of Heat Treated Steel Components
Published: 01 September 2008
Fig. 7 Effect of carbon content on the lath martensite volume, retained austenite volume fraction, and Ms temperature. Source: Adapted from Ref 6
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in Steel Failures due to Tempering and Isothermal Heat Treatment
> Failure Analysis of Heat Treated Steel Components
Published: 01 September 2008
Fig. 8 Specific volume (DV/V) of carbon steels relative to room temperature. Source: Adapted from Ref 7
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Image
Published: 01 October 2011
Fig. 9.12 Effect of carbon content on martensite start temperature and volume percent of retained austenite, γ, in as-quenched martensite
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Published: 01 August 1999
Fig. 12.9 (Part 3) (d) Variation with depth of carbon content, volume fraction of pearlite in the normalized condition, and hardness in the quenched-and-tempered condition for the decarburized 0.4% C steel shown in Fig. 12.9 (Part 1) (a) to (c) .
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Published: 01 August 2013
Fig. 9.11 Change of the specific volume of polyethylene with temperature. If it does not crystallize at the melting temperature, polyethylene will remain a supercooled liquid until it reaches its glass transition temperature. Source: Ref 9.1
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