Skip Nav Destination
Close Modal
Search Results for
voids
Update search
Filter
- Title
- Authors
- Author Affiliations
- Full Text
- Abstract
- Keywords
- DOI
- ISBN
- EISBN
- Issue
- ISSN
- EISSN
- Volume
- References
Filter
- Title
- Authors
- Author Affiliations
- Full Text
- Abstract
- Keywords
- DOI
- ISBN
- EISBN
- Issue
- ISSN
- EISSN
- Volume
- References
Filter
- Title
- Authors
- Author Affiliations
- Full Text
- Abstract
- Keywords
- DOI
- ISBN
- EISBN
- Issue
- ISSN
- EISSN
- Volume
- References
Filter
- Title
- Authors
- Author Affiliations
- Full Text
- Abstract
- Keywords
- DOI
- ISBN
- EISBN
- Issue
- ISSN
- EISSN
- Volume
- References
Filter
- Title
- Authors
- Author Affiliations
- Full Text
- Abstract
- Keywords
- DOI
- ISBN
- EISBN
- Issue
- ISSN
- EISSN
- Volume
- References
Filter
- Title
- Authors
- Author Affiliations
- Full Text
- Abstract
- Keywords
- DOI
- ISBN
- EISBN
- Issue
- ISSN
- EISSN
- Volume
- References
NARROW
Format
Topics
Book Series
Date
Availability
1-20 of 529 Search Results for
voids
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
1
Sort by
Book Chapter
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2010
DOI: 10.31399/asm.tb.omfrc.t53030147
EISBN: 978-1-62708-349-2
... Abstract Achieving the best-performing composite part requires that the processing method and cure cycle create high-quality, low-void-content structures. If voids are present, the performance of the composite will be significantly reduced. There are multiple causes of voids in composite...
Abstract
Achieving the best-performing composite part requires that the processing method and cure cycle create high-quality, low-void-content structures. If voids are present, the performance of the composite will be significantly reduced. There are multiple causes of voids in composite materials; they are generally categorized as voids that are due to volatiles (such as solvents, water) or voids that result from entrapped air. This chapter describes the analysis of various types of voids. It reviews techniques for analysis of voids at ply-drops, voids due to high fiber packing, and voids that occur in honeycomb core composites. The final section of the chapter discusses void documentation through the use of nondestructive inspection techniques and density/specific gravity measurement methods.
Image
Published: 01 December 2018
Fig. 6.15 (a) SEM fractograph showing presence of creep voids on fracture lip surface, 500×; and (b) SEM image of as-polished sample after metallography showing scattered creep voids, 1000×
More
Image
Published: 01 December 2018
Fig. 6.40 SEM fractograph of the rupture surface showing scattered creep voids and cracks
More
Image
in Acoustic Microscopy of Semiconductor Packages
> Microelectronics Failure Analysis: Desk Reference
Published: 01 November 2019
Figure 64 Verification of the contrast in the GHz-SAM images to be voids. Left: acoustic GHz-image. Right: Electron micrograph of a FIB-trench parallel to the sample surface.
More
Image
Published: 01 September 2008
Fig. 10 Primary shrinkage cavity forming large voids of irregular shapes on the component surface. (a) Schematic drawing. (b) Shrinkage cavity compensated for riser
More
Image
in Steel Heat Treatment Failures due to Quenching
> Failure Analysis of Heat Treated Steel Components
Published: 01 September 2008
Fig. 32 Representative view of the crack propagating from porosity or voids within the brazed joint. Unetched. Original magnification: 100×
More
Image
Published: 30 November 2013
Fig. 4 Comparison of wedge-shaped cracks and creep voids: (a) triple-point stress rupture (60×); (b) creep cavitation damage (arrows) in a desuperheater inlet header (1000×)
More
Image
in Alteration of Microstructure
> Metallographer’s Guide: Practices and Procedures for Irons and Steels
Published: 01 March 2002
Fig. 3.36 Microstructure of the same steel in Fig. 3.35 showing voids (rounded, black regions—see arrows) that formed at the junctures of the prior austenite grain boundaries. White-appearing areas at the grain boundaries indicate phosphorus segregation. 4% picral and HCl etch. 100×
More
Image
Published: 01 January 2015
Fig. 3.5 (a) Octahedral and (b) tetrahedral interstitial voids in fcc structure. Source: Ref 3.9
More
Image
Published: 01 January 2015
Fig. 3.6 (a) Octahedral and (b) tetrahedral interstitial voids in bcc structure. Source: Ref 3.9
More
Image
Published: 01 November 2011
Fig. 6.2 Effect of pressure on presence of voids at bond interface of titanium alloy diffusion bonded at temperatures of 980 °C (1795 °F) for 2 h: (a) incomplete bond at 7.0 MPa (1.0 ksi), and (b) complete bond at 10.0 MPa (1.5 ksi). Source: Ref 6.2
More
Image
Published: 01 November 2007
Fig. 15.9 Corrosion attack consisting of voids in a nickel-base alloy after 2 months at 870 °C (1600 °F) in a molten BaCl 2 salt bath. Source: Ref 13
More
Image
in Corrosion by Halogen and Hydrogen Halides
> High-Temperature Corrosion and Materials Applications
Published: 01 November 2007
Fig. 6.53 Internal penetration in terms of voids for various iron- and nickel-base alloys after testing in 900 °C (1650 °F) for 8 h in Ar-4H 2 -4HCl. Source: Ref 55
More
Image
in Fatigue and Fracture of Continuous-Fiber Polymer-Matrix Composites
> Fatigue and Fracture: Understanding the Basics
Published: 01 November 2012
Fig. 33 Various forms of voids and porosity. Source: Ref 7
More
Image
Published: 01 April 2013
Fig. 17 Voids resulting from lack of fill between the faying surfaces of a lap joint between two sheets of Hastelloy X brazed with BNi-1 filler metal. Unetched. 16.5 ×. Source: Ref 1
More
1
