Search Results for verification

The results of certain heat treating processes must be verified for case quality and case depth by destructively sectioning a part or parts that were subjected to the process. Test coupons or test pins are often used for diffusion processes such as carburizing, carbonitriding, nitriding, and ferritic nitrocarburizing to provide an accurate heat treating process evaluation. This appendix briefly describes the advantages and selection and design considerations of test coupons. A typical example of the use of test pins for monitoring carburizing and hardening of gears is provided.

This chapter covers the steps and tests that are important to produce quality parts in heat treating. The quality tests discussed include hardness tests, such as Brinell, Rockwell, and microhardness tests. The chapter also examines tensile testing, toughness testing, optical metallography, and nondestructive testing. The chapter concludes by discussing in-process inspections and the final inspection.

In some cases, the failure analysis team finds that all components meet their requirements, the system was properly assembled, and it was not operated or tested in an out-of-specification manner, yet it still failed. When this occurs, the only conclusion the failure analysis team can reach is that it missed something in its analysis or that the design is defective. This chapter focuses on the latter possibility by discussing the various factors that a failure analysis team should consider to identify the causes of defects in system design. These include requirements identification and verification, circuit performance, mechanical failures, materials compatibility, and environmental factors. Examples that illustrate the value of design analysis are also presented.

As semiconductor feature sizes have shrunk, the technology needed to encapsulate modern integrated circuits has expanded. Due to the various industry changes, package failure analyses are becoming much more challenging; a systematic approach is therefore critical. This article proposes a package failure analysis flow for analyzing open and short failures. The flow begins with a review of data on how the device failed and how it was processed. Next, non-destructive techniques are performed to document the condition of the as-received units. The techniques discussed are external optical inspection, X-ray inspection, scanning acoustic microscopy, infrared (IR) microscopy, and electrical verification. The article discusses various fault isolation techniques to tackle the wide array of failure signatures, namely IR lock-in thermography, magnetic current imaging, time domain reflectometry, and electro-optical terahertz pulse reflectometry. The final step is the step-by-step inspection and deprocessing stage that begins once the defect has been imaged.

This chapter reviews the current technology and examines force application systems, force measurement, strain measurement, important instrument considerations, gripping of test specimens, test diagnostics, and the use of computers for gathering and reducing data. The influence of the machine stiffness on the test results is also described, along with a general assessment of test accuracy, precision, and repeatability of modern equipment. The chapter discusses various types of testing machines and their operations. Emphasis is placed on strain-sensing equipment. The chapter briefly describes load condition factors, such as strain rate, machine rigidity, and various testing modes by load control, speed control, strain control, and strain-rate control. It provides a description of environmental chambers for testing and discusses the processes involved in the force verification of universal testing machines. Specimen geometries and standard tensile tests are also described.

This chapter discusses the characteristics, advantages, and disadvantages of nondestructive hardness testing methods for metals, including electromagnetic impulse testing, photothermal testing, scratch hardness testing, and ultrasonic contact impedance testing. It also discusses the use of ultrasound to determine the depth of hardening in a metal or alloy. The chapter reviews methods used to check and calibrate hardness testing machines and indenters and the use of hardness reference blocks for verification and calibration of test machines. It also addresses conversion of hardness values determined by one method to equivalent values for a different method.

This chapter discusses the role of inverse analysis in providing input data for finite element simulations of metal forming processes. It describes the basic procedures for determining flow stress and friction by inverse analysis and for comparing experimental measurements with corresponding computed data. It also includes an example in which flow stress and friction were measured in compressed aluminum rings and the results used to verify the accuracy of predicted values.

Analyzing the structure of composite materials is essential for understanding how the part will perform in service. Assessing fiber volume variations, void content, ply orientation variability, and foreign object inclusions helps in preventing degradation of composite performance. This chapter describes the optical microscopy and bright-field illumination techniques involved in analyzing ply terminations, prepreg plies, splices, and fiber orientation to provide the insight necessary for optimizing composite structure and performance.

Most of the counterfeit parts detected in the electronics industry are either novel or surplus parts or salvaged scrap parts. This article begins by discussing the type of parts used to create counterfeits. It discusses the three most commonly used methods used by counterfeiters to create counterfeits. These include relabeling, refurbishing, and repackaging. The article presents a systematic inspection methodology that can be applied for detecting signs of possible part modifications. The methodology consists of external visual inspection, marking permanency tests, and X-ray inspection followed by material evaluation and characterization. These processes are typically followed by evaluation of the packages to identify defects, degradations, and failure mechanisms that are caused by the processes (e.g., cleaning, solder dipping of leads, reballing) used in creating counterfeit parts.

This chapter reviews the general principles involved in codifying standards and describes the historical development of materials testing standards. It provides information on the standards related to the Brinell, Vickers, Rockwell, and Knoop methods as well as those for the instrumented indentation test and hardness conversions.

This chapter discusses quality control programs and procedures for induction heat-treating systems and includes related forms and checklists.

In forgings of both ferrous and nonferrous metals, the flaws that most often occur are caused by conditions that exist in the ingot, by subsequent hot working of the ingot or the billet, and by hot or cold working during forging. The inspection methods most commonly used to detect these flaws include visual, magnetic particle, liquid penetrant, ultrasonic, eddy current, and radiographic inspection. This chapter provides a detailed discussion on the characteristics, process steps, applications, advantages, and limitations of these methods. It also describes the flaws caused by the forging operation and the principal factors that influence the selection of a nondestructive inspection method for forgings.

This chapter provides information on comparative attributes of sand molds and metal molds for aluminum casting. The cooling rates and microstructures obtained with each mold type are discussed. In addition, the chapter explains why sand castings work successfully in certain applications.

Machine vision is a means of simulating the image recognition and analysis capabilities of the human eye/brain system with electronic and electromechanical techniques. This chapter discusses four basic steps in the machine vision process, namely image formation, image preprocessing, image analysis, and image interpretation. Details of the processes involved, equipment used, and the factors to be considered are also presented. In addition, the applications of machine vision are discussed.

This chapter is a detailed account of various factors pertinent to the development and launch of a product. It begins by describing the five phases in the product launch process, namely product design and development, process design and development, product and process validation, product launch, and continuous improvement. This is followed by sections covering product-process flow diagrams and also the process elements considered for process failure mode and effects analysis. Some of the aspects covered by the engineering specifications to meet the product performance requirements are then reviewed. Details on product validation requirements and definitions of parameters related to the launch process are also provided. The chapter discusses the purpose of manufacturing control plan, along with an illustration of a manufacturing control plan outlined for a safety-critical suspension casting. It ends with an overview of the contents of a program launch manual.

This chapter gives an overview of how steel castings may be effectively adapted to modern concurrent engineering processes. The chapter discusses computer aided design programs, solid modeling, solidification simulation programs, and rapid prototyping.

This chapter discusses the role of standards and specifications for steel castings. It defines specifications and discusses how certification, testing, examination, methods, practices, procedures, compositions, properties, facilities, statistical process control, and documentation relate to codes and standards. The chapter describes processes involved in the selection of specifications for steel castings. Further, it provides information on the cost of specifications.

This chapter presents an overview of microprocessor and application specific integrated circuit (IC) testing. It begins with a description of key industry trends that will impact how ICs will be tested in the future. Next, it provides a brief description of the most common tests applied in the IC industry, where technical issues that are causing methodology changes are emphasized. These include functional testing, structural testing, scan-based delay testing, built-in self-testing, memory testing, analog circuit testing, system-on-a-chip testing, and reliability testing. Trends discussed have driven the development of novel focus areas in test and the chapter discusses several of those areas, including test data volume containment, test power containment, and novel methods of defect-based test.