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vapor-phase soldering

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Series: ASM Technical Books
Publisher: ASM International
Published: 01 April 2004
DOI: 10.31399/asm.tb.ps.t62440243
EISBN: 978-1-62708-352-2
... of linear thermal expansion; see also CTE small change viscosity surface tension wavelength contact angle effective contact angle density strength subscripts: S solid phase V vapor phase L liquid phase ...
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2011
DOI: 10.31399/asm.tb.jub.t53290165
EISBN: 978-1-62708-306-5
... metal to wet the mating surfaces of a joint, with or without the aid of a fluxing agent, leading to the formation of a metallurgical bond between the filler and the respective components. Solders usually react to form intermetallic phases, that is, compounds of the constituent elements that have...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 April 2004
DOI: 10.31399/asm.tb.ps.t62440145
EISBN: 978-1-62708-352-2
... Solders 4.1.3 Erosion of Parent Materials 4.2 Mechanical Constraints and Solutions 4.1.4 Phase Formation Visual Inspection Appendix A4.3: Dryness and Hermeticity of Sealed Enclosures X-Ray or Scanning Acoustic Microscope (SAM) Inspection Physical Vapor Deposition Appendix A4.1...
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 April 2004
DOI: 10.31399/asm.tb.ps.t62440001
EISBN: 978-1-62708-352-2
.... , 1967 . Diffusion Bonding, Part l , Weld. Met. Fabr. , Vol 35 (No. 12 ), p 483 – 489 • Tylecote R.F. , 1968 . The Solid Phase Welding of Metals , Edward Arnold • Vianco P.T. and Rejent J.A. , 1997 . Capillary Flow Solder Wettability Test , Solder. Surf. Mt...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 April 2004
DOI: 10.31399/asm.tb.ps.9781627083522
EISBN: 978-1-62708-352-2
Series: ASM Technical Books
Publisher: ASM International
Published: 01 April 2004
DOI: 10.31399/asm.tb.ps.t62440103
EISBN: 978-1-62708-352-2
... applied by either electroplating or a vapor-phase technique, through a mask, so that only the required areas of the substrate are coated. The solder thicknesses available range from 2 to 50 μm (0.08 to 2 mil), and almost every common composition is available. These solder coated...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 August 2005
DOI: 10.31399/asm.tb.pb.t51230189
EISBN: 978-1-62708-351-5
... of novel 22 carat gold solders. References References • Alloy Phase Diagrams , 1992 . Vol 3 , ASM Handbook , ASM International , p 3.5 • Corti C.W. , 2001 . Strong 24 Carat Golds: the Metallurgy of Microalloying , Gold Technology ( No. 33 ), p 27 – 36 • Corti C.W...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 April 2004
DOI: 10.31399/asm.tb.ps.t62440049
EISBN: 978-1-62708-352-2
... The phases are generally hard with low fracture toughness. However, their thermal expansivities lie between the substrate and solder, which probably plays a role in decreasing the stress concentration in joints. Property Cu 6 Sn 5 Cu 3 Sn Ni 3 Sn 4 Hardness, HV 378 343 365...
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 August 2005
DOI: 10.31399/asm.tb.pb.t51230001
EISBN: 978-1-62708-351-5
... Principal methods for joining engineering materials Fig. 1.2 A phased array radar antenna prepared for brazing. The (a) front face and (b) interior show strips of brazing foil held in place by twist-tag mechanical fasteners. Courtesy of BAE Systems Ltd. Abstract Brazing and soldering...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 August 2005
DOI: 10.31399/asm.tb.pb.9781627083515
EISBN: 978-1-62708-351-5
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 June 2008
DOI: 10.31399/asm.tb.emea.t52240075
EISBN: 978-1-62708-251-8
... or impurity exceeds its solubility limit in the base solvent metal. For example, cementite (Fe 3 C) is a second-phase constituent in carbon steel. 6.1 Phase Rule A pure metal can exist in either the solid, liquid, or vapor phases, depending on the conditions of temperature and pressure, as shown...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 April 2004
DOI: 10.31399/asm.tb.ps.t62440189
EISBN: 978-1-62708-352-2
... Cadmium 320.8 Toxic vapor Lead 327.5 Toxic Availability of potential alloying elements in lead-free solder Table 5.2 Availability of potential alloying elements in lead-free solder Metal World production in 2000 (a) , tonnes Silver 17,700 Bismuth 5,880 Copper...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2007
DOI: 10.31399/asm.tb.smnm.t52140055
EISBN: 978-1-62708-264-8
... boundary is a solid-solid surface compared to the solid-vapor surface on the copper pipe. Just as there is a surface tension force where the liquid solder contacts the copper-vapor surface, there is a surface tension force where the molten FeS contacts the grain-boundary surfaces between austenite grains...
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2003
DOI: 10.31399/asm.tb.cfap.t69780383
EISBN: 978-1-62708-281-5
.... Thus, for a flat, polished sample containing numerous phases, where little or no contrast may be seen using secondary electrons, an image of high contrast may still be produced using the BSE signal. Unlike the secondary electrons that can be attracted to a detector, the high-energy BSE signal can...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 August 2005
DOI: 10.31399/asm.tb.pb.t51230143
EISBN: 978-1-62708-351-5
... metal is tin, which is conventionally classed as a solder because it melts at 232 °C (450 °F), the elevated process temperatures that are necessary for the removal of voids and brittle interfacial phases to be effective, and also the high joint remelt temperature, qualify this as a brazing process...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 August 2005
DOI: 10.31399/asm.tb.pb.t51230105
EISBN: 978-1-62708-351-5
... ). For high value-added applications it can be worthwhile to apply brazing alloys by electroplating (if technically feasible) or by vapor-phase techniques, usually in conjunction with a mask, so that only the required areas of the components are coated. Silver-copper eutectic is among the brazes that can...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2001
DOI: 10.31399/asm.tb.aub.t61170351
EISBN: 978-1-62708-297-6
... system by which they are defined, and the applications for which they are suited. It then explains how primary alloying elements, second-phase constituents, and impurities affect yield strength, phase formation, and grain size and how they induce structural changes that help refine certain alloys...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 June 2008
DOI: 10.31399/asm.tb.emea.t52240597
EISBN: 978-1-62708-251-8
... solder alloys include a wide variety of material combinations, from 100% Pb to 100% Sn. The reader may want to refer to Section 6.3.2 in Chapter 6, “Phase Diagrams,” for a discussion of solders in relation to the lead-tin eutectic phase diagram. Silver can be added to lead-tin solders, yielding solders...
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2001
DOI: 10.31399/asm.tb.aub.t61170003
EISBN: 978-1-62708-297-6
... to oxidation and vaporization. However, examination of the aluminum-silicon binary phase diagram shows that a low-melting eutectic (577 °C, or 1071 °F) is formed at 12.6 wt% Si. Therefore, successful alloying of aluminum-silicon alloys is achieved by using master alloys or prealloyed ingots containing silicon...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 August 2005
DOI: 10.31399/asm.tb.pb.t51230047
EISBN: 978-1-62708-351-5
... Melting range Phases present Tensile strength of brazed joints between mild steel tubes (0.5 mm, or 20 mils gap) Alloy hardness, HV °C °F MPa ksi 70Cu-10Mn-20Zn 799–925 1470–1697 (Cu,Mn) + CuZn 270 39.1 160 54Cu-4Mn-35Zn-6Ni-1Si 850–930 (approximate) 1562–1706 (approximate) (Cu...