This chapter discusses the characteristics, advantages, and disadvantages of nondestructive hardness testing methods for metals, including electromagnetic impulse testing, photothermal testing, scratch hardness testing, and ultrasonic contact impedance testing. It also discusses the use of ultrasound to determine the depth of hardening in a metal or alloy. The chapter reviews methods used to check and calibrate hardness testing machines and indenters and the use of hardness reference blocks for verification and calibration of test machines. It also addresses conversion of hardness values determined by one method to equivalent values for a different method.

Welded joints in any component or structure require a thorough inspection. The role of nondestructive evaluation (NDE) in the inspection of welds is very important, and the technology has become highly developed as a result. This article describes the applications, methods, evaluation procedures, performance, and limitations of NDE. It provides information on the training and certification of NDE operators, evaluation of test results, and guidance to method selection. Typical examples of various NDE methods for welds are also described.

Ultrasonic inspection is a nondestructive method in which beams of high frequency acoustic energy are introduced into a material to detect surface and subsurface flaws, to measure the thickness of the material, and to measure the distance to a flaw. This chapter begins with an overview of ultrasonic flaw detectors, ultrasonic transducers, and search units and couplants. It then discusses the principles of operation, presentation, and interpretation of data of pulse echo and transmission methods. This is followed by sections providing information on general characteristics of ultrasonic waves and the factors influencing ultrasonic inspection. The advantages, disadvantages, and applications of ultrasonic inspection are finally compared with other methods of nondestructive inspection of metal parts.

Fabricated powder metallurgy (P/M) parts are evaluated and tested at several stages during manufacturing for part acceptance and process control. The various types of tests included are dimensional evaluation, density measurements, hardness testing, mechanical testing, and nondestructive testing. This chapter is a detailed account of these testing methods. It describes the four most common types of defects in P/M parts, namely ejection cracks, density variations, microlaminations, and poor sintering. The chapter discusses the capabilities and limitations of various nondestructive evaluation methods to flaw detection in P/M parts. The nondestructive evaluation methods covered are mechanical proof testing, metallography, liquid penetrant crack detection, filtered particle crack detection, magnetic particle crack inspection, direct current resistivity testing, x-ray radiography, computed tomography, gamma-ray density determination, and ultrasonic techniques.

This chapter discusses the basic steps of a failure investigation. It explains that the first step is to gather and document information about the failed component and its operating history. It advises investigators to visit the failure site as soon as possible to record damages and collect test specimens for subsequent examination and chemical analysis. It also discusses the role of mechanical property testing, the use of nondestructive evaluation, and the final step of generating a report.

This chapter discusses the use of nondestructive inspection methods, including visual, ultrasonic, radiographic, and thermographic techniques, and the types of flaws and damages they can reveal in composite parts and assemblies. It describes the basic principles behind each method along with best practices and procedures.

In embedded systems, the separation between system level, board level, and individual component level failure analysis is slowly disappearing. In order to localize the initial defect area, prepare the sample for root cause analysis, and image the exact root cause, the overall functionality has to be maintained during the process. This leads to the requirement of adding additional techniques that help isolate and image defects that are buried deeply within the board structure. This article demonstrates an approach of advanced board level failure analysis by using several non-destructive localization techniques. The techniques considered for advanced fault isolation are magnetic current imaging for shorts and opens; infrared thermography for electrical shorts; time-domain-reflectometry for shorts and opens; scanning acoustic microscopy; and 2D/3D X-Ray microscopy. The individual methods and their operational principles are introduced along with case studies that will show the value of using them on board level defect analysis.

This chapter describes how ultrasonic testing came to be a viable method for evaluating intergranular stress-corrosion cracking (SCC) in large-diameter stainless steel pipe welds in boiling water reactor service. Intergranular SCC can be difficult to detect using nondestructive evaluation (NDE) techniques because of its treelike branching pattern and its location in the heat-affected zone within the weld. As the chapter explains, by optimizing excitation and reflected waveforms, switching to dual-element sensing, properly orienting the scanning path, and using crack-tip diffraction and amplitude-drop techniques, the height, length, and location of intergranular cracks can be accurately determined anywhere along the walls of the pipe as well as in weld areas.

This chapter concentrates almost exclusively on inspection techniques related to pressure vessels and pipework. The discussion covers the general aspects associated with inspection and the key factors relevant to it. In addition, the chapter addresses processes involved in data collection and management, namely data acquisition, reporting, trending, reviewing, and auditing. Capabilities and limitations of in-service inspection techniques are discussed in the Appendix to this chapter.

Achieving the best-performing composite part requires that the processing method and cure cycle create high-quality, low-void-content structures. If voids are present, the performance of the composite will be significantly reduced. There are multiple causes of voids in composite materials; they are generally categorized as voids that are due to volatiles (such as solvents, water) or voids that result from entrapped air. This chapter describes the analysis of various types of voids. It reviews techniques for analysis of voids at ply-drops, voids due to high fiber packing, and voids that occur in honeycomb core composites. The final section of the chapter discusses void documentation through the use of nondestructive inspection techniques and density/specific gravity measurement methods.

This chapter presents several materials and processes related to soldering technology. It first provides information on lead-free solders, followed by sections devoted to flip-chip processes, diffusion soldering, and modeling. Scanning acoustic microscopy and fine-focus x-ray techniques are also discussed. The chapter describes several evaluation procedures and tests developed to measure solderability and standards for process calibration. The chapter also describes the characteristics of reinforced solders, amalgams used as solders, and other strategies to boost the strength of solders. Further, the chapter considers methods for quantifying the mechanical integrity of joints and predicting their dimensional stability under specified environmental conditions. It discusses the effects of rare earth elements on the properties of solders. The chapter concludes with information on advanced joint characterization techniques.

As fiber-reinforced polymeric composites continue to be used in more damage-prone environments, it is necessary to understand the response of these materials when subjected to impact from foreign objects. This chapter provides an overview of the analysis methods for impact-damaged composites. It discusses the causes and effects of various failure mechanisms in composite materials. The failure mechanisms covered are brittle-matrix composite failure, tough-matrix composite failure, thermoplastic-matrix composite failure mechanisms, untoughened thermoset-matrix composite failure mechanisms, toughened thermoset-matrix composite failure mechanisms, particle interlayer-toughened composite failure mechanisms, and dispersed-phase, rubber-toughened thermoset-matrix composite failure mechanisms.

This chapter describes the procedures, characteristics, and applications for static hardness test methods. It addresses test methods that are state of the art, commonly used, or that may find increased use due to certain advantages. The methods addressed are Rockwell hardness testing (ISO 6508 and ASTM E 18), Vickers hardness testing (ISO 6507, ASTM E92, and ASTM E384), Brinell hardness testing (ISO 6506 and ASTM E10), and Knoop hardness testing (ISO 4545 and ASTM E284). The chapter also discusses the advantages and disadvantages of these test methods.

This chapter discusses the various failure analysis techniques for microelectromechanical systems (MEMS), focusing on conventional semiconductor manufacturing processes and materials. The discussion begins with a section describing the advances in integration and packaging technologies that have helped drive the further proliferation of MEMS devices in the marketplace. It then shows some examples of the top MEMS applications and quickly discusses the fundamentals of their workings. The next section describes common failure mechanisms along with techniques and challenges in identifying them. The chapter also provides information on the testing of MEMS devices. It covers the two common challenges in sample preparation for MEMS: decapping, or opening up the package, without disturbing the MEMS elements; and removing MEMS elements for analysis. Finally, the chapter discusses the aspects of failure analysis techniques that are of particular interest to MEMS.

This chapter discusses the extrusion characteristics of hard aluminum alloys, particularly those in the 5000 and 7000 series. It begins with a review of two studies, one showing how the extrudability of 7 xxx alloys varies with the presence and amount of different alloying elements, the other relating minimum wall thickness with circumscribing circle diameter. It then explains how oxides on either the billet or container complicate the control of extrusion as well as auxiliary processes and how material flow and the movement of trapped gasses in different regions of the extrusion can lead to defects and variations in strength. It also discusses the extrusion of aluminum matrix composites and explains how composite billets are made.

The scanning acoustic microscope (SAM) is an important tool for development of improved molded and flip chip packages. The SAM used for integrated circuit inspection is a hybrid instrument with characteristics of both the Stanford SAM and the C-scan recorder. This chapter presents the historical development of SAM for integrated circuit package inspection, SAM theory, and analysis considerations. Case studies are presented to illustrate the practical applications of SAM. Other non-destructive imaging tools are briefly discussed, as well as SAM challenges and methods including spectral signature analysis and GHz-SAM.

This appendix is a glossary of terms and definitions associated with sheet metal forming.

This chapter assesses the state of 3D printing among automakers, medical device manufacturers, and construction companies.

Drawing is a bulk deformation process that involves significant surface generation and high pressures. This chapter provides an overview of the mechanics and tribology of wire, bar, tube, and shape drawing. It presents important equations for calculating stresses, forces, friction, heat, strain, and distortion for different tooling configurations and geometries. It explains how to select and apply lubricants based on drawing speed, die design, and other factors and how to maintain sufficient film thickness for hydrodynamic, mixed, and solid-film lubrication conditions. It also discusses the use of vibrating dies, the influence of surface finish and defects, and lubrication practices for specific materials.