1-20 of 64 Search Results for

ultrasonic contact impedance

Follow your search
Access your saved searches in your account

Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Image
Published: 01 October 2011
Fig. 5 Composition of an ultrasonic contact impedance (UCI) probe More
Image
Published: 01 October 2011
Fig. 6 Frequency shift of an ultrasonic contact impedance (UCI) probe as a function of hardness More
Series: ASM Technical Books
Publisher: ASM International
Published: 01 October 2011
DOI: 10.31399/asm.tb.htpa.t53310091
EISBN: 978-1-62708-346-1
... Abstract This chapter discusses the characteristics, advantages, and disadvantages of nondestructive hardness testing methods for metals, including electromagnetic impulse testing, photothermal testing, scratch hardness testing, and ultrasonic contact impedance testing. It also discusses...
Image
Published: 01 October 2011
Fig. 7 Determination of the hardness curve on the heat-affected zone of a welded joint with an ultrasonic contact impedance (UCI) hardness tester. Courtesy of GE Inspection Technologies More
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 April 2013
DOI: 10.31399/asm.tb.imub.t53720267
EISBN: 978-1-62708-305-8
...) the acoustic impedance of such a reflector. Energy reflected from various interfaces and flaws can be used to define the presence and locations of flaws; the thickness of the material; and, the depth of a flaw beneath a surface. Most ultrasonic inspections are performed using a frequency between 1 and 25...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 April 2013
DOI: 10.31399/asm.tb.imub.t53720183
EISBN: 978-1-62708-305-8
... of water, to contract into a sphere. In such a droplet, surface tension is counterbalanced by the internal hydrostatic pressure of the liquid. When the liquid comes into contact with a solid surface, the cohesive force responsible for surface tension competes with the adhesive force between the molecules...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2011
DOI: 10.31399/asm.tb.jub.t53290137
EISBN: 978-1-62708-306-5
... welding, forge welding, roll welding, coextrusion welding, cold welding, friction welding, friction stir welding, explosion welding, and ultrasonic welding. coextrusion welding cold welding diffusion welding explosion welding forge welding friction welding roll welding ultrasonic welding...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 July 1997
DOI: 10.31399/asm.tb.wip.t65930085
EISBN: 978-1-62708-359-1
...) and the impedance vector from cracks can be achieved. Further reductions in noise can be made using signal filters, but the probe then has to be scanned at a constant speed. The test frequency also affects the signal-to-noise separation in ultrasonic testing. As the frequency increases, the ultrasound...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 June 1988
DOI: 10.31399/asm.tb.eihdca.t65220143
EISBN: 978-1-62708-341-6
... development and may find some use in the future. These methods include those based on ultrasonics, eddy-current detection, and real-time measurement of coil current or impedance during induction heating. Each of these is briefly discussed below. Ultrasonic Methods<xref ref-type="fn" rid="t65220143-fn6">[6...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 April 2013
DOI: 10.31399/asm.tb.imub.t53720001
EISBN: 978-1-62708-305-8
... Comparison of some nondestructive testing methods Application Characteristics detected Advantages Limitations Example of use Ultrasonics Changes in acoustic impedance caused by cracks, non-bonds, inclusions, or interfaces Can penetrate thick materials; excellent for crack detection; can...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2006
DOI: 10.31399/asm.tb.cw.t51820203
EISBN: 978-1-62708-339-3
... corrosion. Nondestructive testing techniques, such as ultrasonic thickness measurements, work from outside the vessel or piping. Properly conducted corrosion tests can mean the savings of millions of dollars. They are a means of avoiding the use of a metal under unsuitable conditions or of using a more...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 October 2011
DOI: 10.31399/asm.tb.mnm2.t53060149
EISBN: 978-1-62708-261-7
... Abstract This chapter explains how metallography and hardness testing are used to evaluate the quality and condition of metal products. It also discusses the use of tensile testing, fracture toughness and impact testing, fatigue testing, and nondestructive test methods including ultrasonic, x...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2010
DOI: 10.31399/asm.tb.scm.t52870183
EISBN: 978-1-62708-314-0
... electrical energy into mechanical energy. The sonotrode is placed in contact with one of the pieces to be joined. The second piece is held stationary while the vibrating piece creates frictional heating at the interface. Ultrasonic frequencies of 20 to 40 kHz are normally used. The process works best if one...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 August 2015
DOI: 10.31399/asm.tb.piht2.t55050245
EISBN: 978-1-62708-311-9
... only Defects only Source: Ref 4 Characteristics of some nondestructive testing methods Table 12.5 Characteristics of some nondestructive testing methods Method Characteristics detected Advantages Limitations Example of use Ultrasonics Changes in acoustic impedance caused...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110563
EISBN: 978-1-62708-247-1
... but is not necessarily needed because van der Waals forces do the work once surface contact is initiated. Annealing at a high temperature (&gt;1000C) makes the bond full strength. From an FA standpoint, this is the most difficult seal to break open or analyze. The question of how much to integrate MEMS with CMOS...
Series: ASM Technical Books
Publisher: ASM International
Published: 30 April 2021
DOI: 10.31399/asm.tb.tpsfwea.t59300079
EISBN: 978-1-62708-323-2
.... These bubble collapse jets can produce contact stresses that can be near or above the yield strength of the surface ( Fig. 4.9 ). Fig. 4.9 Collapse of bubbles to create a cavitation jet The energetic action of bubble collapse is used to advantage in ultrasonic cleaning devices. A piezoelectric...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 April 2004
DOI: 10.31399/asm.tb.ps.t62440103
EISBN: 978-1-62708-352-2
... occur, the contact angle between the molten solder and the parent material is often high, and thus the solder does not spread over the component surfaces. This situation cannot be remedied with the help of chemical fluxes because these are unable to change the physical properties of the intrinsic...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2015
DOI: 10.31399/asm.tb.cpi2.t55030360
EISBN: 978-1-62708-282-2
... ). Inspection Techniques A wide variety of techniques ranging from simple visual inspections through well-established methods such as radiography and ultrasonic testing to new and highly specialized methods are available for use. Some are identified subsequently. Not all the techniques are suitable for all...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 January 2000
DOI: 10.31399/asm.tb.cub.t66910427
EISBN: 978-1-62708-250-1
... for evaluating various nonmetallic materials of construction that are used in contact with metals, such as thermal insulation products and leather. Examples of humidity tests include the following: ASTM C 665, “Specification for Mineral Fiber Blanket Thermal Insulation for Light Frame Construction...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110550
EISBN: 978-1-62708-247-1
... Time-Domain Reflectometry is a useful tool for finding electrical anomalies in FCBGA (Flip-chip Ball Grid Array) samples. The technique is able to isolate an open, short or resistance shift to at least the laminate, bumps or chip by contacting a BGA (Ball Grid Array) Input/Output (I/O) bump...