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ultra-high resolution

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Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110413
EISBN: 978-1-62708-247-1
..., sample tilt and image composition, focus and astigmatism correction, dynamic focus and image correction, raster alignment, and adjusting brightness and contrast. The article also provides information on achieving ultra-high resolution in the SEM. It concludes with information on the general...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2023
DOI: 10.31399/asm.tb.edfatr.t56090155
EISBN: 978-1-62708-462-8
... as strain using 4D STEM or integrated differential phase contrast (iDPC) Ultra-high-resolution electron energy-loss spectroscopy (EELS) Chip Packaging In packaging, higher integration of chips/die per package and more layers of interconnect are expected to continue to grow. The introduction...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2023
DOI: 10.31399/asm.tb.edfatr.t56090003
EISBN: 978-1-62708-462-8
... is localized accurately while keeping the original symptoms and the morphology of the defect intact. This ultimately helps study the defect during PFA with quick turn-around time and high success rates. The success rates of EFI greatly depend on signal strengths, spatial or timing resolution of the signals...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2023
DOI: 10.31399/asm.tb.edfatr.t56090021
EISBN: 978-1-62708-462-8
... challenge in x-ray imaging lies in the way ultra-high-resolution imaging is performed on large form factors containing 3D IC packages, such as modules, PCBs (including actual phones), and full-sized wafers. Typically, customer returns would come in the form of a customer-specific PCB or even a full device...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2023
DOI: 10.31399/asm.tb.edfatr.9781627084628
EISBN: 978-1-62708-462-8
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2023
DOI: 10.31399/asm.tb.edfatr.t56090109
EISBN: 978-1-62708-462-8
... by chemical etching, or chemical etching only. Precision Die Ultra-Thinning—Fault Isolation Sample Preparation To serve the need for higher resolution optical fault isolation, silicon die backside ultra-thinning will require a uniform thickness profile of <5 μm or below over the entire area...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110153
EISBN: 978-1-62708-247-1
... SIL will wane as more analyses push for ultra-thin silicon (< 10 µm RST). SIL for Ultra-Thin Silicon Oil or water immersion lenses improve the NA from a theoretical 1.0 (best case in air) up to around 1.5. The improvement in resolution coupled with the shorter visible wavelengths of light...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110196
EISBN: 978-1-62708-247-1
... approaches to FA is spatial resolution. Using 1µm laser wavelengths to examine 45nm node technologies and below produces serious limits to defect localization. Two approaches have been successfully demonstrated to improve backside spatial resolution, solid immersion lenses and substrate ultra-thinning...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110244
EISBN: 978-1-62708-247-1
... application extensions (some of which will be discussed later in this article), system configurations are also regularly upgraded to enable improved capabilities and ease-of-use. Examples of which include enhanced detector arrangements (e.g. integrated high- and low-frequency modules), resolution improvements...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110461
EISBN: 978-1-62708-247-1
...-contrast image clearly shows dark contrast at the interface, indicative of light elemental composition. High-Resolution STEM Phase contrast imaging is commonly used for metrology of ultra-thin device features such as the gate oxide. In STEM mode, the electron lenses above the sample can...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110180
EISBN: 978-1-62708-247-1
... end up in stacked active layers. For those technologies, the optical approach for CFI techniques will be challenged. The high data rates for IoT can only be realized with ultra low power technologies of 0.5V supply voltage and below. Channel mobility management will play an important role in devices...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2023
DOI: 10.31399/asm.tb.edfatr.t56090091
EISBN: 978-1-62708-462-8
... operation, high bandwidth (~10 GHz), voltage accuracy (~mV), and inverted columns designed for ATE docking, but only moderate spatial resolution (~0.35 μm). In contrast, the new systems are based on modern SEM platforms ( Fig. 9 ), offering high resolution (~20–30 nm) and low-voltage operation (~500 eV...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110485
EISBN: 978-1-62708-247-1
... (assuming uniform sample hardness). This method is capable of high lateral resolution with minimal impact of the adsorbed fluid layer on the surface of a sample in an ambient environment. Probe lifetime, however, is adversely affected due to the force on the sample and tip wear. In intermittent contact...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2023
DOI: 10.31399/asm.tb.edfatr.t56090131
EISBN: 978-1-62708-462-8
... speed image processing software. However, in stacked packages, there are limitations for CSAM applications because highly penetrating low frequency acoustic waves are unable to provide high resolution imaging of high-density submicron interconnects. In addition, the convolution of signals from...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110335
EISBN: 978-1-62708-247-1
... demonstrated [5] and these systems are typically used for high resolution surface imaging. The helium ion beam also has capabilities beyond imaging including beam induced material deposition and milling in very fine structures. These capabilities have been leveraged for a variety of device prototyping...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 January 2015
DOI: 10.31399/asm.tb.spsp2.t54410001
EISBN: 978-1-62708-265-5
...). Steelmaking is the important first step in processing and has evolved over centuries to produce today huge tonnages of high-quality steel. Thus steelmaking, its history, and its effect on the structure of solid steel are discussed briefly in subsequent chapters. Microstructure of Steels Size Scales...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2010
DOI: 10.31399/asm.tb.omfrc.t53030115
EISBN: 978-1-62708-349-2
... induces stress and strain as artifacts) to obtain the high resolution or detail that can be achieved with a polished ultrathin section. The following sections describe the various aspects relating to the selection and preparation of ultrathin-section specimens of fiber-reinforced polymeric composites...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110067
EISBN: 978-1-62708-247-1
... with frequencies in the range of 100 MHz to 8 GHz are used. The upper frequency limit and spatial resolution limit are mainly determined by frequency-dependent attenuation in the couplant. Cryogenic fluids and high-pressure gases have been used as the couplant for frequencies above 2 GHz. Precision mechanical...
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 1984
DOI: 10.31399/asm.tb.mpp.t67850267
EISBN: 978-1-62708-260-0
... Abstract This chapter discusses the tools and techniques of light microscopy and how they are used in the study of materials. It reviews the basic physics of light, the inner workings of light microscopes, and the relationship between resolution and depth of field. It explains the difference...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110323
EISBN: 978-1-62708-247-1
... at the high or low voltage states, thus allowing identification of the individual device’s logic states. By comparing the observed device or node state with the expected state one can identify a failing device or node. With fin level resolution it is possible to even locate the particular fin responsible...