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tungsten
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Published: 01 July 2009
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Published: 01 June 2008
Fig. 22.19 A coarse-grained cemented tungsten carbide (94WC-6Co). Tungsten carbide is gray; matrix is white. Original magnification: 1500 ×. Source: Ref 6
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Published: 01 December 2001
Fig. 11 Corrosion rate versus tungsten content for tantalum-tungsten alloys exposed to concentrated H 2 SO 4 at 180 °C (360 °F) and 210 °C (405 °F)
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Published: 01 December 2001
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in Deformation and Fracture Mechanisms and Static Strength of Metals
> Mechanics and Mechanisms of Fracture: An Introduction
Published: 01 August 2005
Fig. 2.68 Effect of temperature on the yield strength of bcc tantalum, tungsten, molybdenum, and iron and fcc nickel. Source: J.H. Bechtold (graphs adopted from Ref 2.2 )
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in Deformation and Fracture Mechanisms and Static Strength of Metals
> Mechanics and Mechanisms of Fracture: An Introduction
Published: 01 August 2005
Fig. 2.69 Effect of temperature on the reduction of area of tantalum, tungsten, molybdenum, iron, and nickel. Source: J.H. Bechtold (graphs adopted from Ref 2.2 )
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Published: 01 August 1999
Fig. 11.25 (Part 1) Tungsten inert-gas butt weld made in 12 mm 0.2% C plate in five passes. Parent metal: 0.20C-0.28Si-1.85Mn (wt%). CE = 0.51. Weld metal: 0.12C-0.10Si-1.66Mn-0.11S (wt%). (a) Weld region. 3% nital. 1×. (b) Weld metal, outer region of outer pass. 200 HV. 1% nital. 100
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Published: 01 August 1999
Fig. 11.26 (Part 1) Tungsten inert-gas weld. (a) to (f) Butt weld made in five passes in 12 mm 0.1 5 % C plate in five passes. Weld metal: 0.08C-0.005Si-0.31 Mn (wt%). (a) Weld region. 3% nital. 1×. (b) Weld metal, as-deposited pass. 1% nital. 100×. (c) and (d) Weld metal
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in Role of Advanced Circuit Edit for First Silicon Debug
> Microelectronics Failure Analysis: Desk Reference
Published: 01 November 2019
Figure 36 TEM and EDS Maps of FIB Platinum (a &b) and Tungsten(c) material showing the granular structure of depositions with different resistivity values. [70]
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Published: 01 November 2019
Figure 10(a) Secondary electron image of an aluminum line with a tungsten cap layer damaged by electromigration.
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Published: 01 November 2019
Figure 20(a) SEM image at 20 kV beam voltage of tungsten plugs underneath an aluminum line.
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Published: 01 November 2019
Figure 33 STEM-in-SEM image of an aluminum line connected to a tungsten plug contact. The barrier layer and the plug liner are visible.
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Published: 01 November 2019
Figure 35 STEM-in-SEM image of a tungsten plug contacting silicon.
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in Failure Analysis Techniques and Methods for Microelectromechanical Systems (MEMS)[1]
> Microelectronics Failure Analysis: Desk Reference
Published: 01 November 2019
Figure 37 TEM cross section of a released, tungsten-coated micromachine. Grains of the poly silicon are clearly visible.
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in Failure Analysis Techniques and Methods for Microelectromechanical Systems (MEMS)[1]
> Microelectronics Failure Analysis: Desk Reference
Published: 01 November 2019
Figure 38 TEM cross section of a tungsten wear-resistant film deposited on a polysilicon micromachine.
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in 3D Hot-Spot Localization by Lock-in Thermography
> Microelectronics Failure Analysis: Desk Reference
Published: 01 November 2019
Figure 15 Top-view LIT image of shorted TSV columns probed by tungsten needle. Amplitude image superimposed on topography image (left) and phase image (right).
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Published: 01 December 1984
Figure 3-27 Tungsten (cold-worked (left) and annealed, (right) 1800°C, 1 h) etched with Murakami’s reagent, 150×. (Courtesy of R. D. Buchheit, Battelle Memorial Institute.)
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Published: 01 December 1984
Figure 3-29 Alloy of cobalt and 15% tungsten etched in nitric acid, hydrogen peroxide, and lactic acid (10:10:80), 250×. (Courtesy of R. D. Buchheit, Battelle Memorial Institute.)
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Published: 01 September 2008
Fig. 27 Effect of vanadium molybdenum, tungsten, and chromium additions on secondary (high-temperature) hardness of medium-carbon steels. Source: Ref 23
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Published: 30 April 2020
Fig. 2.14 Agglomerated tungsten with weak sinter bonds formed between the particles as part of the oxide reduction treatment
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