Search Results for troubleshooting

This chapters reviews the various process, material, and post-treatment problems that can occur in nitriding and how to troubleshoot them. The troubleshooting methods discussed relate to gas nitriding, salt bath nitriding, and ion nitriding.

This chapter presents an overview of some of the major causes of tool and die failures. The chapter describes fracture and fracture toughness of tool steels, and the influence of factors such as steel quality and primary processing, mechanical design, heat treatment, grinding and finishing, and distortion and dimensional change.

At the conclusion of a systems failure analysis, the people involved should have a much more in-depth understanding of how the system is supposed to work. The analysis should help understand shortfalls in the design, production, testing, and use of the system. The failure analysis team will have identified other potential failure causes and actions required to preclude future failures. This is valuable knowledge, and it should not be set aside or ignored when the failure analysis team concludes its activities. This chapter is a brief account of the creation of failure analysis libraries, of process guidelines based on previous failure analyses, and of troubleshooting and repair guidelines. Also provided is a listing of the various steps that should be included in a failure analysis procedure.

The metallurgy of aluminum and its alloys offers a range of opportunities for employing heat treatments to obtain desirable combinations of mechanical and physical properties such that castings meet defined temper requirements. This chapter discusses the processes involved in solution heat treatment, quenching, precipitation hardening, and annealing of aluminum alloys. The effects of these processes on dimensional stability and residual stresses are also discussed. Troubleshooting and diagnosis of heat treating problems are covered in the concluding section of the chapter.

This chapter provides guidelines on how to set up and run an effective quality-improvement program for aluminum extrusion operations. It begins by identifying production processes and variables that impact the quality of hard and soft alloy extrusions. It then presents a series of checklists and flowcharts that can be used to monitor and troubleshoot billet-making and extrusion processes, die construction, equipment maintenance, heat treating, and sawing and stretching procedures. It also discusses the importance of charting test results and monitoring surface treatments that may be required to improve corrosion, oxidation, or wear resistance.

This chapter discusses the maintenance needs of major components in induction heat-treating systems, including power supplies, heat stations, capacitors, high-frequency output stages, induction coils, water systems, quench systems, and fixturing.

This chapter discusses quality control programs and procedures for induction heat-treating systems and includes related forms and checklists.

This article summarizes the results of work completed by the ASM Thermal Spray Society Advisory Committee to identify key research challenges and opportunities in the thermal spray field. It describes and prioritizes research priorities related to emerging process methods, thermal spray markets and applications, and process robustness, reliability, and economics.

Transistors are the most important active structure of any semiconductor component. Performance characteristics of such devices within the specifications are key to ensuring proper functionality and long-term reliability of the product. In this article, a summary of the semiconductor technology from design to manufacturing and the characterization methods are discussed. The focus is on two prominent MOS structures: planar MOS device and FinFET device. The article covers the device parameters and device properties that determine the design criteria and the device tuning procedures. The discussion includes the effects of drain induced barrier lowering, velocity saturation, hot carrier degradation, and short channel on these devices.

This chapter focuses on what can cause a system to fail and addresses the challenge in approaching a system failure. It then examines the steps involved in the four-step problem-solving process: defining the problem, identifying all potential failure causes and evaluating the likelihood of each, identifying the potential solutions, and identifying the best solution. The chapter concludes by describing the responsibilities of a failure analysis team.

This chapter assesses the potential impact of neural networks on package-level failure analysis, the challenges presented by next-generation semiconductor packages, and the measures that can be taken to maximize FA equipment uptime and throughput. It presents examples showing how neural networks have been trained to detect and classify PCB defects, improve signal-to-noise ratios in SEM images, recognize wafer failure patterns, and predict failure modes. It explains how new packaging strategies, particularly stacking and disintegration, complicate fault isolation and evaluates the ability of various imaging methods to locate defects in die stacks. It also presents best practices for sample preparation, inspection, and navigation and offers suggestions for improving the reliability and service life of tools.

Examining and evaluating the nitrided case is generally accomplished by hardness testing and microscopic examination. This chapter discusses both characterization methods, as well as sample preparation. The chapter also discusses the processes involved in the etching of the sample after microhardness testing and provides practices that contribute to the safe preparation of specimens. Examples of nitrided case microstructures, using optical light microscopy, are also presented.

Cross-sectioning is a technique used for process development and reverse engineering. This article introduces novice analysts to the methods of cross-sectioning semiconductor devices and provides a refresher for the more experienced analysts. Topics covered include encapsulated (potted) device sectioning techniques, non-encapsulated device techniques, utilization of the focused ion beam (FIB) making a cross-section and/or enhancing a physically polished one. Delineation methods for revealing structures are also discussed. These can be chemical etchants, chemo-mechanical polishing, and ion milling, either in the FIB or in a dedicated ion mill.

Ion nitriding equipment can be categorized into two groups: cold-wall continuous direct current (dc) equipment and hot-wall pulsed dc equipment. This chapter focuses on these two categories along with other important considerations for ion (plasma) nitriding equipment and processing. Other important considerations discussed include the hollow cathode effect, sputter cleaning, furnace loading, pressure/voltage relationships, workpiece masking, and furnace configuration options. The chapter describes five methods of cooling parts from the process temperature to an acceptable exposure temperature after plasma nitriding. The chapter also presents some of the advantages of the pulsed plasma process.

This article presents best practices for the metallographic preparation of specimens produced via thermal spray coating methods. It outlines typical metallographic preparation process flow, highlighting important considerations for obtaining a clear and representative specimen suitable for characterization via examination techniques, such as optical or electron microscopy. The process flow includes preliminary resin infiltration, sectioning, mounting, grinding, and polishing. To aid in the identification and resolution of common issues during subsequent specimen analysis, the article presents common issues, along with causes and mitigation strategies. It describes the processes involved in the interpretation of the thermal spray coating microstructure.

This chapter discusses the basic components in an induction heat treating system. It describes the design and operating characteristics of power supplies, load-matching transformers, tuning capacitors, power regulators, controllers, process monitors, and diagnostic systems. It also provides information on fixtures and work-handling devices, quench systems, and load matching and tuning procedures.

This chapter reviews various ways to classify failure categories and summarizes the basic types, causes, and mechanisms of damage, with particular consideration given to whether the likelihood of the types of damage can or cannot be influenced by the heat treating of steel parts. The classical organization for types of damage (failures) is as follows: deformation, fracture, wear, corrosion or other environmental damage, and multiple or complex damage. The chapter also provides some examples of lack of conformance to specification that may at first look like the heat treater did something wrong, but where other contributing factors made it difficult or impossible for the heat treater to meet the specification.

This chapter provides an overview of the tools and techniques, as well as some of the underlying theory, that have proven useful for process modeling and simulation. It begins by presenting the framework of a thermoset cure model that accounts for kinetics, viscosity, heat transfer, flow, voids, and residual stress. It then discusses each variable in detail, explaining how it affects the cure process, how it is measured, and how it can be expressed mathematically in the form of a simple model. The discussions throughout the chapter are supported by numerous images, diagrams, and data plots.

This chapter discusses the methods by which stainless steel powders are shaped and compacted prior to sintering, including rigid die compaction, metal injection molding, extrusion, and hot isostatic pressing. It explains where each process is used and how processing parameters, such as temperature and pressure, and powder characteristics, such as particle size and shape, influence the quality of manufactured parts. It describes the various stages of metal powder compaction, the role of lubricants, and how to account for dimensional changes in the design of tooling and process sequences.

This chapter discusses the selection, use, and integration of methods to control process variables in induction heating, including control of workpiece and processing temperature and materials handling systems. The discussion of temperature control includes a review of proportional controllers and heat-regulating devices. Integration of control functions is illustrated with examples related to heating of steel slabs, surface hardening of steel parts, vacuum induction melting for casting operations, and process optimization for electric-demand control. Distributed control within larger manufacturing systems is discussed. The chapter also covers nondestructive techniques for process control and methods for process simulation.