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tool-chip interface

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Published: 30 September 2023
Figure 13.21: Effects of tool/chip contact length ( L = χt ) and interface shear strength ( τ i = βk c ) on energy consumed in machining. More
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 30 September 2023
DOI: 10.31399/asm.tb.stmflw.t59390456
EISBN: 978-1-62708-459-8
... . Sliding friction can be maintained over the rake face only when μp < k . Since p is generally larger than k , μ must be kept quite low. This can be achieved only under limited conditions: (a) Access of a lubricant to the chip/tool interface is very difficult, but a lubricant can reduce...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110391
EISBN: 978-1-62708-247-1
... are supported by softer materials, the brittle materials will chip at the interface. That’s why the Si die always seems to chip at the die attach interface. The larger the section face, the more stress on the sample. Thin dice, such as those used in CSP or stacked die packages, have less chipping...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110550
EISBN: 978-1-62708-247-1
... Time-Domain Reflectometry is a useful tool for finding electrical anomalies in FCBGA (Flip-chip Ball Grid Array) samples. The technique is able to isolate an open, short or resistance shift to at least the laminate, bumps or chip by contacting a BGA (Ball Grid Array) Input/Output (I/O) bump...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 January 2015
DOI: 10.31399/asm.tb.tpmpa.t54480293
EISBN: 978-1-62708-318-8
... 13.1 , 13.2 , 13.13 – 13.16 ). In addition, titanium produces a thin chip, which flows at high velocity over the tool face on a small tool-chip contact area. This situation, plus the high strength of titanium, produces high contact pressures at the tool-chip interface. This combination of events...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110067
EISBN: 978-1-62708-247-1
... Abstract The scanning acoustic microscope (SAM) is an important tool for development of improved molded and flip chip packages. The SAM used for integrated circuit inspection is a hybrid instrument with characteristics of both the Stanford SAM and the C-scan recorder. This chapter presents...
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2013
DOI: 10.31399/asm.tb.mfub.t53740213
EISBN: 978-1-62708-308-9
... temperature and extreme pressure at the tool-chip interface. The work material adheres to the cutting edge of the tool. Although this material protects the cutting edge, it also modifies the geometry of the tool. Built-up edges are not stable and will periodically slough off, adhering to the chip or passing...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2023
DOI: 10.31399/asm.tb.edfatr.t56090021
EISBN: 978-1-62708-462-8
... the readiness level of fault isolation tools and techniques. It examines the capabilities, limitations, and optimization potential of x-ray tomography and magnetic field imaging, describes various approaches for optical fault isolation, and compares and contrasts pre-OFI sample preparation methods. The chapter...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110016
EISBN: 978-1-62708-247-1
... edge or corner chipping when handled even in a careful manner. Some WLCSP devices are very small, with a size of 1mm x 1mm. There are few proper tools available for handing such fragile and small devices that do not add additional damage to the Si device. As mentioned earlier, most CSPs use BGA...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2023
DOI: 10.31399/asm.tb.edfatr.9781627084628
EISBN: 978-1-62708-462-8
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2000
DOI: 10.31399/asm.tb.ttg2.t61120313
EISBN: 978-1-62708-269-3
..., the tool has failed. If the hole being drilled is to be tapped subsequently, generation of discolored chips may mean the workpiece has been ruined. Recommended Drilling Tools Cobalt (T-4 or T-5) or molybdenum (M-10) high-speed steel drills have been found suitable for most drilling operations, while...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2023
DOI: 10.31399/asm.tb.edfatr.t56090131
EISBN: 978-1-62708-462-8
... the ability of various imaging methods to locate defects in die stacks. It also presents best practices for sample preparation, inspection, and navigation and offers suggestions for improving the reliability and service life of tools. 3D packaging artificial intelligence deep learning disintegration...
Series: ASM Technical Books
Publisher: ASM International
Published: 30 September 2023
DOI: 10.31399/asm.tb.stmflw.9781627084598
EISBN: 978-1-62708-459-8
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110402
EISBN: 978-1-62708-247-1
.... Using a clean twill jean cloth for cleaving is ideal to avoid sample-to-sample contamination and/or damage to a sample from Si dust or chip fragments. Automated cleaving systems are typically highly sensitive to any adhesives or marker present on samples as they can interfere with vacuum pick-up tools...
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 30 September 2023
DOI: 10.31399/asm.tb.stmflw.t59390039
EISBN: 978-1-62708-459-8
... of the lubricant, only two-body wear takes place. Oxides and intermetallic compounds can be as hard as the constituents of the die or cutting tool; therefore, abrasive wear becomes a competition between die and workpiece whenever the lubricant fails to sufficiently separate the interface. Particles embedded...
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 30 September 2023
DOI: 10.31399/asm.tb.stmflw.t59390019
EISBN: 978-1-62708-459-8
... surfaces become rougher or smoother due to the effects of deformation, tooling interactions, and lubricant film thickness. It familiarizes readers with the concept of nominal contact, the role of asperities, and the effects of interface pressure, plasticity index, shear stress, and bulk strain rate...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2023
DOI: 10.31399/asm.tb.edfatr.t56090109
EISBN: 978-1-62708-462-8
... to the chip CAD interface. Scanning Probe Microscopy The industry trend of device scaling in front-end processes has given rise to the challenges of 3D mapping of active dopant distributions in fine sub-10 nm devices where traditional technology CAD (TCAD) diffusion models are no longer valid. Dopant...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110111
EISBN: 978-1-62708-247-1
... complex and the industry keeps advancing packaging technologies like flip-chip, stacked die, Wafer-Level- packaging, System-in-Package, TSV, 2.5D, FanOut, etc., present Fault Isolation (FI) tools and techniques are having increasing difficulty in meeting Failure Analysis (FA) needs [1] . With gate sizes...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110132
EISBN: 978-1-62708-247-1
... waveform signatures, such as trace bends, vias, and interconnects of a typical flip-chip package. A lower rise time is needed to resolve closely spaced design elements like vias and trace turns, while a higher SNR is needed for the tool to pick up the very subtle discontinuity of these designs. The EOTPR...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110603
EISBN: 978-1-62708-247-1
... type (e.g., dual-in-line (DIP) or plastic leaded chip carrier (PLCC)). The process involves recovery of die (by removing the original packaging) and molding the die into the desired package type. Counterfeiters generally do not use proper handling procedures, tools, and materials for repackaging...