Skip Nav Destination
Close Modal
Search Results for
tin-base soft solders
Update search
Filter
- Title
- Authors
- Author Affiliations
- Full Text
- Abstract
- Keywords
- DOI
- ISBN
- EISBN
- Issue
- ISSN
- EISSN
- Volume
- References
Filter
- Title
- Authors
- Author Affiliations
- Full Text
- Abstract
- Keywords
- DOI
- ISBN
- EISBN
- Issue
- ISSN
- EISSN
- Volume
- References
Filter
- Title
- Authors
- Author Affiliations
- Full Text
- Abstract
- Keywords
- DOI
- ISBN
- EISBN
- Issue
- ISSN
- EISSN
- Volume
- References
Filter
- Title
- Authors
- Author Affiliations
- Full Text
- Abstract
- Keywords
- DOI
- ISBN
- EISBN
- Issue
- ISSN
- EISSN
- Volume
- References
Filter
- Title
- Authors
- Author Affiliations
- Full Text
- Abstract
- Keywords
- DOI
- ISBN
- EISBN
- Issue
- ISSN
- EISSN
- Volume
- References
Filter
- Title
- Authors
- Author Affiliations
- Full Text
- Abstract
- Keywords
- DOI
- ISBN
- EISBN
- Issue
- ISSN
- EISSN
- Volume
- References
NARROW
Format
Topics
Book Series
Date
Availability
1-20 of 100 Search Results for
tin-base soft solders
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
1
Sort by
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2006
DOI: 10.31399/asm.tb.ex2.t69980195
EISBN: 978-1-62708-342-3
... spectrum of materials to be extruded. This chapter focuses on the processes involved in the extrusion of semifinished products in various metals and their alloys, namely tin, lead, lead-base soft solders, tin-base soft solders, zinc, magnesium, aluminum, copper, titanium, zirconium, iron, nickel...
Abstract
Compared with other deformation processes used to produce semifinished products, the hot-working extrusion process has the advantage of applying pure compressive forces in all three force directions, enhancing workability. The available variations in the extrusion process enable a wide spectrum of materials to be extruded. This chapter focuses on the processes involved in the extrusion of semifinished products in various metals and their alloys, namely tin, lead, lead-base soft solders, tin-base soft solders, zinc, magnesium, aluminum, copper, titanium, zirconium, iron, nickel, and powder metals. It discusses their properties and applications as well as suitable equipment for extrusion. It further discusses the processes involved in the extrusion of semifinished products in exotic alloys and extrusion of semifinished products from metallic composite materials.
Book Chapter
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2001
DOI: 10.31399/asm.tb.aub.t61170528
EISBN: 978-1-62708-297-6
... and the amounts and combinations in which they are found. lead alloys tin alloys tin-based bearing alloys tin-lead solders Composition Introduction and Overview Lead and tin are low melting point metals that are often alloyed together. For example, solders in the tin-lead system are the most...
Abstract
This article examines the role of alloying in the production and use of lead and tin. It describes the various categories and grades of lead and lead-base alloys along with their nominal compositions and corresponding UNS numbers. It also discusses the composition and properties of lead used in battery grids, type metals, and bearings. It, likewise, discusses the use of tin in various types of solder and in bearings and provides composition and property data for application-specific designations and grades. The article also discusses the effect of impurities in tin-lead solders and the amounts and combinations in which they are found.
Book Chapter
Series: ASM Technical Books
Publisher: ASM International
Published: 31 December 2024
DOI: 10.31399/asm.tb.hisppa.t56110119
EISBN: 978-1-62708-483-3
... important to adhere to the specified temperatures. Test methodology: An important parameter when testing a solder joint is the test speed or strain rate. Tin- and indium-base solders are strain-rate sensitive, which is reflected in the apparent strength of the solder joint. Additionally, the test...
Book Chapter
Series: ASM Technical Books
Publisher: ASM International
Published: 31 December 2024
DOI: 10.31399/asm.tb.hisppa.t56110257
EISBN: 978-1-62708-483-3
... Alloy Tube ASTM B907-05, Standard Specification for Zinc, Tin and Cadmium Base Alloys Used as Solders Society of Automotive Engineers (SAE) J1147_201801, Welding, Brazing, and Soldering—Materials and Practices Relevant German and European Soldering\Brazing Standard...
Book Chapter
Series: ASM Technical Books
Publisher: ASM International
Published: 31 December 2024
DOI: 10.31399/asm.tb.hisppa.t56110099
EISBN: 978-1-62708-483-3
... solders into consumer electronics and servers has resulted in a growth in the number of available alloys, many based on the tin-silver eutectic composition but with alloy additions of bismuth, copper, and indium. The low-temperature 58Bi-42Sn eutectic alloy ( T eut = 139 °C, or 282 °F) is gaining...
Abstract
This chapter presents the following groupings of metals and alloys that are soldered together: steel and iron-base alloys, aluminum and aluminum alloys, and copper and copper alloys. It also presents the ancillary materials and process methods that assist the solder filler metal in completing the solder joint through induction heating. The chapter focuses on the selection of fluxes and the use of inert gases or even vacuum to realize an oxide-free base material surface both before and during the soldering process.
Book Chapter
Book: Principles of Soldering
Series: ASM Technical Books
Publisher: ASM International
Published: 01 April 2004
DOI: 10.31399/asm.tb.ps.t6244000x
EISBN: 978-1-62708-352-2
... production. Silver extraction from ores involved cupellation of lead, and the base metal was then recovered from the litharge [ Tylecote 1976 ]. The softness and malleability of lead were clearly recognized, and there exist examples of lead being used as a setting agent to fix posts in the ground and lock...
Book Chapter
Book: Principles of Soldering
Series: ASM Technical Books
Publisher: ASM International
Published: 01 April 2004
DOI: 10.31399/asm.tb.ps.t62440049
EISBN: 978-1-62708-352-2
... publications [e.g., Klein Wassink 1989, Manko 2002, Schwartz 2003 ] as well as suppliers’ data sheets and manuals. All solder alloys are based on combinations of two or more constituents, chosen from nine common elements, namely antimony, bismuth, cadmium, gold, indium, lead, silver, tin, and zinc...
Abstract
This chapter presents an overview and survey of solder alloy systems. Extensive reference is made to phase diagrams and their interpretation. The chapter describes the effect of metallic impurities on different solders. The chapter concludes with a review of the key characteristics of eutectic alloys and of the factors most effective at depressing the melting point of solders by eutectic alloying.
Book Chapter
Series: ASM Technical Books
Publisher: ASM International
Published: 01 June 2008
DOI: 10.31399/asm.tb.emea.t52240597
EISBN: 978-1-62708-251-8
... in the United States is for solders. Tin is often alloyed with lead, which produces a series of solders that melt at lower temperatures. Additions of antimony and silver are used to increase the strength of these solders. Pewter is a tin-base white metal containing antimony and copper. Originally, pewter...
Book Chapter
Book: Principles of Soldering
Series: ASM Technical Books
Publisher: ASM International
Published: 01 April 2004
DOI: 10.31399/asm.tb.ps.t62440189
EISBN: 978-1-62708-352-2
... or alloys are not subject to supply or price constraints that would prevent their widespread adoption. Based on the current world consumption of lead-tin solder, each 1% substitution for lead-tin solder by another element represents a new annual consumption for that element of the order of 500 to 600 tonnes...
Abstract
This chapter presents several materials and processes related to soldering technology. It first provides information on lead-free solders, followed by sections devoted to flip-chip processes, diffusion soldering, and modeling. Scanning acoustic microscopy and fine-focus x-ray techniques are also discussed. The chapter describes several evaluation procedures and tests developed to measure solderability and standards for process calibration. The chapter also describes the characteristics of reinforced solders, amalgams used as solders, and other strategies to boost the strength of solders. Further, the chapter considers methods for quantifying the mechanical integrity of joints and predicting their dimensional stability under specified environmental conditions. It discusses the effects of rare earth elements on the properties of solders. The chapter concludes with information on advanced joint characterization techniques.
Series: ASM Technical Books
Publisher: ASM International
Published: 31 December 2024
DOI: 10.31399/asm.tb.hisppa.9781627084833
EISBN: 978-1-62708-483-3
Book Chapter
Series: ASM Technical Books
Publisher: ASM International
Published: 01 October 2011
DOI: 10.31399/asm.tb.mnm2.t53060315
EISBN: 978-1-62708-261-7
..., brackets, chassis, and covers for electronic equipment and sheathing for cable and pipe. Solders Solders account for the second largest use of tin (after tinplate). Tin is an important constituent in solders because it wets and adheres to many common base metals at temperatures considerably below...
Abstract
Nonferrous metals are of commercial interest both as engineering materials and as alloying agents. This chapter addresses both roles, discussing the properties, processing characteristics, and applications of several categories of nonferrous metals, including light metals, corrosion-resistance alloys, superalloys, refractory metals, low-melting-point metals, reactive metals, precious metals, rare earth metals, and metalloids or semimetals. It also provides a brief summary on special-purpose materials, including uranium, vanadium, magnetic alloys, and thermocouple materials.
Book Chapter
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2011
DOI: 10.31399/asm.tb.jub.t53290165
EISBN: 978-1-62708-306-5
... on its surface. Wetting actually depends on a slight surface alloying of the base metal with the brazing filler metal. Lead, for example, does not alloy with iron and will not wet it. Tin, on the other hand, does form an alloy with iron, so a tin-lead solder will wet steel. Fig. 7.2 Principle...
Abstract
Brazing and soldering processes use a molten filler metal to wet the mating surfaces of a joint, with or without the aid of a fluxing agent, leading to the formation of a metallurgical bond between the filler and the respective components. This chapter discusses the characteristics, advantages, and disadvantages of brazing and soldering. The first part focuses on the fundamentals of the brazing process and provides information on filler metals and specific brazing methods. The soldering portion of the chapters provides information on solder alloys used, selection criteria for base metal, the processes involved in precleaning and surface preparation, types of fluxes used, solder joint design, and solder heating methods.
Book Chapter
Book: Principles of Soldering
Series: ASM Technical Books
Publisher: ASM International
Published: 01 April 2004
DOI: 10.31399/asm.tb.ps.t62440103
EISBN: 978-1-62708-352-2
.... These halide atmospheres also chemically attack the underlying metal and physically undermine the oxide, as occurs in the fluxing of aluminum. This point is discussed in section 3.2.2.1 in this chapter. A different option, particularly for tin-base solders, is to use a process atmosphere that contains...
Abstract
Materials used in joining, whether solders, fluxes, or atmospheres, are becoming increasingly subjected to restrictions on the grounds of health, safety, and pollution concerns. These regulations can limit the choice of materials and processes that are deemed acceptable for industrial use. The chapter addresses this issue with a focus on soldering fluxes. The chapter also describes factors related to soldering under a protective atmosphere, provides information on chemical fluxes for soldering of various metals, and discusses the processes involved in fluxless soldering processes.
Book: Principles of Soldering
Series: ASM Technical Books
Publisher: ASM International
Published: 01 April 2004
DOI: 10.31399/asm.tb.ps.t62440145
EISBN: 978-1-62708-352-2
... of Soft Solders Gold is widely used as the surface layer in metallization schemes because of its chemical inertness and ease of visual inspection. The change in the melting point (solidus temperature) of selected binary tin-base solders, when these have dissolved gold, is given in Table 4.3...
Abstract
This chapter considers the materials and processing aspects of soldering and the manner in which these interrelate in the development of joining processes. It discusses the processes involved in eliminating or suppressing metallurgical and mechanical constraints as well as constraints imposed by the components.
Book Chapter
Series: ASM Technical Books
Publisher: ASM International
Published: 30 April 2021
DOI: 10.31399/asm.tb.tpsfwea.t59300163
EISBN: 978-1-62708-323-2
... Alloy Characteristics Cu + Ni Copper is mutually soluble in nickel, and copper/nickel alloys are usually soft and ductile; monels are copper/nickel alloys. Cu + Sn Copper tin alloys contain up to 20% tin. The tin strengthens the copper. There are many Cu/Sn alloys with minor additions...
Book Chapter
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2001
DOI: 10.31399/asm.tb.aub.t61170003
EISBN: 978-1-62708-297-6
... is increased by additions of antimony. Fig. 5 Phase diagram for the magnesium-tin system, which exhibits a high-melting intermetallic compound. Source: A.A. Nayeb-Hashemi and J.B. Clark, 1988 Weldability, Brazeability, and Solderability Although the weldability of a material depends...
Abstract
This article discusses the general purpose of alloying and identifies some of the material properties and behaviors that can be improved by adding various elements to the base metal. It explains how alloying can make metals stronger and more resistant to corrosion and wear as well as easier to cast, weld, form, and machine. It also discusses some of the alloying techniques that have been developed to address problems stemming from dissimilarities between the base metal and alloying or inoculate material.
Series: ASM Technical Books
Publisher: ASM International
Published: 01 April 2004
DOI: 10.31399/asm.tb.ps.9781627083522
EISBN: 978-1-62708-352-2
Book Chapter
Book: Principles of Soldering
Series: ASM Technical Books
Publisher: ASM International
Published: 01 April 2004
DOI: 10.31399/asm.tb.ps.t62440001
EISBN: 978-1-62708-352-2
... as having melting points above this value. This distinction has a historical origin: the earliest solders were based on alloys of tin, while brazes were based on copper-zinc alloys (see “History of Soldering” in this volume and “ History of Brazing ” in the planned companion volume Principles of Brazing...
Abstract
Soldering and brazing represent one of several types of methods for joining solid materials. These methods may be classified as mechanical fastening, adhesive bonding, soldering and brazing, welding, and solid-state joining. This chapter summarizes the principal characteristics of these joining methods. It presents a comparison between solders and brazes. Further details on pressure welding and diffusion bonding are also provided. Key parameters of soldering are discussed, including surface energy and surface tension, wetting and contact angle, fluid flow, filler spreading characteristics, surface roughness of components, dissolution of parent materials and intermetallic growth, significance of the joint gap, and the strength of metals. The chapter also examines the principal aspects related to the design and application of soldering processes.
Book: Principles of Brazing
Series: ASM Technical Books
Publisher: ASM International
Published: 01 August 2005
DOI: 10.31399/asm.tb.pb.t51230189
EISBN: 978-1-62708-351-5
... and 5.2 reveals that colored gold brazes are modified gold-silver-copper jewelry alloys, while white gold brazes, like their counterpart jewelry alloys, contain silver, nickel, zinc, copper, indium, and tin additions, or are based on gold-silver-palladium with possibly copper, zinc, and nickel additions...
Abstract
Brazes for carat gold jewelry must meet or exceed the fineness/caratage of the component piece parts of the assembly in order for it to meet the national fineness/caratage standards and marking or hallmarking regulations for jewelry. This chapter concentrates on brazes for gold jewelry. It provides understanding of the metallurgy of gold jewelry alloys and includes a discussion of brazes for carat gold jewelry. The chapter also provides information on traditional gold jewelry brazes, the target properties of filler metals for carat gold jewelry and describes the characteristics of novel 22 carat gold solders.
Book Chapter
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2001
DOI: 10.31399/asm.tb.aub.t61170457
EISBN: 978-1-62708-297-6
..., have superb spring qualities, high fatigue resistance, excellent formability and solderability, and high corrosion resistance. They are primarily produced as strip for electrical products. Other uses include corrosion-resistant bellows, diaphragms, and spring washers. Leaded (Cu-Sn-P-Pb) Tin...
Abstract
This article discusses the composition, properties, and behaviors of copper and its alloys. It begins with an overview of the characteristics, applications, and commercial grades of wrought and cast copper. It then discusses the role of alloying, explaining how zinc, tin, aluminum, silicon, and nickel affect the physical and mechanical properties of coppers and high-copper alloys as well as brasses, bronzes, copper-nickels, and nickel silvers. It also explains how alloying affects electrical conductivity, corrosion resistance, stress-corrosion cracking, and processing characteristics.
1