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tin pest
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Book Chapter
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2011
DOI: 10.31399/asm.tb.jub.t53290165
EISBN: 978-1-62708-306-5
.... , Suh J.O. , and Wu A.T. , Tin Whisker Growth on Lead-Free Solder Finishes , Lead-Free Solder Interconnect Reliability , ASM International , 2005 7.12 Vianco P.T. , Wave Soldering , Welding, Brazing, and Soldering , Vol 6 , ASM Handbook , ASM International , 1993 10.31399...
Abstract
Brazing and soldering processes use a molten filler metal to wet the mating surfaces of a joint, with or without the aid of a fluxing agent, leading to the formation of a metallurgical bond between the filler and the respective components. This chapter discusses the characteristics, advantages, and disadvantages of brazing and soldering. The first part focuses on the fundamentals of the brazing process and provides information on filler metals and specific brazing methods. The soldering portion of the chapters provides information on solder alloys used, selection criteria for base metal, the processes involved in precleaning and surface preparation, types of fluxes used, solder joint design, and solder heating methods.
Book Chapter
Book: Principles of Soldering
Series: ASM Technical Books
Publisher: ASM International
Published: 01 April 2004
DOI: 10.31399/asm.tb.ps.t62440049
EISBN: 978-1-62708-352-2
... of bismuth and also antimony are added to lead-tin solders to prevent degradation at low temperatures through a mechanism known as “tin pest.” Further details of this failure mechanism are given in section 2.2 in this chapter. Fig. 2.16 Liquidus surface of the Bi-Pb-Sn system Silver Lead...
Abstract
This chapter presents an overview and survey of solder alloy systems. Extensive reference is made to phase diagrams and their interpretation. The chapter describes the effect of metallic impurities on different solders. The chapter concludes with a review of the key characteristics of eutectic alloys and of the factors most effective at depressing the melting point of solders by eutectic alloying.
Book Chapter
Book: Principles of Soldering
Series: ASM Technical Books
Publisher: ASM International
Published: 01 April 2004
DOI: 10.31399/asm.tb.ps.t62440189
EISBN: 978-1-62708-352-2
... be achieved, which is low enough to be widely acceptable [ Vaynman and Fine 2000 ]. 5.1.5.5 Susceptibility to Tin Pest and Tin Whiskers Tin undergoes an allotropic transformation from its normal metallic white form, which has a body-centered tetragonal crystal structure, to a powdery gray material...
Abstract
This chapter presents several materials and processes related to soldering technology. It first provides information on lead-free solders, followed by sections devoted to flip-chip processes, diffusion soldering, and modeling. Scanning acoustic microscopy and fine-focus x-ray techniques are also discussed. The chapter describes several evaluation procedures and tests developed to measure solderability and standards for process calibration. The chapter also describes the characteristics of reinforced solders, amalgams used as solders, and other strategies to boost the strength of solders. Further, the chapter considers methods for quantifying the mechanical integrity of joints and predicting their dimensional stability under specified environmental conditions. It discusses the effects of rare earth elements on the properties of solders. The chapter concludes with information on advanced joint characterization techniques.
Book Chapter
Series: ASM Technical Books
Publisher: ASM International
Published: 01 October 2011
DOI: 10.31399/asm.tb.mnm2.t53060333
EISBN: 978-1-62708-261-7
.... Very pure tin is particularly susceptible to this tin pest , while small additions (0.1%) of bismuth or antimony prevent disintegration. Tin alloys containing antimony show age-hardening characteristics similar to the antimony-bearing lead-base alloys. This process determines to a certain extent...
Abstract
Nonferrous alloys are heat treated for a variety of reasons. Heat treating can reduce internal stresses, redistribute alloying elements, promote grain formation and growth, produce new phases, and alter surface chemistry. This chapter describes heat treatment processes and how nonferrous alloys respond to them. It provides information on aluminum, cobalt, copper, magnesium, nickel, and titanium alloys and their composition, microstructure, properties, and processing characteristics.
Series: ASM Technical Books
Publisher: ASM International
Published: 31 December 2020
DOI: 10.31399/asm.tb.phtbp.t59310351
EISBN: 978-1-62708-326-3
...-Pb Tin brasses C40400–C48600 Cu-Zn-Sn-Pb Phosphor bronzes C50100–C52480 Cu-Sn-P Leaded phosphor bronzes C53400–C54400 Cu-Sn-Pb-P Copper-phosphorus and Cu-Ag-P alloys (c) C55180–C55284 Cu-P-Ag Aluminum bronzes C60800–C64210 Cu-Al-Ni-Fe-Si-Sn Silicon bronzes C64700–C66100...
Abstract
The term heat treatable alloys is used in reference to alloys that can be hardened by heat treatment, and this chapter briefly describes the major types of heat treatable nonferrous alloys. The discussion provides a general description of annealing cold-worked metals and describes some of the common nonferrous alloys that can be hardened through heat treatment. The nonferrous alloys covered include aluminum alloys, cobalt alloys, copper alloys, magnesium alloys, nickel alloys, and titanium alloys.