Search Results for time-of-flight mass spectrometry

This article covers common techniques for surface characterization, including the modern scanning electron microscopy and methods for the chemical characterization of surfaces by Auger electron spectroscopy, X-ray photoelectron spectroscopy, and time-of-flight secondary ion mass spectrometry. The principles of surface analysis and some of the applications of the technique in polymer failure studies are also provided.

There are several analytical methods available that can be used in-line on whole wafers as well as off-line on de-processed products that are returned from the field. These techniques are surface analytical techniques that can be used to characterize the bulk of the material. The main six methods used in semiconductor industry are: Auger spectroscopy, dynamic secondary ion mass spectroscopy, time of flight static secondary ion mass spectroscopy (ToF-SIMS), X-ray photoelectron spectroscopy, scanning electron microscope-energy dispersive X-ray spectroscopy (SEM-EDX), and transmission electron microscope-EDX. This review specifically addresses ToF-SIMS and describes some typical examples of the application of Auger and SEM-EDX.

With the commercialization of heavier and lighter ion beams, adoption of focused ion beam (FIB) use for analysis of challenging regions of interest (ROI) has grown. In this chapter, the authors focus on highlighting commercially available and complementary FIB technologies and their implementation challenges and application trends.

This article provides an overview of the most common micro-analytical technique in the failure analysis laboratory: energy dispersive X-ray spectroscopy (EDS). It discusses the general characteristics, advantages, and disadvantages of some of the X-ray detectors attached to the scanning electron microscope chamber including the lithium-drifted EDS detector, silicon drift detector (SDD), and wavelength dispersive X-ray detector. The article then provides information on qualitative and quantitative X-ray analysis programs followed by a discussion on EDS elemental mapping. The discussion includes a comparison of scanning transmission electron microscope-EDS elemental mapping and mapping with an SDD. A brief section is devoted to the discussion on the artifacts that occur during X-ray mapping.

This chapter discusses the compatibility problems that arise from chemical or physical interactions between liquefied gases and the common materials used in their production, storage, transportation, distribution, and use. The discussion covers the compatibility of materials with liquid oxygen and liquid fluorine. Hydrogen-environment embrittlement is unique to low-temperature hydrogen systems and is also discussed.

This chapter covers the engineering aspects of corrosion inhibitors and their effect on corrosion reactions. It explains how different metallic salts and heterocyclic compounds influence chemical reactions on metal surfaces exposed to corrosive media or environments. It describes how to evaluate inhibition efficiency through weight loss measurements, linear polarization resistance tests, electrochemical impedance spectroscopy, electrochemical noise monitoring, and surface analysis. It demonstrates the use of potentiodynamic polarization curves, Tafel extrapolations, equivalent circuit models, and various methods for characterizing corrosion damage and protective surface films. It also discusses typical applications, industry trends, and the emerging role of high-throughput experimentation, quantitative modeling, and machine learning in the development of cleaner and more effective corrosion inhibitors.

This chapter provides a practical overview of the tools and techniques used to assess the tribological aspects of metal forming processes. It describes test methods that have been developed to evaluate bulk deformation and sheet metal forming processes along with lubricant rheology, friction forces, and stress and strain distributions. It explains how to measure temperature between tooling and workpiece surfaces as well as surface topography and composition, film thickness, and wear. It also discusses the benefits of reduced-scale and simulation testing and the transfer of results from one process to another.

This chapters discusses the basic steps in the failure analysis process. It covers examination procedures, selection and preservation of fracture surfaces, macro and microfractography, metallographic analysis, mechanical testing, chemical analysis, and simulated service testing.