Search Results for time

Time-domain based characterization methods, mainly time-domain reflectometry (TDR) and time-domain transmissometry (TDT), have been used to locate faults in twisted cables, telegraph lines, and connectors in the electrical and telecommunication industry. This article provides a brief review of conventional TDR and its application limitations to advanced packages in semiconductor industry. The article introduces electro optical terahertz pulse reflectometry (EOTPR) and discusses how its improvements of using high frequency impulse signal addressed application challenges and quickly made it a well-adopted tool in the industry. The third part of this article introduces a new method which combines impulse signal and the TDT concept, and discusses a combo TDR and TDT method. Cases studies and application notes are shared and discussed for each technique. Application benefits and limitations of these techniques (TDR, EOTPR, and combo TDR/TDT) are summarized and compared.

This chapter describes the two types of Time-Temperature-Transformation (TTT) diagrams used and outlines the methods of determining them. As a precursor to the examination of the decomposition of austenite, it first reviews the phases and microconstituents found in steels. This includes a presentation of the iron-carbon phase diagram and the equilibrium phases. The chapter also covers the common microconstituents that form in steels, including the nomenclature used to describe them. The chapter provides a comparison of isothermal and continuous cooling TTT diagrams. These diagrams are affected by the carbon and alloy content and by the prior austenite grain size, and the way in which these factors affect them is examined.

This chapter provides a detailed review of creep-fatigue analysis techniques, including the 10% rule, strain-range partitioning, several variants of the frequency-modified life equation, damage assessment based on tensile hysteresis energy, the OCTF (oxidation, creep, and thermomechanical fatigue) damage model, and numerous methods that make use of creep-rupture, crack-growth, and void-growth data. It also discusses the use of continuum damage mechanics and includes examples demonstrating the accuracy of each method as well as the procedures involved.