This chapter covers basic machining and assembly operations, with an emphasis on hole preparation for mechanical fasteners. It describes manual, power feed, and automated drilling techniques as well as reaming and countersinking. It discusses various types of fasteners, including rivets, pins, and bolts, along with selection factors and special considerations for composite joints. It also includes information on interference-fit and blind fasteners as well as trimming operations, general assembly considerations, and sealing and painting procedures.

This chapter familiarizes readers with the design, configuration, and function of tooling and dies used to extrude aluminum alloys. It discuses basic design considerations, including the geometry, location, and orientation of die openings; allowances for thermal shrinkage, stretching, and deflection; and the length and profile of bearing surfaces. It outlines the steps and processes involved in die making, describes the selection and treatment of die materials, and examines the factors that influence friction and wear. It also discusses the general procedures for on-site die correction.

Circuit edit has been instrumental to the development of focused ion beam (FIB) systems. FIB tools for advanced circuit edit play a major role in the validation of design and manufacture. This chapter begins with an overview of value, role, and unique capabilities of FIB circuit edit tools for first silicon debug. The etching capabilities of circuit edit FIB tools are then discussed, providing information on chemistry assisted etching in silicon oxides and low-k dielectrics. The chapter also discusses the requirements and procedures involved in edit operation: high aspect ratio milling, endpointing, and cutting copper. It then provides an introduction to FIB metal/conductor deposition and FIB dielectric deposition. Edit design rules that can facilitate prototype production from first silicon are also provided. The chapter concludes with a discussion on future trends in circuit edit technology.

This article reviews the basic physics behind active photon injection for local photocurrent generation in silicon and thermal laser stimulation along with standard scanning optical microscopy failure analysis tools. The discussion includes several models for understanding the local thermal effects on metallic lines, junctions, and complete devices. The article also provides a description and case study examples of multiple photocurrent and thermal injection techniques. The photocurrent examples are based on Optical Beam-Induced Current and Light-Induced Voltage Alteration. The thermal stimulus examples are Optical Beam-Induced Resistance Change/Thermally-Induced Voltage Alteration and Seebeck Effect Imaging. Lastly, the article discusses the application of solid immersion lenses to improve spatial resolution.

Ion nitriding equipment can be categorized into two groups: cold-wall continuous direct current (dc) equipment and hot-wall pulsed dc equipment. This chapter focuses on these two categories along with other important considerations for ion (plasma) nitriding equipment and processing. Other important considerations discussed include the hollow cathode effect, sputter cleaning, furnace loading, pressure/voltage relationships, workpiece masking, and furnace configuration options. The chapter describes five methods of cooling parts from the process temperature to an acceptable exposure temperature after plasma nitriding. The chapter also presents some of the advantages of the pulsed plasma process.

This chapter begins with an overview of the history of ion nitriding. This is followed by sections that describe how the ion nitriding process works, glow discharge characteristics, process parameters requiring good control, and the applications of plasma processing. The chapter explores what happens in the ion nitriding process and provides information on its gas ratios. It describes the reactions that occur at the surface of the material being treated during iron nitriding and defines corner effect and nitride networking. Further, the chapter provides information on the stability of surface layers and processes involved in the degradation of surface finish and control of the compound zone formation. Gases primarily used for ion nitriding and the control parameters used in ion nitriding are also covered. The chapter also presents the philosophies and advantages of the plasma generation technique for nitriding. It concludes with processes involved in oxynitriding.

Photon emission (PE) is one of the major optical techniques for contactless isolation of functional faults in integrated circuits (ICs) in full electrical operation. This article describes the fundamental mechanisms of PE in silicon based ICs. It presents the opportunities of contactless characterization for the most important electronic device, the MOS - Field Effect Transistor, the heart of ICs and their basic digital element, the CMOS inverter. The article discusses the specification and selection of detectors for proper PE applications. The main topics are image resolution, sensitivity, and spectral range of the detectors. The article also discusses the value and application of spectral information in the PE signal. It describes state of the art IC technologies. Finally, the article discusses the applications of PE in ICs and also I/O devices, integrated bipolar transistors in BiCMOS technologies, and parasitic bipolar effects like latch up.

This chapter discusses the basic differences between direct and indirect extrusion, the application of plastic theory, the significance of strain and strain rate, friction, and pressure, and factors such as alloy flow stress and extrusion ratio, which influence the quality of material exiting the die and the amount of force required.

X-ray imaging systems have long played a critical role in failure analysis laboratories. This article begins by listing several favorable traits that make X-rays uniquely well suited for non-destructive evaluation and testing. It then provides information on X-ray equipment and X-ray microscopy and its application in failure analysis of integrated circuit (IC) packaging and IC boards. The final section is devoted to the discussion on nanoscale 3D X-ray microscopy and its applications.

This chapter presents a comprehensive coverage of mechanical fastening methods. It begins with a discussion on the advantages and disadvantages of mechanical fastening followed by sections providing information on mechanically fastened joints and the selection of the correct fastener system. The chapter then describes important structural fasteners, namely bolts, screws, pins, collar fasteners, rivets, blind fasteners, machine pins, and spring clip fasteners. The following sections describe the process involved in presses, shrink fits, hole generation, and fastener installation. The chapter ends with information on miscellaneous mechanical fastening methods.

This chapter provides a brief overview of iron and steel manufacturing and the major equipment involved in the process as well as identifying where casting fits into the overall process. In addition, it provides an overview of cast iron manufacturing, including the processes involved in converting pig iron into cast iron and steel.

Laser Voltage Probing (LVP) is a key enabling technology that has matured into a well-established and essential analytical optical technique that is crucial for observing and evaluating internal circuit activity. This article begins by providing an overview on LVP history and LVP theory, providing information on electro-optical effects and free-carrier effects. It then focuses on commercially available continuous wave LVP systems. Alternative optoelectronic imaging and probing technologies for fault isolation, namely frequency mapping and laser voltage tracing, are also discussed. The subsequent section provides information on the use of Visible Laser Probing. The article closes with some common LVP observations/considerations and limitations and future work concerning LVP.

This chapter discusses the fatigue behavior of bolted, riveted, and welded joints. It describes the relative strength of machined and rolled threads and the effect of thread design, preload, and clamping force on the fatigue strength of bolts made from different steels. It explains where fatigue failures are likely to occur in cold-driven rivet and friction joints, and why the fatigue strength of welded joints can be much lower than that of the parent metal, depending on weld shape, joint geometry, discontinuities, and residual stresses. The chapter also explains how to improve the fatigue life of welded joints and discusses the factors that can reduce the fracture toughness of weld metals.

This chapter discusses the use of mechanical fastening and adhesive bonding, the primary methods for joining polymer matrix composites. It describes and analyzes the basic types of mechanically fastened joints, including single-hole and multirow bolted composite joints. It then reviews the advantages and disadvantages of adhesively bonded joints and compares and contrasts the long-term performance of various joint designs. The chapter also discusses the merits of stepped-lap and bonded-bolted joints.

High-pressure cold spray repair process has been used on a number of different applications in the defense industry. This chapter describes various applications for cold spray systems that have operating pressures greater than 2.4 MPa (350 psi) and operating temperatures greater than 500 deg C (930 deg F).

This chapter discusses composite testing procedures, including tension, compression, shear, flexure, and fracture toughness testing as well as adhesive shear, peel, and honeycomb flatwise tension testing. It also discusses specimen preparation, environmental conditioning, and data analysis.

Beryllium’s machining characteristics are similar to those of heat-treated cast aluminum and chilled cast iron. Like the other materials, it can be turned, milled, drilled, bored, sawed, cut, threaded, tapped, and trepanned with good results. This chapter explains how these machining operations are conducted and describes the effect of tooling materials, cutting speeds, metal-removal rates, and other variables. It also explains how to assess and remove surface damage caused by machining such as microcracks and twins.

This article introduces the wafer-level fault localization failure analysis (FA) process flow for an accelerated yield ramp-up of integrated circuits. It discusses the primary design considerations of a fault localization system with an emphasis on complex tester-based applications. The article presents examples that demonstrate the benefits of the enhanced wafer-level FA process. It also introduces the setup of the wafer-level fault localization system. The application of the wafer-level FA process on a 22 nm technology device failing memory test is studied and some common design limitations and their implications are discussed. The article presents a case study and finally introduces a different value-add application flow capitalizing on the wafer-level fault localization system.

This chapter describes joining by forming processes including riveting, clinching, crimping, and dieless joining techniques. It also discusses the fatigue behavior of clinched joints and the results of fatigue tests that compare clinched and spot welded joints.

This chapter discusses the various failure analysis techniques for microelectromechanical systems (MEMS), focusing on conventional semiconductor manufacturing processes and materials. The discussion begins with a section describing the advances in integration and packaging technologies that have helped drive the further proliferation of MEMS devices in the marketplace. It then shows some examples of the top MEMS applications and quickly discusses the fundamentals of their workings. The next section describes common failure mechanisms along with techniques and challenges in identifying them. The chapter also provides information on the testing of MEMS devices. It covers the two common challenges in sample preparation for MEMS: decapping, or opening up the package, without disturbing the MEMS elements; and removing MEMS elements for analysis. Finally, the chapter discusses the aspects of failure analysis techniques that are of particular interest to MEMS.