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thin-section preparation

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Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2010
DOI: 10.31399/asm.tb.omfrc.t53030115
EISBN: 978-1-62708-349-2
... microscopy contrast methods are shown throughout. fiber-reinforced polymeric composites grinding mounting polishing thin-section preparation transmitted-light microscopy The technique that is used to prepare fiber-reinforced composite specimens for optical analysis dictates the information...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2010
DOI: 10.31399/asm.tb.omfrc.t53030211
EISBN: 978-1-62708-349-2
... thin-section development through grinding and polishing alleviates these phenomena when performed correctly. The details of this preparation technique were described in Chapter 6, “Thin-Section Preparation and Transmitted-Light Microscopy,” in this book. The thin sections developed in these studies...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2010
DOI: 10.31399/asm.tb.omfrc.t53030089
EISBN: 978-1-62708-349-2
... preparation after polishing. One option is the development of an ultrathin section from the material of interest, as described in Chapter 6, “Thin-Section Preparation and Transmitted-Light Microscopy,” but other methods, such as etching, staining, and dyeing, are less time-consuming and work well...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110461
EISBN: 978-1-62708-247-1
... interaction volume in thin section of TEM sample and bulk material in SEM (not drawn to scale). The electrons can penetrate as deep as 8 μm in to the bulk sample at 30 keV [36] and degrade spatial resolution. In a thin TEM section, the interaction volume is limited by the sample thickness (few tens...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2010
DOI: 10.31399/asm.tb.omfrc.t53030023
EISBN: 978-1-62708-349-2
..., and thin sections. Circular plastic molds can also be used for mounting composite samples, but they are not as convenient for the geometry of most composite materials or for polishing. Wash and degrease the samples to create a clean interface to bond to the mounting resin. Completely dry all...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110391
EISBN: 978-1-62708-247-1
...-Automated Sample Prep Things to Always Keep in Mind Standard Mount to Chuck Basic Sectioning Recipe Sample Too Small for Chuck Glass Sandwich for Thin/Weak Samples Thin Sample Sectioning Recipe Large Flip-Chip Samples For Global Substrate Thinning Turner Method for Thinning Thick...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 1984
DOI: 10.31399/asm.tb.mpp.t67850060
EISBN: 978-1-62708-260-0
... laboratory abrasive cutoff machine [1] used for sectioning metallographic specimens. These machines use either consumable or nonconsumable cutting wheels. Figure 2-2 Typical laboratory abrasive cutoff saw. (Courtesy of Buehler Ltd.) In abrasive cutting, a thin rotating disc of a suitable...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2010
DOI: 10.31399/asm.tb.omfrc.t53030067
EISBN: 978-1-62708-349-2
... into a single step. A thin diamond wafering blade is used to cut the mount through the midsection, as shown in Fig. 4.4 . This process will bypass the steps that cause the majority of damage to the sample. After the sample has been sectioned with the diamond saw, it is ready to be polished. The diamond blade...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110402
EISBN: 978-1-62708-247-1
... Figure 3 Copper bumps prepared in cross-section (A) post cleave (B) after broad ion beam milling. Figure 12 8″ wafer cleaved at 45 degrees to the notch. Figure 13 Sample cleaved at 45 degrees to (100) plane using a long scribe. Figure 11 Copper film on (100...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110153
EISBN: 978-1-62708-247-1
... trivial. The die remained relatively flat and the fillers used were very compatible with cross-sectioning as well as backside preparation, additionally, the thinning requirements were much less stringent. Due to higher CTE mismatch of composites and silicon, a strain layer forms and warps the package...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 March 2002
DOI: 10.31399/asm.tb.mgppis.t60400149
EISBN: 978-1-62708-258-7
... in this section. In the TEM, the image that is observed is the result of transmitted electrons. Thus, the internal microstructure of a thin section of a metal can be seen, consisting of dislocations, precipitates, grain boundaries, and subgrain boundaries. Figure 6.9 shows a transmission electron micrograph...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110335
EISBN: 978-1-62708-247-1
...° with respect to the substrate. Figure 16 Typical TEM lamella produced by FIB milling. A) Bulk lamella before polishing a thin region for TEM imaging. B) Top-down view of a lamella with a thin, electron transparent section on the right side. C) Side view of lamella with a very thin, transparent...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 March 2001
DOI: 10.31399/asm.tb.secwr.t68350195
EISBN: 978-1-62708-315-7
... areas discussed later in this section), the choice of surface treatment can be made primarily on the basis of surface hardness, since even very thin coatings are able to support the contact loads. The industrial areas covered in this section include textiles, printing, plastics, packaging, food...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 March 2002
DOI: 10.31399/asm.tb.mgppis.t60400169
EISBN: 978-1-62708-258-7
... as abrasive particles. Wire sawing is a very slow process and is usually used in preparing damage-free specimens for electron microscopy. However, very delicate specimens such as thin-walled tubing, honeycomb structures, and enameled sheet steel (ceramic-coated steel) are sectioned with a wire saw. The kerf...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110144
EISBN: 978-1-62708-247-1
... Preparation and Optics” section as frontside and backside techniques are frequently needed in the same package. Topside access can be accomplished by flat lapping, CNC machining, laser etching, RIE (Reactive Ion Etching), chemical etching, or a combination of these coupled with optical or electrical...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 August 2018
DOI: 10.31399/asm.tb.msisep.t59220085
EISBN: 978-1-62708-259-4
... preparation for TEM involves producing very thin regions. As it is normal to use very large magnifications in the TEM (this is one of the most important abilities of this microscope), the total volume of metal that is examined in the TEM is very small. Thus, this microscope is usually used to observe general...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110323
EISBN: 978-1-62708-247-1
... Backside Four Terminal Resistance Measurements Electron Beam Induced Resistance Change Resistive Gate Defect Identification Circuit Editing on Backside Silicon Removed Units Prior to the 45nm technology node, preparation of cross-section TEM samples was performed with the lamella...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110550
EISBN: 978-1-62708-247-1
... into interconnect bumps Figure 25 Sample with a corner Micropillar chain fail. The sample was delidded (a) and the failing corner of the top die thinned to 80µm (b & c). PFIB cross section was then carried out to image the defect Figure 26 Workflow outline for the deconstruction operation...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 August 2015
DOI: 10.31399/asm.tb.piht2.t55050245
EISBN: 978-1-62708-311-9
...-cooled metallurgical cutoff saw. (Water-jet cutoff has also been used.) Because hardened parts are being cut, soft-bonded cutoff wheels must be used. Parts must be clamped so that they can be cut without causing binding of the cutoff wheel during cutting. In addition, parts with thin cross sections need...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110413
EISBN: 978-1-62708-247-1
... Reflectivity, color, phase contrast, bright field/dark field, polarization Sample loading Slow – requires vacuum Fast – no vacuum Sample preparation May require sectioning or delayering, Insulating samples may need sputter coating Usually none - dielectrics are transparent, No problem with insulating...