This chapter describes three approaches for 3D hot-spot localization of thermally active defects by lock-in thermography (LIT). In the first section, phase-shift analysis for analyzing stacked die packages is performed. The second example employs defocusing sequences for the localization of resistive electrical shorts in 3D architectures, and the third operates in cross sectional LIT mode to investigate defects in the insulation liner of Through Silicon Vias. All three approaches allow for a precise localization of thermally active defects in all three spatial dimensions to guide subsequent high-resolution physical analyses.

This article reviews the basic physics behind active photon injection for local photocurrent generation in silicon and thermal laser stimulation along with standard scanning optical microscopy failure analysis tools. The discussion includes several models for understanding the local thermal effects on metallic lines, junctions, and complete devices. The article also provides a description and case study examples of multiple photocurrent and thermal injection techniques. The photocurrent examples are based on Optical Beam-Induced Current and Light-Induced Voltage Alteration. The thermal stimulus examples are Optical Beam-Induced Resistance Change/Thermally-Induced Voltage Alteration and Seebeck Effect Imaging. Lastly, the article discusses the application of solid immersion lenses to improve spatial resolution.

Optoelectronic components can be readily classified as active light-emitting components (such as semiconductor lasers and light emitting diodes), electrically active but non-emitting components, and inactive components. This chapter focuses on the first category, and particularly on semiconductor lasers. The discussion begins with the basics of semiconductor lasers and the material science behind some causes of device failure. It then covers some of the common failure mechanisms, highlighting the need to identify failures as wearout or maverick failures. The chapter also covers the capabilities of many key optoelectronic failure analysis tools. The final section describes the common steps that should be followed so as to assure product reliability of optoelectronic components.

This article provides an introduction to the dynamic random access memory (DRAM) operation with a focus to localization techniques of the defects combined with some physical failure analysis examples and case studies for memory array failures. It discusses the electrical measurement techniques for array failure analysis. The article then presents know-how-based analysis techniques of array failures by bitmap classification. The limits of bitmapping that lead to well-known localization techniques like thermally induced voltage alteration and optical beam induced resistance change are also discussed. The article concludes by providing information on soft defect localization techniques.

The building block of all matter, including metals, is the atom. This chapter initially provides information on atomic bonding and the crystal structure of metals and alloys, followed by a description of three crystal lattice structures of metals: face-centered cubic, hexagonal close-packed, and body-centered cubic. It then describes the four main divisions of crystal defects, namely point defects, line defects, planar defects, and volume defects. The chapter provides information on grain boundaries of metals, processes involved in atomic diffusion, and key properties of a solid solution. It also explains the aspects of a phase diagram that shows what phase or phases are present in the alloy under conditions of thermal equilibrium. Finally, a discussion on the applications of equilibrium phase diagrams is presented.

This chapter surveys both basic quality and basic reliability concepts as an introduction to the failure analysis professional. It begins with a section describing the distinction between quality and reliability and moves on to provide an overview of the concept of experiment design along with an example. The chapter then discusses the purposes of reliability engineering and introduces four basic statistical distribution functions useful in reliability engineering, namely normal, lognormal, exponential, and Weibull. It also provides information on three fundamental acceleration models used by reliability engineers: Arrhenius, Eyring, and power law models. The chapter concludes with information on failure rates and mechanisms and the two techniques for uncovering reliability issues, namely burn-in and outlier screening.

Many defects generate excessive heat during operation; this is due to the power dissipation associated with the excess current flow at the defect site. There are several thermal detection techniques for failure analysis and this article focuses on infrared thermography with lock-in detection, which detects an object's temperature from its infrared emission based on blackbody radiation physics. The basic principles and the interpretation of the results are reviewed. Some typical results and a series of examples illustrating the application of this technique are also shown. Brief sections are devoted to the discussion on liquid-crystal imaging and fluorescent microthermal imaging technique for thermal detection.

Binder removal approaches involve various combinations of heat, solvents, vacuum, and pressure. In each variant, the goal is binder removal without component damage. This chapter addresses the factors that control success, showing how process decisions depend on the powder and binder characteristics. The chapter starts with a comparison of binder-, lubricant-, and polymer-removal situations that arise after powder shaping and then describes the general principles of binder removal in powder-binder techniques. The subsequent sections discuss in detail characteristics, operating procedure, equipment setup, advantages, limitations, and applications of first- and second-stage binder removal processes, as well as the factors influencing these processes. Cost issues associated with binder-removal technologies are also discussed.

This article is a detailed account of the mechanisms of fatigue failure of polymers, namely thermal fatigue failure and mechanical fatigue failure. The mechanical fatigue failure is discussed in terms of fatigue crack initiation and fatigue crack propagation.

This chapter introduces many of the key concepts on which metallurgy is based. It begins with an overview of the atomic nature of matter and the forces that link atoms together in crystal lattice structures. It discusses the types of imperfections (or defects) that occur in the crystal structure of metals and their role in mechanical deformation, annealing, precipitation, and diffusion. It describes the concept of solid solutions and the effect of temperature on solubility and phase transformations. The chapter also discusses the formation of solidification structures, the use of equilibrium phase diagrams, the role of enthalpy and Gibb’s free energy in chemical reactions, and a method for determining phase compositions along the solidus and liquidus lines.

Annealing, a heat treatment process, is used to soften metals that have been hardened by cold working. This chapter discusses the following three distinct processes that can occur during annealing: recovery, recrystallization, and grain growth. The types of processes that occur during recovery are the annihilation of excess point defects, the rearrangement of dislocations into lower-energy configurations, and the formation of subgrains that grow and interlock into sub-boundaries. The article also discusses the main factors that affect recrystallization. They are temperature and time; degree of cold work; purity of the metal; original grain size; and temperature of deformation. The types of grain growth discussed include normal or continuous grain growth and abnormal or discontinuous grain growth.

Passive components can be broadly divided into capacitors, resistors, and inductors. Failure analysis of these components helps determine the root cause and improve the overall quality and reliability of the electronic systems. This article describes different failure analysis approaches used for these components. It discusses different types of capacitors along with their constructions and failure modes. The types include tantalum, aluminum electrolytic, multi-layered ceramics, film, and super capacitors. The article then provides a discussion on the two common types of inductors, namely, common mode choke coil and surface mount powder choke coil.

Semiconductor memories are superb drivers for process yield and reliability improvement because of their highly structured architecture and use of aggressive layout rules. This combination provides outstanding failure signature analysis possibilities for the entire design, manufacturing, and test process. This article discusses five key disciplines of the signature analysis process that need to be orchestrated within the organization: design for test practices, test floor data collection methodology, post-test data analysis tools, root cause theorization, and physical failure analysis strategies.

Diagnosing the root cause of a failure is particularly challenging if the symptom of the failure is not consistently observable. This article focuses on Laser Assisted Device Alteration/Soft Defect Localization (LADA/SDL), a global fault isolation technique, for detecting such failures. The discussion begins with a section describing the three steps in LADA/SDL analysis setup: create the test loop with the fail flag and loop trigger, select the laser dwell time, and select the shmoo bias point. An overview of LADA/SDL workflow is then presented followed by a brief section on time-resolved LADA. The closing pages of the article consider in detail SDL laser interaction physics and LADA laser interaction physics.

Porosity in aluminum is caused by the precipitation of hydrogen from liquid solution or by shrinkage during solidification, and more usually by a combination of these effects. Nonmetallic inclusions entrained before solidification influence porosity formation and mechanical properties. This chapter describes the causes and control of porosity and inclusions in aluminum castings as well as the combined effects of hydrogen, shrinkage, and inclusions on the properties of aluminum alloys. In addition, it discusses the applications of radiography to reveal internal discontinuities in aluminum.

Post-mortem analysis of photovoltaic modules that have degraded performance is essential for improving the long term durability of solar energy. This article focuses on a general procedure for analyzing a failed module. The procedure includes electrical characterization followed by thermal imaging such as forward bias, reverse bias, and lock-in, and emission imaging such as electroluminescence and photoluminescence imaging.

This chapter provides a short introduction to phase transformations, namely, the liquid-to-solid phase transformations that occur during solidification and the solid-to-solid transformations that are important in processing, such as heat treatment. It also introduces the concept of free energy that governs whether or not a phase transformation is possible, and then the kinetic considerations that determine the rate at which transformations take place. The chapter also describes important solid-state transformations such as spinodal decomposition and martensitic transformation.

This chapter explains the basic terminology and principles of metallurgy as they apply to extrusion. It begins with an overview of crystal structure in metals and alloys, including crystal defects and orientation. This is followed by sections discussing the development of the continuous cast microstructure of aluminum and copper alloys. The discussion provides information on billet and grain segregation and defects in continuous casting. The chapter then discusses the processes involved in the deformation of pure metals and alloys at room temperature. Next, it describes the characteristics of pure metals and alloys at higher temperatures. The processes involved in extrusion are then covered. The chapter provides details on how the toughness and fracture characteristics of metals and alloys affect the extrusion process. The weld seams in hollow profiles, the production of composite profiles, and the processing of composite materials, as well as the extrusion of metal powders, are discussed. The chapter ends with a discussion on the factors that define the extrudability of metallic materials and how these attributes are characterized.

Laser Voltage Probing (LVP) is a key enabling technology that has matured into a well-established and essential analytical optical technique that is crucial for observing and evaluating internal circuit activity. This article begins by providing an overview on LVP history and LVP theory, providing information on electro-optical effects and free-carrier effects. It then focuses on commercially available continuous wave LVP systems. Alternative optoelectronic imaging and probing technologies for fault isolation, namely frequency mapping and laser voltage tracing, are also discussed. The subsequent section provides information on the use of Visible Laser Probing. The article closes with some common LVP observations/considerations and limitations and future work concerning LVP.

This chapter provides a brief review of industry’s battle with fatigue and fracture and what has been learned about the underlying failure mechanisms and their effect on product lifetime and service. It recounts some of the tragic events that led to the discovery of fatigue and brittle fracture and explains how they reshaped design philosophies, procedures, and tools. It also discusses the influence of material and manufacturing defects, operating conditions, stress concentration and intensity, temperature and pressure, and cyclic loading, all of which play a role in the onset of fatigue cracking and thus should be considered when predicting useful product life.