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thermal expansion mismatch

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Series: ASM Technical Books
Publisher: ASM International
Published: 01 July 2009
DOI: 10.31399/asm.tb.fdmht.t52060223
EISBN: 978-1-62708-343-0
... mismatch of tungsten-fiber and nickel-base superalloy matrix. Courtesy of D.W. Petrasek. Source: Ref 9.5 Fig. 9.2 Schematic thermal expansion response of a metal-matrix composite and its constituents. (a) Cold, stress free. (b) Hot (+Δ T ), unbonded. (c) Hot (+Δ T ), bonded Fig. 9.1...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 August 2005
DOI: 10.31399/asm.tb.pb.t51230143
EISBN: 978-1-62708-351-5
... of the braze (950 °C, or 1740 °F), with time. Fig. 4.16 Examples of compliant structures for mitigating mismatch expansivity (α) of the abutting components Fig. 4.17 (a) Longitudinal and (b) transverse sections through a compliant structure that is capable of accommodating a thermal...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 August 2005
DOI: 10.31399/asm.tb.pb.t51230221
EISBN: 978-1-62708-351-5
... (CTE) mismatch, relative to that of the ceramic, on the shear strength of silicon nitride/metal brazed joints. Adapted from Naka, Kubo, and Okamoto [1989] Fig. 7.32 Relationship between coefficient of thermal expansion (CTE) mismatch relative to that of the ceramic and the critical defect...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 April 2004
DOI: 10.31399/asm.tb.ps.t62440145
EISBN: 978-1-62708-352-2
..., on the grounds of thermal degradation, and may restrict the atmosphere in which the joining process can be carried out. When the overall assembly is considered, any mismatch in thermal expansivity of the abutting components can force compromises with regard to the choice of materials and processes. All...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 October 2012
DOI: 10.31399/asm.tb.lmub.t53550569
EISBN: 978-1-62708-307-2
... behavior of a continuous fiber CMC is determined to a large degree by three factors: the strength of the reinforcing fibers, the characteristics of the fiber-matrix interface, and the residual stress present in the composite due to thermal expansion mismatch between fibers and matrix. High-strength fibers...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 March 2002
DOI: 10.31399/asm.tb.stg2.t61280287
EISBN: 978-1-62708-267-9
... to the substrate (MCrAlY bond coat). Thermal stress within the coatings occurs due to a mismatch between the thermal expansion coefficients of the metallic substrate and the coating, and due to transient thermal gradients during rapid thermal cycling. Depending on deposition conditions, the EBPVD technique also...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2003
DOI: 10.31399/asm.tb.cfap.t69780295
EISBN: 978-1-62708-281-5
... temperature, represent a problem in high-performance (high-temperature) thermoplastics such as polysulfone (PSU) or polyetherketone (PEK) because they develop significant thermal stresses on cooling. It is this coefficient of thermal expansion (CTE) mismatch between polymers and fillers, especially...
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 April 2004
DOI: 10.31399/asm.tb.ps.t62440001
EISBN: 978-1-62708-352-2
..., in the case of components to be crimped. The choice of suitable joint configurations is highly dependent on service conditions—for example, whether or not leak tightness is required. Joints may be designed to accommodate thermal expansion mismatch between the components in the assembly. In the extreme case...
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 August 2005
DOI: 10.31399/asm.tb.pb.t51230001
EISBN: 978-1-62708-351-5
... 400 grit 23 0.51 1200 grit 5 0.23 Polishing alumina 0.05 0.012 For comparison, copper surfaces on electronic component leads usually have an orientated R a of approximately 0.1 μm (4 μin.). Typical thermal expansivities of common engineering materials at normal ambient...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 April 2004
DOI: 10.31399/asm.tb.ps.9781627083522
EISBN: 978-1-62708-352-2
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2006
DOI: 10.31399/asm.tb.cw.t51820001
EISBN: 978-1-62708-339-3
... deposit may increase the susceptibility for stress-corrosion cracking (SCC) in the HAZ of the high-strength steel. A 40% thermal expansion mismatch between the austenitic stainless steel and ferritic base metal produces a significant residual stress field in the weldment; this residual stress field also...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 October 2012
DOI: 10.31399/asm.tb.lmub.t53550457
EISBN: 978-1-62708-307-2
... strength, and yield strength, while reducing the thermal expansion and, in some cases, the density of the composite system. Unfortunately, ductility and fracture toughness typically decrease with increasing reinforcement volume. The increase in both the elastic modulus and strength (ultimate and yield...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 August 2005
DOI: 10.31399/asm.tb.pb.9781627083515
EISBN: 978-1-62708-351-5
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2010
DOI: 10.31399/asm.tb.scm.t52870573
EISBN: 978-1-62708-314-0
... atmospheres, along with low densities of 0.054 to 0.072 lb/in. 3 (1.49 to 1.99 g/cm 3 ). Their low thermal expansion and range of thermal conductivities provide high thermal shock resistance. In vacuum and inert gas atmospheres, carbon is an extremely stable material, capable of use to temperatures exceeding...
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 June 2008
DOI: 10.31399/asm.tb.emea.t52240563
EISBN: 978-1-62708-251-8
... and Incoloy 901 are examples, contains at least 40 wt% Ni, as well as higher levels of solid-solution-strengthening and precipitate-forming elements. A third subgroup, based on the Fe-Ni-Co system strengthened by γ′, combines low thermal expansion coefficients and relatively high strength to a temperature...
Series: ASM Technical Books
Publisher: ASM International
Published: 30 April 2021
DOI: 10.31399/asm.tb.tpsfwea.t59300271
EISBN: 978-1-62708-323-2
..., this thermal expansion mismatch must be dealt with. Apparently, hybrid bearings with silicon nitride rolling elements and steel raceways accommodate expansion differences; these bearings are in common use. The other tribological properties of silicon nitride are similar to their competitors. Figure 10.2...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 April 2004
DOI: 10.31399/asm.tb.ps.t62440189
EISBN: 978-1-62708-352-2
... by Coombs [1988 ]. So long as the primary function of solders has been to provide electrical contact, their mechanical weakness could largely be tolerated, although creep and fatigue failure arising from thermal expansion mismatch of abutting components have caused occasional reliability problems...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2001
DOI: 10.31399/asm.tb.aub.t61170573
EISBN: 978-1-62708-297-6
... thermal expansion coefficients two to three times greater than those of carbides. In metalforming applications at elevated temperatures, such as warm forming or extrusion, this difference must be taken into consideration when designing steel/carbide assemblies. This expansion coefficient mismatch also...
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 30 November 2013
DOI: 10.31399/asm.tb.uhcf3.t53630035
EISBN: 978-1-62708-270-9
... of these factors are explored in later sections. First, let us study the basic mechanisms of residual stress formation: thermal, transformational, mechanical, and chemical. Thermal Residual Stresses Thermal residual stresses are caused primarily by differential expansion when a material is heated...
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2001
DOI: 10.31399/asm.tb.aub.t61170003
EISBN: 978-1-62708-297-6
.../oxidation resistance Hardness and wear resistance Physical properties Elastic modulus Magnetic properties Electrical properties Thermal expansion properties Color Room-Temperature Strength Hardenability Fatigue Resistance Creep Resistance Heat Resistance...