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Series: ASM Technical Books
Publisher: ASM International
Published: 01 June 1983
DOI: 10.31399/asm.tb.mlt.t62860075
EISBN: 978-1-62708-348-5
... Abstract Specific heat and thermal expansion are closely related. Following a discussion on thermal expansion theory, methods of measurement techniques are presented along with their advantages and disadvantages. The results of the measurements are then summarized for three classes of materials...
Abstract
Specific heat and thermal expansion are closely related. Following a discussion on thermal expansion theory, methods of measurement techniques are presented along with their advantages and disadvantages. The results of the measurements are then summarized for three classes of materials: metallics, nonmetallics, and composites. Because predicting thermal expansion values for unmeasured or novel materials is useful, the chapter also describes the means of making educated guesses for low-temperature values. A short discussion on how thermal expansion data can be used is followed by a section describing where such data can be found.
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Published: 01 June 1983
Figure 3.4 Typical curves of thermal expansion, L ( T ), and thermal expansion coefficient, α , as a function of temperature.
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Published: 01 June 1983
Figure 3.24 Ratio of the thermal expansion to the thermal expansion coefficient as a function of temperature for copper and aluminum.
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Published: 01 June 1983
Figure 3.25 Deviation of the ratio of thermal expansion to thermal expansion coefficient for various metals and alloys from that of copper as a function of temperature.
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Published: 01 June 1983
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Published: 01 April 2004
Fig. 4.13 Coefficient of thermal expansion (CTE) of Osprey controlled-expansion alloys (based on aluminum-silicon) as a function of the proportion of silicon, in weight percent
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Published: 01 December 2003
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Published: 01 December 2008
Fig. 2.18 The thermal analysis curve (a) and the thermal expansion curve (b) for pure iron A 3 transformation (circled) is an abnormal one progressing in the opposite direction (from “coarse” to “dense”).
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Published: 01 November 2010
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Published: 01 August 2005
Fig. 4.6 General relationship between coefficient of thermal expansion, or CTE (between 273 and 373 K), and melting point for metals, T m . Adapted from Li and Krsulich [1996]
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Published: 01 August 2005
Fig. 4.8 Coefficient of thermal expansion (CTE) of low-carbon steel and iron-nickel alloys as a function of temperature. The low CTE of iron-nickel alloys exists only over a limited range of temperature. Normal expansion behavior is observed above about 400 °C (750 °F).
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Published: 01 August 2005
Fig. 4.9 Coefficient of thermal expansion of liquid-phase sintered tungsten and molybdenum materials as a function of the content of the main braze constituents, namely copper and nickel.
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Published: 01 August 2005
Fig. 4.10 Coefficient of thermal expansion of double-sided copper-clad molybdenum at room temperature as a function of the copper thickness
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Published: 01 August 2005
Fig. 7.31 Effect of coefficient of thermal expansion (CTE) mismatch, relative to that of the ceramic, on the shear strength of silicon nitride/metal brazed joints. Adapted from Naka, Kubo, and Okamoto [1989]
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Published: 01 August 2005
Fig. 7.32 Relationship between coefficient of thermal expansion (CTE) mismatch relative to that of the ceramic and the critical defect size that will cause failure of the ceramic due to imposed stress. Adapted from Akselsen [1992]
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in Obstacles to High-Temperature Structural Durability of Continuous-Fiber Metal-Matrix Composites
> Fatigue and Durability of Metals at High Temperatures
Published: 01 July 2009
Fig. 9.1 Inverse correlation of stiffness and thermal expansion. Source: Data from Appendix A in Ref 9.1
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in Obstacles to High-Temperature Structural Durability of Continuous-Fiber Metal-Matrix Composites
> Fatigue and Durability of Metals at High Temperatures
Published: 01 July 2009
Fig. 9.2 Schematic thermal expansion response of a metal-matrix composite and its constituents. (a) Cold, stress free. (b) Hot (+Δ T ), unbonded. (c) Hot (+Δ T ), bonded
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in Acoustic Microscopy of Semiconductor Packages
> Microelectronics Failure Analysis: Desk Reference
Published: 01 November 2019
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Published: 01 June 1983
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Published: 01 June 1983
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