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Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110485
EISBN: 978-1-62708-247-1
... analysis. I would like to personally thank longtime friends and colleagues Leon Moszkowicz and Randy Wells. Much of the data presented in this chapter was acquired by Leon and Randy, in many instances, industry firsts. Thank you Dr. Jim Slinkman, friend and mentor, for the semiconductor physics...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 June 2016
DOI: 10.31399/asm.tb.hpcspa.t54460185
EISBN: 978-1-62708-285-3
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110219
EISBN: 978-1-62708-247-1
... acknowledge RTI international for providing TSV and Cu/Sn-Cu microbump samples as well as Cu-filled TSV test structures. Many thanks to DCG Systems and Thermo Fisher Scientific for their support on LIT development. Additional work was performed in the project SAM3, where the German partners are funded...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110010
EISBN: 978-1-62708-247-1
... be written and shared. Authors would like to thank George Perreault, Nathan Wang, Carlo Casabuena for their support and contribution. The initial history and data review is time well spent; although it is the most critical step, it is also the most overlooked as engineers often mistakenly rush...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 June 2022
DOI: 10.31399/asm.tb.tstap.t56040055
EISBN: 978-1-62708-428-4
.... Additional requirements may apply based on the available equipment, testing materials, customer requirements, and other criteria. Acknowledgments This document was prepared for publication in 2022 by the ASM Thermal Spray Society Accepted Practices Committee. Special thanks are extended...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110587
EISBN: 978-1-62708-247-1
.... Khomwongthep, K. Oga and P. Lessner. We would also like to thank J. Kaplan of Cornell Dubilier for his help. Tantalum CAPS (Ta-CAPS) typically consist of a porous Ta anode (for high surface area) with a Ta wire attached to it. The dielectric, amorphous Ta 2 O 5 , typically a few tens of nm thick...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110262
EISBN: 978-1-62708-247-1
... with CADNav are proven methodologies that have been developed and fine-tuned over many years to achieve faster FA cycle times, leading to higher product yields, quicker TTM, and ultimately increased profitability. The authors would like to thank Ankush Oberai, Lavakumar Ranganathan, Kun Young Chung, Rupa...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 September 2011
DOI: 10.31399/asm.tb.cfw.t52860007
EISBN: 978-1-62708-338-6
... operations, such as loading and unloading fibers, tying and cutting off fibers, filling resin baths, and so on, are generally in the past. Today’s filament winding has really become high tech and fully automated. Acknowledgments The author would like to thank the following companies for use...
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2008
DOI: 10.31399/asm.tb.ssde.t52310019
EISBN: 978-1-62708-286-0
... an alloy could be passive. In the case of stainless steels, the range of pH and other conditions under which this would occur has been increased thanks to the chromium content, which readily forms a Cr 2 O 3 scale. In general, a passive layer constituted of adsorbed molecules or thin oxide/hydroxide...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110042
EISBN: 978-1-62708-247-1
...; magnification has a secondary effect on resolution but numerical aperture determines the limit to resolution. Special thanks to Michael W. Davidson of the National High Magnetic Field Laboratory at Florida State University for generous permission to use many of the excellent illustrations from...
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2003
DOI: 10.31399/asm.tb.cfap.t69780159
EISBN: 978-1-62708-281-5
... to measure smolder susceptibility and flash-fire propensity. The former is particularly important for soft furnishings, where the classic ignition source is a lighted cigarette. Appropriate tests are described in Ref 5 . Acknowledgment The author would like to thank D. Oates and A. Bertram...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 August 2012
DOI: 10.31399/asm.tb.smfpa.t53500289
EISBN: 978-1-62708-317-1
... by transferring heat from the heated anvil to the components to be joined at the exact moment of clamping between the insulated part of the clamp and the heated anvil ( Ref 14.19 ). In this process, it is only the flat countertool that is heated through a heating cartridge with temperature control. Thanks...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110461
EISBN: 978-1-62708-247-1
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110391
EISBN: 978-1-62708-247-1
... by Terry Jenkins, long since retired from Texas Instruments, Inc. DLOG fab. Additional modifications were done by the late Andy Vance of KFAB, Texas Instruments, Inc. I would like to thank the late Marlin Downey of TI/Raytheon Failure Analysis for teaching me to cross-section those many years ago...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110032
EISBN: 978-1-62708-247-1
... saying “thanks”… Internal to the FA organization, we want to optimize the use of resources, control costs, justify needed capital or personnel additions, and assess the readiness for new technologies. Standards, such as customer requirements on cycle time expectations for analysis of customer returns...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110196
EISBN: 978-1-62708-247-1
... probing methods will continue to be mainstays in IC FA for the foreseeable future and topics for development and improvement. The authors would like to thank Romain Desplats, Phillipe Perdu, Christian Boit, Richard E. Anderson, Daniel L. Barton, Michael R. Bruce, Paiboon Tangyunyong, Jerry M. Soden...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110550
EISBN: 978-1-62708-247-1
... the shortest cycle time. This is especially critical in FA labs supporting key qualifications and milestones in a manufacturing environment. The authors would like to thank Ron Russotti, Frank Palermo, David Benz, Michael Harris, Joe Myers, Dan Bader, Erik McCullen, Greg Tidman, and Thom Hartswick...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110634
EISBN: 978-1-62708-247-1
... methodologies that promise to continue to allow IC manufacturers to supply correct, robus and reliable products to the marketplace. The authors wish to thank Wojciech Maly for providing the motivation for exploring many of these technical issues. We would also like to acknowledge Brian Kessler for providing...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110643
EISBN: 978-1-62708-247-1
... registers in test mode, so that the logic values of a circuit’s internal nodes can be shifted off-chip to allow deduction of any defective logic gates. Inserting a scan path requires adding multiplexers in most logic paths – the added delay is usually insignificant (or zero) thanks to automated logic...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110652
EISBN: 978-1-62708-247-1
... like to extend special thanks to the authors of the original 1994 paper and to the rest of the engineering and technician staff. A lot has happened since then, but they were part of an original team trying to establish a clear distinction between ESD and EOS. It has been shown...