This article describes the most common, general-purpose analog design-for-test (DFT) methods, analog test buses and loopback, and shows their advantages and limitations in diagnosability and automatability. It also describes DFT and built-in self-test (BIST) techniques for the most common analog functions, namely phase-locked loop, serializer-deserializer, analog/digital converters, and radio frequency. Lastly, the challenges of creating BIST for analog functions are summarized, along with seven principles that must be exploited to meet these challenges. These principles show how the design constraints for analog BIST circuitry can be more relaxed than for the circuit under test, while delivering the required test accuracy and speed.

This chapter introduces the basic concepts of mechanical design and its general relation with the properties derived from tensile testing. It begins with a description of the basic objective of product design. Next, a simple tie bar is used to illustrate the application of mechanical property data to material selection and design and to highlight the general implications for mechanical testing. Material subjected to the basic stress conditions is considered to establish design approaches and mechanical test methods, first in static loading and then in dynamic loading and aggressive environments. The chapter then briefly describes design criteria for some basic property combinations such as strength, weight, and costs as well as stiffness in tension. Additionally, it describes the processes involved in mechanical testing for stress at failure and elastic modulus. Finally, the chapter examines the correlation between hardness and strength.

The necessity of developing the lightest-weight structures with sufficient strength was the driving factor for the development of filament-wound composite pressure vessels. This chapter presents a brief history of the development of rocket motor cases (RMCs), followed by a comparison of the advantages of composites over metals for RMCs. A discussion on a typical design, analysis, and manufacturing operation follows. The chapter introduces the basic design approach and shows some sizing techniques along with example calculations. It discusses the processes involved in the testing of the composite pressure vessel.

Semiconductor memories are superb drivers for process yield and reliability improvement because of their highly structured architecture and use of aggressive layout rules. This combination provides outstanding failure signature analysis possibilities for the entire design, manufacturing, and test process. This article discusses five key disciplines of the signature analysis process that need to be orchestrated within the organization: design for test practices, test floor data collection methodology, post-test data analysis tools, root cause theorization, and physical failure analysis strategies.

This chapter is a brief account of various factors pertinent to the development of an engineering component. The discussion covers the disciplines and interactions of design development, engineering of component design, validation of design and process analysis, and matrix of design and manufacturing elements.

This chapter presents an overview of microprocessor and application specific integrated circuit (IC) testing. It begins with a description of key industry trends that will impact how ICs will be tested in the future. Next, it provides a brief description of the most common tests applied in the IC industry, where technical issues that are causing methodology changes are emphasized. These include functional testing, structural testing, scan-based delay testing, built-in self-testing, memory testing, analog circuit testing, system-on-a-chip testing, and reliability testing. Trends discussed have driven the development of novel focus areas in test and the chapter discusses several of those areas, including test data volume containment, test power containment, and novel methods of defect-based test.

A typical mobile processor die may contain, among other things, a variety of high-performance as well as low-power processing cores along with 5G modems, Wi-Fi modules, image processors, GPUs, and security modules, with a total transistor count exceeding 10 billion. Such designs pose many challenges for yield ramp and diagnostics. This chapter examines these challenges and the growing demand for innovative solutions to help failure analysts quickly and accurately isolate faults. It also assesses the capabilities and future potential of ATPG scan diagnostics, streaming scan networks, and advanced fault models for diagnosing embedded memory.

This chapter sheds light on the challenges involved in diagnosing faults in analog, mixed-signal, and RF circuits. It describes some of the work being done to leverage the benefits of standardization, improve fault simulation tools, and overcome limitations on optical fault isolation techniques. One of the solutions being considered is to integrate LEDs throughout the analog circuit, thereby using light to report the status of internal signals.

Gearbox vibrations can often be dealt with in the field by modifying, replacing, and repositioning components and adjusting operating conditions and control parameters. Every gearbox design, however, eventually reaches a point where problems due to vibration are not so easily addressed. This chapter discusses such a case, that of an epicyclic reducer plagued by subsynchronous vibration, and explains how the gearbox was redesigned, improving lifetime as well as efficiency.

This chapter provides an overview of how the disciplines of design, material, and manufacturing contribute to engineering for functional performance. It describes the interaction of product designers and casting engineers in product development. It discusses the consequences of component failure, uncertainty in data and assumptions, and selection of the factor of safety. The chapter also presents an overview of the functional requirements for product performance and provides an overview of product design development. It also presents a partial list of the different tests that are performed on prototypes and examples of product testing. The chapter describes the requirements of a traceability system.

This chapter is a detailed account of various factors pertinent to the development and launch of a product. It begins by describing the five phases in the product launch process, namely product design and development, process design and development, product and process validation, product launch, and continuous improvement. This is followed by sections covering product-process flow diagrams and also the process elements considered for process failure mode and effects analysis. Some of the aspects covered by the engineering specifications to meet the product performance requirements are then reviewed. Details on product validation requirements and definitions of parameters related to the launch process are also provided. The chapter discusses the purpose of manufacturing control plan, along with an illustration of a manufacturing control plan outlined for a safety-critical suspension casting. It ends with an overview of the contents of a program launch manual.

This chapter provides a brief but practical overview of the case carburizing process. It discusses the benefits and challenges of the process and compares and contrasts it with other hardening methods. It explains how design allowables and safety factors compensate for unknowns and familiarizes readers with the steps involved in determining case depth and verifying that case carbon requirements have been met.

The tensile test provides a relatively easy, inexpensive technique for developing mechanical property data for the selection, qualification, and utilization of metals and alloys in engineering service. The tensile test requires interpretation, and interpretation requires a knowledge of the factors that influence the test results. This chapter provides a metallurgical perspective for such interpretation. The topics covered include elastic behavior, anelasticity, damping, proportional limit, yield point, ultimate strength, toughness, ductility, strain hardening, and yielding and the onset of plasticity. The chapter describes the effects of grain size on yielding, effect of cold work on hardness and strength, and effects of temperature and strain-rate on the properties of metals and alloys. It provides information on true stress-strain relationships and special tests developed to measure the effects of test/specimen conditions. Finally, the chapter covers the characterization of tensile fractures of ductile metals and alloys.

This chapter details low-temperature test procedures and equipment. It discusses the role temperature plays in the properties of typical engineering materials. The effect that lowering the temperature of a solid has on the mechanical properties of a material is summarized for three principal groups of engineering materials: metals, ceramics, and polymers (including fiber-reinforced polymers). The chapter describes the factors that influence the selection of tensile testing procedures for low-temperature evaluation, along with a comparison of tensile and compression tests. It covers the parameters and standards related to low-temperature tensile testing. The chapter discusses the factors involved in controlling test temperature. Finally, the chapter discusses the safety issues concerning the use of cooled methanol, liquid-nitrogen, and liquid helium.

In this overview of diagnosis of scan logic and diagnosis driven failure analysis, the authors explore the world of diagnosis of digital semiconductors devices. After shortly outlining the technology behind diagnosis, the main part of this article describes key improvements to the basic diagnosis tools, discussing their merits for the failure analysis engineer. The article also describes the various requirements and other considerations that typically need to be taken into account to set up a full working scan diagnosis system. It summarizes the principles of design with embedded compression technologies. Finally, several successful industrial applications of diagnosis are presented.

This chapter discusses the stress-strain response of materials, how it is measured, and how it used to set performance expectations. It begins by describing the common tensile test and how it sheds light on the elastic design of structures as well as plasticity and fracture behaviors. It explains how engineering and true stress-strain curves differ, how one is used for design and the other for analyzing metal forming operations. It discusses the effect of holes, fillets, and radii on the distribution of stresses and the use of notch tensile testing to detect metallurgical embrittlement. The chapter also covers compression, shear, and torsion testing, the prediction of yielding, residual stress, and hardness.

A pair of bolts on a connecting rod failed during a test run for a prototype engine. They were replaced by bolts made from a stronger material that also failed, one due to fatigue, the other by tensile overload. The fracture surfaces on all four bolts were examined using optical and electron microscopes, indicating that the operating loads on the bolts far exceeded the design loads. Based on their observations, which are summarized in the report, failure analysts concluded that the design of the connecting rod system needs to be reassessed.