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Published: 01 November 2023
Fig. 1 Technology scaling trends until 2028 ( Ref 9 ). More-Moore Technology scaling roadmap, with lateral gate all-arounds (LGAA) predicted to be introduced in 2022 (node 3 nm), and complimentary field-effect transistor (CFET) in 2028 (node 1.5 nm). Copyright 2022 IEEE, Ref 9 More
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Published: 01 November 2023
Fig. 2 (a) Spatial resolution requirements with technology scaling trends until 2028. The required resolution (in blue) appears to flatten out at about 100 nm. The available microscope resolution (in green) tracks the required resolution well. With visible probing, the spatial resolution More
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110335
EISBN: 978-1-62708-247-1
... and their implementation challenges and application trends. focused ion beam gallium microelectronics failure analysis Introduction This chapter updates the FIB overview counterpart in the 6 th edition, which gives a comprehensive introduction to gallium focused ion beam (FIB) technology and its use...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110351
EISBN: 978-1-62708-247-1
... milling, endpointing, and cutting copper. It then provides an introduction to FIB metal/conductor deposition and FIB dielectric deposition. Edit design rules that can facilitate prototype production from first silicon are also provided. The chapter concludes with a discussion on future trends in circuit...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110634
EISBN: 978-1-62708-247-1
... by today’s technologies. Test-Related Trends The majority of this chapter is aimed at providing an overview of the test methods commonly used in the industry today. It is important, however, not only to understand where the industry is today, but also where it is heading. In this section, we highlight...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 March 2000
DOI: 10.31399/asm.tb.aet.t68260245
EISBN: 978-1-62708-336-2
... innovations. The major trend of research is in the advancement of productivity and quality. To satisfy these two areas, technology is advancing toward the development of more controls in press equipment to finally control the exit temperature and speed to optimize production. Technology is also advancing...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2023
DOI: 10.31399/asm.tb.edfatr.t56090003
EISBN: 978-1-62708-462-8
...). Technology Scaling Trends—More Moore The technology scaling trends for the next five years are shown in Fig. 1 . Many of the EFI techniques in use today were developed for analysis of planar transistors with flip-chip packaging or with packaging such that the silicon substrate is exposed. Technology...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 August 2013
DOI: 10.31399/asm.tb.ahsssta.t53700159
EISBN: 978-1-62708-279-2
... on the utilization and trends of AHSS in vehicle bodies and closures. advanced high-strength steels vehicle components ADVANCED HIGH-STRENGTH STEELS (AHSS) are best used for strong structural applications where light weighting enhances the performance of a product. In addition to the automotive industry...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2023
DOI: 10.31399/asm.tb.edfatr.t56090131
EISBN: 978-1-62708-462-8
.... The packaging technology trends of 3D stacking and disintegration, where there are numerous chips on one package, are both complex heterogeneous integration schemes not possible with monolithic designs. The resulting packages lead to numerous FA challenges due to the need for isolation of defects in the Z-axis...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110025
EISBN: 978-1-62708-247-1
... and electrical measurements were able to find most board related defects on these technologies and additional component analysis can be done in a separate failure analysis flow. Figure 1 Trend overview for semiconductor packaging integration on board and system level. [2] In present system...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110062
EISBN: 978-1-62708-247-1
... defects that are commonly imaged with 3D X-ray Microscopy tools [13] . With respect to future technologies and packaging trends, high density multi-chip packages, such as multi-chip modules (MCM) and 2.5/3D packages, are consistently emerging as an alternative to pure silicon scaling...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 June 2022
DOI: 10.31399/asm.tb.tstap.t56040001
EISBN: 978-1-62708-428-4
... Abstract This article provides a high-level overview of thermal spray technologies and their applications and benefits. It is intended to educate members of government, industry, and academia to the benefits of thermal spray technology. The article describes the value of thermal spray...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2023
DOI: 10.31399/asm.tb.edfatr.9781627084628
EISBN: 978-1-62708-462-8
Series: ASM Technical Books
Publisher: ASM International
Published: 01 March 2000
DOI: 10.31399/asm.tb.aet.t68260119
EISBN: 978-1-62708-336-2
... for the beginner in the aluminum extrusion technology. Billet quality directly controls or may affect extrusion productivity and quality. The profitability of the extrusion is derived from the cost of the billet. The cost of casting and the quality of the billet are two very important considerations...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2000
DOI: 10.31399/asm.tb.ttg2.t61120131
EISBN: 978-1-62708-269-3
... user planning to employ titanium should know what can be possible with this metal system. The advanced materials and technologies mentioned in this chapter, for the most part, owe their current status to the support of the United States government. Many initial titanium metallurgy concepts were brought...
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2004
DOI: 10.31399/asm.tb.aacppa.t51140001
EISBN: 978-1-62708-335-5
... 2880 1306 associated with transverse property limitations. 1995 2990 1356 1996 3260 1479 1.4 Major Trends In uencing 1997 3380 1533 Increased Use of Aluminum Castings 1998 3490 1583 1999 3550 1610 1.4.1 Technology 2000 3640 1651 The importance of improved energy efficiency in recent decades 2001 3800...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 February 2005
DOI: 10.31399/asm.tb.chffa.t51040319
EISBN: 978-1-62708-300-3
... in order to produce precise components. Some of these developments and future trends are discussed in the subsequent sections. 23.3 Advances in Tool Design In order to produce precision-forged parts, factors related to the tooling, namely, elastic deflection, eccentricity, thermal expansion, etc...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2023
DOI: 10.31399/asm.tb.edfatr.t56090109
EISBN: 978-1-62708-462-8
... to the chip CAD interface. Scanning Probe Microscopy The industry trend of device scaling in front-end processes has given rise to the challenges of 3D mapping of active dopant distributions in fine sub-10 nm devices where traditional technology CAD (TCAD) diffusion models are no longer valid. Dopant...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110673
EISBN: 978-1-62708-247-1
... areas of education and training that should be given to the analyst for him or her to be successful developing and fielding modern semiconductor components: analysis process, technology, and technique training. failure analyst product failure analysis semiconductor components training...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 June 2010
DOI: 10.31399/asm.tb.hss.t52790251
EISBN: 978-1-62708-356-0
..., Present and Future—With Suggestions as to Future Trend , Proceedings , American Society for Testing Materials , Vol 24 , 1924 , p 193 – 207 Arnold W. , Vertically Challenged in Malaysia , New York Times , New York, N.Y. , March 8 , 2003 Barraclough K.C. , Sheffield...