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technology
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in Laser-Based, Photon, and Thermal Emission
> Electronic Device Failure Analysis Technology Roadmap
Published: 01 November 2023
Fig. 1 Technology scaling trends until 2028 ( Ref 9 ). More-Moore Technology scaling roadmap, with lateral gate all-arounds (LGAA) predicted to be introduced in 2022 (node 3 nm), and complimentary field-effect transistor (CFET) in 2028 (node 1.5 nm). Copyright 2022 IEEE, Ref 9
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Series: ASM Technical Books
Publisher: ASM International
Published: 01 September 2011
DOI: 10.31399/asm.tb.cfw.t52860081
EISBN: 978-1-62708-338-6
... Abstract The technology of fabricating composite hardware and structures by filament winding has evolved empirically through the development and manufacturing of specific components. This chapter reviews areas of technology used in building composite parts and discusses the processes from which...
Abstract
The technology of fabricating composite hardware and structures by filament winding has evolved empirically through the development and manufacturing of specific components. This chapter reviews areas of technology used in building composite parts and discusses the processes from which the current technology was derived. The discussion covers quality control requirements for composite fabrication technology and cleanliness standards in the workplace. It describes technology developed for specific components, including satellites struts, aircraft hydraulic cylinders, drill pipe, drive shafts, couplings, and cryogenic tubing.
Series: ASM Technical Books
Publisher: ASM International
Published: 01 March 2000
DOI: 10.31399/asm.tb.aet.9781627083362
EISBN: 978-1-62708-336-2
Book Chapter
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2018
DOI: 10.31399/asm.tb.fibtca.t52430001
EISBN: 978-1-62708-253-2
.... The carried particles are continuously captured by a cyclone installed in the outlet of the combustor and sent back to the bottom part of the combustor to combust unburned particles. This helps to ensure full combustion. A pressurized fluidized bed combustion (PFBC) boiler is a variation of FBC technology...
Abstract
Boilers are engineered systems designed to convert the chemical energy in fuel into heat to generate hot water or steam. This chapter describes boiler applications and types, including firetube boilers, watertube boilers, electric boilers, packaged boilers, fluidized bed combustion boilers, oil- and gas-fired boilers, waste heat boilers, and black liquor recovery boilers. It also describes the operation and working principle of utility or power plant boilers, covering conventional subcritical and advanced supercritical types.
Book Chapter
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2000
DOI: 10.31399/asm.tb.ttg2.t61120065
EISBN: 978-1-62708-269-3
... requirements could be encountered by designers planning to use titanium and its alloys. This situation is not restricted to titanium but is characteristic of the more technologically sophisticated alloys used in high-performance applications. Joint Design Criteria and Limitations Designers of titanium...
Abstract
This chapter covers the welding characteristics of titanium along with the factors that determine which welding method is most appropriate for a given application. It discusses the joinability of titanium alloys, the effect of heat on microstructure, the cause of various defects, and the need for contaminant-free surfaces and atmospheres. It describes common forms of fusion, arc, and solid-state welding along with the use of filler metals, shielding gases, and stress-relief treatments. It also discusses the practice of titanium brazing and the role of filler metals.
Book Chapter
Series: ASM Technical Books
Publisher: ASM International
Published: 01 March 2002
DOI: 10.31399/asm.tb.stg2.t61280149
EISBN: 978-1-62708-267-9
... technologically sophisticated alloys used in high-performance applications. Most superalloy primary users, such as the gas turbine manufacturers, have specifications related not only to production welding, but also to repair and refurbishment of superalloys. Repair and refurbishment have become increasingly...
Abstract
Superalloys, except those with high aluminum and titanium contents, are welded with little difficulty. They can also be successfully brazed. This chapter describes the welding and brazing processes most often used and the factors that must be considered when making application decisions. It discusses the basic concepts of fusion welding and the differences between solid-solution-hardened and precipitation-hardened wrought superalloys. It addresses joint integrity, design, weld-related cracking, and the effect of grain size, precipitates, and contaminants. It covers common fusion welding techniques, defect prevention, fixturing, heat treatments, and general practices, including the use of filler metals. It also discusses several solid-state welding methods, superplastic forming, and transient liquid phase bonding, a type of diffusion welding process. The chapter includes extensive information on brazing processes, atmospheres, filler metals, and surface preparation procedures. It also includes examples of nickel-base welded components for aerospace use.
Series: ASM Technical Books
Publisher: ASM International
Published: 01 August 2013
DOI: 10.31399/asm.tb.ahsssta.9781627082792
EISBN: 978-1-62708-279-2
Series: ASM Technical Books
Publisher: ASM International
Published: 01 June 2022
DOI: 10.31399/asm.tb.tstap.t56040001
EISBN: 978-1-62708-428-4
... Abstract This article provides a high-level overview of thermal spray technologies and their applications and benefits. It is intended to educate members of government, industry, and academia to the benefits of thermal spray technology. The article describes the value of thermal spray...
Abstract
This article provides a high-level overview of thermal spray technologies and their applications and benefits. It is intended to educate members of government, industry, and academia to the benefits of thermal spray technology. The article describes the value of thermal spray technology with examples of application success stories. A few applications critical to thermal spray and market growth are briefly discussed. The article also summarizes the key research areas in thermal spray technology.
Series: ASM Technical Books
Publisher: ASM International
Published: 01 June 2022
DOI: 10.31399/asm.tb.tstap.t56040020
EISBN: 978-1-62708-428-4
... spray markets and applications, and process robustness, reliability, and economics. thermal spray markets thermal spraying Introduction and Background Thermal spray is regarded as a key surface engineering technology that underpins the competitiveness of critical manufacturing...
Abstract
This article summarizes the results of work completed by the ASM Thermal Spray Society Advisory Committee to identify key research challenges and opportunities in the thermal spray field. It describes and prioritizes research priorities related to emerging process methods, thermal spray markets and applications, and process robustness, reliability, and economics.
Series: ASM Technical Books
Publisher: ASM International
Published: 01 June 2022
DOI: 10.31399/asm.tb.tstap.9781627084284
EISBN: 978-1-62708-428-4
Book Chapter
Book: Principles of Soldering
Series: ASM Technical Books
Publisher: ASM International
Published: 01 April 2004
DOI: 10.31399/asm.tb.ps.t62440189
EISBN: 978-1-62708-352-2
... Abstract This chapter presents several materials and processes related to soldering technology. It first provides information on lead-free solders, followed by sections devoted to flip-chip processes, diffusion soldering, and modeling. Scanning acoustic microscopy and fine-focus x-ray...
Abstract
This chapter presents several materials and processes related to soldering technology. It first provides information on lead-free solders, followed by sections devoted to flip-chip processes, diffusion soldering, and modeling. Scanning acoustic microscopy and fine-focus x-ray techniques are also discussed. The chapter describes several evaluation procedures and tests developed to measure solderability and standards for process calibration. The chapter also describes the characteristics of reinforced solders, amalgams used as solders, and other strategies to boost the strength of solders. Further, the chapter considers methods for quantifying the mechanical integrity of joints and predicting their dimensional stability under specified environmental conditions. It discusses the effects of rare earth elements on the properties of solders. The chapter concludes with information on advanced joint characterization techniques.
Series: ASM Technical Books
Publisher: ASM International
Published: 31 October 2024
DOI: 10.31399/asm.tb.ahsssta2.9781627084826
EISBN: 978-1-62708-482-6
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2023
DOI: 10.31399/asm.tb.edfatr.9781627084628
EISBN: 978-1-62708-462-8
Series: ASM Technical Books
Publisher: ASM International
Published: 30 June 2023
DOI: 10.31399/asm.tb.atia.9781627084277
EISBN: 978-1-62708-427-7
Book Chapter
Series: ASM Technical Books
Publisher: ASM International
Published: 31 December 2024
DOI: 10.31399/asm.tb.hisppa.t56110079
EISBN: 978-1-62708-483-3
... Abstract This chapter explains the fundamentals of soldering technology and provides an overview of the soldering process. It discusses the wetting of the molten solder filler metal to the base material surface and the design aspects when induction heating is used to make the solder joint...
Image
Published: 01 August 2005
Fig. 1.25 Examples of foil strip produced by rapid-solidification casting technology. Source: Fleetwood et al. [1988]
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Image
in Photon Emission in Silicon Based Integrated Circuits
> Microelectronics Failure Analysis: Desk Reference
Published: 01 November 2019
Figure 13 Illustration of technology node and device pitch.
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Image
in Photon Emission in Silicon Based Integrated Circuits
> Microelectronics Failure Analysis: Desk Reference
Published: 01 November 2019
Figure 17 Photon emission spectra of MOSFETs from different technology nodes under nominal conditions [13] .
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Image
in Role of Advanced Circuit Edit for First Silicon Debug
> Microelectronics Failure Analysis: Desk Reference
Published: 01 November 2019
Figure 18 Histogram of the deposition data from analysis of 4 process technology nodes (180nm, 65nm, 45nm, 28nm). [28]
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