1-20 of 2384 Search Results for

technology

Follow your search
Access your saved searches in your account

Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Image
Published: 01 November 2023
Fig. 1 Technology scaling trends until 2028 ( Ref 9 ). More-Moore Technology scaling roadmap, with lateral gate all-arounds (LGAA) predicted to be introduced in 2022 (node 3 nm), and complimentary field-effect transistor (CFET) in 2028 (node 1.5 nm). Copyright 2022 IEEE, Ref 9 More
Series: ASM Technical Books
Publisher: ASM International
Published: 01 September 2011
DOI: 10.31399/asm.tb.cfw.t52860081
EISBN: 978-1-62708-338-6
... Abstract The technology of fabricating composite hardware and structures by filament winding has evolved empirically through the development and manufacturing of specific components. This chapter reviews areas of technology used in building composite parts and discusses the processes from which...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 March 2000
DOI: 10.31399/asm.tb.aet.9781627083362
EISBN: 978-1-62708-336-2
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2018
DOI: 10.31399/asm.tb.fibtca.t52430001
EISBN: 978-1-62708-253-2
.... The carried particles are continuously captured by a cyclone installed in the outlet of the combustor and sent back to the bottom part of the combustor to combust unburned particles. This helps to ensure full combustion. A pressurized fluidized bed combustion (PFBC) boiler is a variation of FBC technology...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2000
DOI: 10.31399/asm.tb.ttg2.t61120065
EISBN: 978-1-62708-269-3
... requirements could be encountered by designers planning to use titanium and its alloys. This situation is not restricted to titanium but is characteristic of the more technologically sophisticated alloys used in high-performance applications. Joint Design Criteria and Limitations Designers of titanium...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 March 2002
DOI: 10.31399/asm.tb.stg2.t61280149
EISBN: 978-1-62708-267-9
... technologically sophisticated alloys used in high-performance applications. Most superalloy primary users, such as the gas turbine manufacturers, have specifications related not only to production welding, but also to repair and refurbishment of superalloys. Repair and refurbishment have become increasingly...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 August 2013
DOI: 10.31399/asm.tb.ahsssta.9781627082792
EISBN: 978-1-62708-279-2
Series: ASM Technical Books
Publisher: ASM International
Published: 01 June 2022
DOI: 10.31399/asm.tb.tstap.t56040001
EISBN: 978-1-62708-428-4
... Abstract This article provides a high-level overview of thermal spray technologies and their applications and benefits. It is intended to educate members of government, industry, and academia to the benefits of thermal spray technology. The article describes the value of thermal spray...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 June 2022
DOI: 10.31399/asm.tb.tstap.t56040020
EISBN: 978-1-62708-428-4
... spray markets and applications, and process robustness, reliability, and economics. thermal spray markets thermal spraying Introduction and Background Thermal spray is regarded as a key surface engineering technology that underpins the competitiveness of critical manufacturing...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 June 2022
DOI: 10.31399/asm.tb.tstap.9781627084284
EISBN: 978-1-62708-428-4
Series: ASM Technical Books
Publisher: ASM International
Published: 01 April 2004
DOI: 10.31399/asm.tb.ps.t62440189
EISBN: 978-1-62708-352-2
... Abstract This chapter presents several materials and processes related to soldering technology. It first provides information on lead-free solders, followed by sections devoted to flip-chip processes, diffusion soldering, and modeling. Scanning acoustic microscopy and fine-focus x-ray...
Series: ASM Technical Books
Publisher: ASM International
Published: 31 October 2024
DOI: 10.31399/asm.tb.ahsssta2.9781627084826
EISBN: 978-1-62708-482-6
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2023
DOI: 10.31399/asm.tb.edfatr.9781627084628
EISBN: 978-1-62708-462-8
Series: ASM Technical Books
Publisher: ASM International
Published: 30 June 2023
DOI: 10.31399/asm.tb.atia.9781627084277
EISBN: 978-1-62708-427-7
Series: ASM Technical Books
Publisher: ASM International
Published: 31 December 2024
DOI: 10.31399/asm.tb.hisppa.t56110079
EISBN: 978-1-62708-483-3
... Abstract This chapter explains the fundamentals of soldering technology and provides an overview of the soldering process. It discusses the wetting of the molten solder filler metal to the base material surface and the design aspects when induction heating is used to make the solder joint...
Image
Published: 01 August 2005
Fig. 1.25 Examples of foil strip produced by rapid-solidification casting technology. Source: Fleetwood et al. [1988] More
Image
Published: 01 November 2019
Figure 13 Illustration of technology node and device pitch. More
Image
Published: 01 November 2019
Figure 17 Photon emission spectra of MOSFETs from different technology nodes under nominal conditions [13] . More
Image
Published: 01 November 2019
Figure 1 Shrinking technology nodes increase FA cycle time More
Image
Published: 01 November 2019
Figure 18 Histogram of the deposition data from analysis of 4 process technology nodes (180nm, 65nm, 45nm, 28nm). [28] More