This chapter describes some common pitfalls encountered in failure investigations and provides guidance to help engineers recognize processes and “quick fixes” that companies often try to substitute for failure analysis. It discusses three important skills and characteristics that a professional engineer must improve to conduct an effective and successful failure investigation, namely technical skills, communication skills, and technical integrity. The chapter also provides information on the additional basic tools available for failure investigation and root cause determination: the Kepner-Tregoe structured problem-solving method, PROACT software for root cause analysis developed by the Reliability Center, Inc., and other processes and methods developed by the Failsafe Network, Inc., and Shainin LLC.

This chapter discusses the development of aluminum, its industry growth, and its modern uses in manufacturing. It begins with the biography of Charles Martin Hall, who invented the process for reducing aluminum from its ore. The evolution of aluminum production from the Pittsburgh Reduction Company to a pilot plant on Smallman Street in Pittsburgh, to a production plant in New Kensington, and to Niagara Falls, New York, is then described. This is followed by a discussion on early aluminum applications and the usage of lower-cost raw materials. The chapter provides information on aluminum production process integrated by Aluminum Company of America (Alcoa) and the numerous technical problems and solutions related to Alcoa's research from World War I to World War II. The aerospace applications for aluminum alloys are also presented. The chapter concludes with a section on aluminum alloys developed by Alcoa.

This chapter presents an overview of microprocessor and application specific integrated circuit (IC) testing. It begins with a description of key industry trends that will impact how ICs will be tested in the future. Next, it provides a brief description of the most common tests applied in the IC industry, where technical issues that are causing methodology changes are emphasized. These include functional testing, structural testing, scan-based delay testing, built-in self-testing, memory testing, analog circuit testing, system-on-a-chip testing, and reliability testing. Trends discussed have driven the development of novel focus areas in test and the chapter discusses several of those areas, including test data volume containment, test power containment, and novel methods of defect-based test.

The aim of every extrusion plant is the efficient production of competitive products that meet the appropriate quality requirements. This chapter discusses the processes involved in the selection and introduction of a quality management system, along with its application, advantages, and disadvantages. It describes the process chain for order processing within the quality circle and provides information on product liability legal issues. In addition, the chapter discusses the processes involved in quality control, along with its organization, responsibilities, audits, and testing.

Laser Voltage Probing (LVP) is a key enabling technology that has matured into a well-established and essential analytical optical technique that is crucial for observing and evaluating internal circuit activity. This article begins by providing an overview on LVP history and LVP theory, providing information on electro-optical effects and free-carrier effects. It then focuses on commercially available continuous wave LVP systems. Alternative optoelectronic imaging and probing technologies for fault isolation, namely frequency mapping and laser voltage tracing, are also discussed. The subsequent section provides information on the use of Visible Laser Probing. The article closes with some common LVP observations/considerations and limitations and future work concerning LVP.

The management of a failure analysis (FA) laboratory requires a broad range of activities to optimize the efficiency of the operation. The purpose of this article is to stimulate readers to consider the various aspects of FA laboratory operations and their respective business management requirements. The various aspects include: staffing, laboratory organization, lab design and operations, strategic development, financial management, and metrics and measurements. References for further reading and examples of resource materials are also included.

Transistors are the most important active structure of any semiconductor component. Performance characteristics of such devices within the specifications are key to ensuring proper functionality and long-term reliability of the product. In this article, a summary of the semiconductor technology from design to manufacturing and the characterization methods are discussed. The focus is on two prominent MOS structures: planar MOS device and FinFET device. The article covers the device parameters and device properties that determine the design criteria and the device tuning procedures. The discussion includes the effects of drain induced barrier lowering, velocity saturation, hot carrier degradation, and short channel on these devices.

This chapter provides information on comparative attributes of sand molds and metal molds for aluminum casting. The cooling rates and microstructures obtained with each mold type are discussed. In addition, the chapter explains why sand castings work successfully in certain applications.

In dynamic hardness tests, the test force is applied to the defined indenter in an accelerated way (with a high application rate). Dynamic test methods relate hardness to the elastic response of a material, whereas the classical static indentation tests determine hardness in terms of plastic behavior. This chapter describes of the most important and widespread dynamic hardness testing methods. These tests fall into two categories: methods in which the deformation is measured and methods in which the energy is measured. Methods that measure deformation include the Poldi hammer method, the shearing force method, the Baumann hammer method, and the Dynatest method. Methods that measure energy include the Shore method, the Leeb method, and the Nitronic method. The chapter concludes with a discussion of applications of dynamic hardness testing.

Since the introduction of chip scale packages (CSPs) in the early 90s, they have continuously increased their market share due to their advantages of small form factor, cost effectiveness and PCB optimization. The reduced package size brings challenges in performing failure analysis. This article provides an overview of CSPs and their classification as well as their advantages and applications, and reveals some of the challenges in performing failure analysis on CSPs, particularly for CSPs in special package configurations such as stacked die multi-chip-packages (MCPs) and wafer level CSPs (WLCSPs). The discussion covers special requirements of CSPs such as precision decapsulation for fine ball grid array packages, accessing the failing die for MCP packages, and careful handling for WLCSP. Solutions and best practices are shared on how to overcome these challenges. The article also presents a few case studies to demonstrate how failure analysis work on CSPs can be successfully completed.

Designs and materials continue to become more complex, with novel technologies developed to create them, and novel instruments invented to analyze them. Engineers at all stages of the design and manufacturing process should appreciate the reasons why formal failure analysis is performed. This chapter describes why failure analysis is conducted and outlines the responsibilities of the failure analyst.

This article presents six case studies of failures with steel forgings. The case studies covered are crankshaft underfill; tube bending; spade bit; trim tear; upset forging; and avoidance of flow through, lap, and crack. The case studies illustrate difficulties encountered in either cold forging or hot forging in terms of preforge factors and/or discontinuities generated by the forging process. Supporting topics that are discussed in the case studies include validity checks for buster and blocker design, lubrication and wear, mechanical surface phenomenon, forging process design, and forging tolerances. Wear, plastic deformation processes, and laws of friction are introduced as a group of subjects that have been considered in the case studies.

This chapter discusses the advantages and disadvantages of sandwich and integral cocured structures, and the methods by which they are made. It begins by explaining where and how sandwich construction is used and why it is so efficient. It then describes the design and fabrication of honeycomb panels and foam cores along with their respective applications and unique attributes. The chapter also discusses the cocuring process and its use in fabricating unitized structures.

Hot isostatic pressing (HIP) is a process refinement available to address internal porosity in castings. The HIP process may be used, in particular, for applications requiring very high quality and performance. This chapter discusses the principles, advantages, and disadvantages of HIP. It describes the effect of HIP on tensile properties and on the fatigue performance of aluminum alloy castings. In addition, the chapter discusses the processes involved in radiographic inspection of HIP-processed castings.

This chapter is an account of the various events that led to the decline of the integrated steel industry during the 1950s. These include the steel strike of 1959, the improvements in technology and increase in imports since 1950s, widespread closures of steel companies, the decline of the minimill industry, and the rapid growth of Mittal Steel.

This appendix identifies producers, suppliers, and service providers experienced with superalloy materials and applications. It also identifies potential sources of engineering information and property data.

This chapter focuses on key requirements for obtaining third-generation advanced high-strength steels (AHSS). The discussion covers the microstructure design for AHSS, novel AHSS processing routes, the development of nanostructured AHSS, and the development of third-generation AHSS by the Integrated Computational Materials Engineering approach.

Corrosion can be defined as a chemical or electrochemical reaction between a material, usually a metal, and its environment that produces a deterioration of the material and its properties. This chapter describes the effects and economic impact of corrosion in major industrial plants. The emphasis in this chapter, as well as in other chapters in this book, is on aqueous corrosion, or corrosion in environments where water is present. The chapter describes the classification of various forms of corrosion based on the nature of the corrodent, mechanism of corrosion, and appearance of the corroded metal. It discusses five primary methods of corrosion control, namely, material selection, coatings, inhibitors, cathodic protection, and design. Examples of the opportunities in corrosion control and the means to implement a program to capitalize on those opportunities are presented in a table. The chapter concludes with varied sources of information pertaining to corrosion and corrosion prevention.

Induction heating is a rapid, efficient technique for producing localized or through heating in a wide range of industries. The economics as well as the technical feasibility of induction heating should be important considerations prior to investing in such a system. A number of cost elements enter into the analysis. These include equipment and energy costs, production lot size and ease of automation, material savings, labor costs, and maintenance requirements. This chapter discusses each of these factors. It compares the cost elements of induction heating with those of its main competitor, gas-fired furnace heating. Several typical examples are provided to illustrate the economic considerations in design and application of induction heating processes.