This chapter presents an overview of microprocessor and application specific integrated circuit (IC) testing. It begins with a description of key industry trends that will impact how ICs will be tested in the future. Next, it provides a brief description of the most common tests applied in the IC industry, where technical issues that are causing methodology changes are emphasized. These include functional testing, structural testing, scan-based delay testing, built-in self-testing, memory testing, analog circuit testing, system-on-a-chip testing, and reliability testing. Trends discussed have driven the development of novel focus areas in test and the chapter discusses several of those areas, including test data volume containment, test power containment, and novel methods of defect-based test.

This chapter discusses the development of aluminum, its industry growth, and its modern uses in manufacturing. It begins with the biography of Charles Martin Hall, who invented the process for reducing aluminum from its ore. The evolution of aluminum production from the Pittsburgh Reduction Company to a pilot plant on Smallman Street in Pittsburgh, to a production plant in New Kensington, and to Niagara Falls, New York, is then described. This is followed by a discussion on early aluminum applications and the usage of lower-cost raw materials. The chapter provides information on aluminum production process integrated by Aluminum Company of America (Alcoa) and the numerous technical problems and solutions related to Alcoa's research from World War I to World War II. The aerospace applications for aluminum alloys are also presented. The chapter concludes with a section on aluminum alloys developed by Alcoa.

The management of a failure analysis (FA) laboratory requires a broad range of activities to optimize the efficiency of the operation. The purpose of this article is to stimulate readers to consider the various aspects of FA laboratory operations and their respective business management requirements. The various aspects include: staffing, laboratory organization, lab design and operations, strategic development, financial management, and metrics and measurements. References for further reading and examples of resource materials are also included.

This chapter is an account of the various events that led to the decline of the integrated steel industry during the 1950s. These include the steel strike of 1959, the improvements in technology and increase in imports since 1950s, widespread closures of steel companies, the decline of the minimill industry, and the rapid growth of Mittal Steel.

Photon emission (PE) is one of the major optical techniques for contactless isolation of functional faults in integrated circuits (ICs) in full electrical operation. This article describes the fundamental mechanisms of PE in silicon based ICs. It presents the opportunities of contactless characterization for the most important electronic device, the MOS - Field Effect Transistor, the heart of ICs and their basic digital element, the CMOS inverter. The article discusses the specification and selection of detectors for proper PE applications. The main topics are image resolution, sensitivity, and spectral range of the detectors. The article also discusses the value and application of spectral information in the PE signal. It describes state of the art IC technologies. Finally, the article discusses the applications of PE in ICs and also I/O devices, integrated bipolar transistors in BiCMOS technologies, and parasitic bipolar effects like latch up.

This chapter discusses the formation and growth of various integrated steel companies from 1901 to 1959, namely the United States Steel Corporation, Bethlehem Steel Corporation, and a few of the notable smaller steel companies. The chapter discusses labor unrest and the growth of organized labor in the steel industry in the twentieth century.

Laser Voltage Probing (LVP) is a key enabling technology that has matured into a well-established and essential analytical optical technique that is crucial for observing and evaluating internal circuit activity. This article begins by providing an overview on LVP history and LVP theory, providing information on electro-optical effects and free-carrier effects. It then focuses on commercially available continuous wave LVP systems. Alternative optoelectronic imaging and probing technologies for fault isolation, namely frequency mapping and laser voltage tracing, are also discussed. The subsequent section provides information on the use of Visible Laser Probing. The article closes with some common LVP observations/considerations and limitations and future work concerning LVP.

Superalloys, except those with high aluminum and titanium contents, are welded with little difficulty. They can also be successfully brazed. This chapter describes the welding and brazing processes most often used and the factors that must be considered when making application decisions. It discusses the basic concepts of fusion welding and the differences between solid-solution-hardened and precipitation-hardened wrought superalloys. It addresses joint integrity, design, weld-related cracking, and the effect of grain size, precipitates, and contaminants. It covers common fusion welding techniques, defect prevention, fixturing, heat treatments, and general practices, including the use of filler metals. It also discusses several solid-state welding methods, superplastic forming, and transient liquid phase bonding, a type of diffusion welding process. The chapter includes extensive information on brazing processes, atmospheres, filler metals, and surface preparation procedures. It also includes examples of nickel-base welded components for aerospace use.

This appendix identifies producers, suppliers, and service providers experienced with superalloy materials and applications. It also identifies potential sources of engineering information and property data.

Transistors are the most important active structure of any semiconductor component. Performance characteristics of such devices within the specifications are key to ensuring proper functionality and long-term reliability of the product. In this article, a summary of the semiconductor technology from design to manufacturing and the characterization methods are discussed. The focus is on two prominent MOS structures: planar MOS device and FinFET device. The article covers the device parameters and device properties that determine the design criteria and the device tuning procedures. The discussion includes the effects of drain induced barrier lowering, velocity saturation, hot carrier degradation, and short channel on these devices.

This chapter discusses the application of investment casting to nickel- and cobalt-base superalloys. It describes the production of polycrystalline and single crystal castings, the materials normally used, and the part dimensions and tolerances typically achieved. It explains how patterns, molds, and shells are produced, discusses the practice of directional solidification, and examines an assortment of turbine components cast from nickel- and cobalt-base alloys. The chapter also addresses casting problems such as inclusions, porosity, distortion, core shift, and leaching and explains how to avoid them.

This article discusses the steps in the primary processing of stainless steels: melting, refining, remelting, casting, and hot rolling. It provides information of the major categories of defects in hot rolled stainless steels, namely hot mill defects, inclusion-related defects, and hot ductility-related defects.

Many defects generate excessive heat during operation; this is due to the power dissipation associated with the excess current flow at the defect site. There are several thermal detection techniques for failure analysis and this article focuses on infrared thermography with lock-in detection, which detects an object's temperature from its infrared emission based on blackbody radiation physics. The basic principles and the interpretation of the results are reviewed. Some typical results and a series of examples illustrating the application of this technique are also shown. Brief sections are devoted to the discussion on liquid-crystal imaging and fluorescent microthermal imaging technique for thermal detection.

This chapter provides a brief introduction to superalloys and their high-temperature capabilities. It explains how and why they were developed and highlights some of their unique properties, behaviors, and characteristics. It discusses their basic metallurgy, how they are processed, and where they are typically used. It also includes nominal composition data for more than 120 superalloys and a concise overview of the major topics in the book.

This chapter deals with the technology of stainless steel as it pertains to its proper use in architecture, art, and construction. It begins with an overview of the corrosion resistance of stainless steel, providing guidelines for balancing corrosion resistance, processing characteristics, and economy. This is followed by sections describing the influence of surface finish on corrosion resistance of stainless steel and reviewing some of the factors pertinent to balancing service environment, design requirements, and maintenance considerations. The chapter then discusses the various factors pertinent to important considerations in buildings, namely surface finish aesthetics, flatness, maintenance, repair, fabrication, and service considerations. It ends with a section providing information on concrete reinforcing bar.

Root cause of failure in automotive electronics cannot be explained by the failure signatures of failed devices. Deeper investigations in these cases reveals that a superimposition of impact factors, which can never be represented by usual qualification testing, caused the failure. This article highlights some of the most frequent early life failure types in automotive applications. It describes some of the critical things to be considered while handling packages and printed circuit board layout. The article also provides information on failure anamnesis that shows how to use history, failure signatures, environmental conditions, regional failure occurrences, user profile issues, and more in the failure analysis process to improve root cause findings.

Joining comprises a large number of processes used to assemble individual parts into a larger, more complex component or assembly. The selection of an appropriate design to join parts is based on several considerations related to both the product and the joining process. Many product design departments now improve the ease with which products are assembled by using design for assembly (DFA) techniques, which seek to ensure ease of assembly by developing designs that are easy to assemble. This chapter discusses the general guidelines for DFA and concurrent engineering rules before examining the various joining processes, namely fusion welding, solid-state welding, brazing, soldering, mechanical fastening, and adhesive bonding. In addition, it provides information on several design considerations related to the joining process and selection of the appropriate process for joining.

In this overview of diagnosis of scan logic and diagnosis driven failure analysis, the authors explore the world of diagnosis of digital semiconductors devices. After shortly outlining the technology behind diagnosis, the main part of this article describes key improvements to the basic diagnosis tools, discussing their merits for the failure analysis engineer. The article also describes the various requirements and other considerations that typically need to be taken into account to set up a full working scan diagnosis system. It summarizes the principles of design with embedded compression technologies. Finally, several successful industrial applications of diagnosis are presented.

This chapter is a chronological account of the development of ironmaking in colonial America from 1645 to 1870. The discussion covers the spread of ironmaking in many of the colonies in the northeast, canal building in Pennsylvania, the replacement of charcoal by anthracite coal in ironmaking, the life of ironmaking pioneer John Fritz, and the rapid increase in ironmaking for the railroads.