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surface tension
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Image
Published: 01 August 2005
Image
Published: 01 August 2005
Fig. 1.12 Surface tension forces acting when a liquid droplet wets a solid surface, according to the classical model
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Image
Published: 01 April 2004
Fig. 1.8 Surface tension forces acting when a liquid droplet wets a solid surface, according to the classical model
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Image
Published: 01 March 2012
Fig. 5.18 Surface tension balance at the three-phase (α-β- L ) junction and the resulting curvature of the solid-liquid interface. Source: Ref 5.6
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Image
Published: 01 November 2007
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Published: 01 November 2007
Fig. 8.2 Surface tension forces acting on grain-boundary segments produce pressure differences across the boundaries
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Image
Published: 01 August 2005
Fig. 1.14 Surface tension, γ LV , of liquid elemental metals at their melting points [ Howe 1993 ]
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Published: 01 August 2005
Fig. 2.29 Reduction in the surface tension of molten aluminum produced by various alloying additions. Adapted from Korol’kov [1956]
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Book Chapter
Book: Principles of Soldering
Series: ASM Technical Books
Publisher: ASM International
Published: 01 April 2004
DOI: 10.31399/asm.tb.ps.t62440001
EISBN: 978-1-62708-352-2
... pattern to the substrate. Fig. 1.8 Surface tension forces acting when a liquid droplet wets a solid surface, according to the classical model Fig. 1.9 Wetting angle of lead-tin solder on copper at 10 °C above the melting point, 1 min after reflow using rosin mildly activated (RMA) flux...
Abstract
Soldering and brazing represent one of several types of methods for joining solid materials. These methods may be classified as mechanical fastening, adhesive bonding, soldering and brazing, welding, and solid-state joining. This chapter summarizes the principal characteristics of these joining methods. It presents a comparison between solders and brazes. Further details on pressure welding and diffusion bonding are also provided. Key parameters of soldering are discussed, including surface energy and surface tension, wetting and contact angle, fluid flow, filler spreading characteristics, surface roughness of components, dissolution of parent materials and intermetallic growth, significance of the joint gap, and the strength of metals. The chapter also examines the principal aspects related to the design and application of soldering processes.
Image
Published: 01 August 2005
Fig. 5.21 Propagation of surface flaw under uniform tension for initial flaw shape a /2 c = 0.3. Courtesy of T.M. Hsu
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Image
Published: 01 August 2005
Fig. 5.22 Propagation of surface flaw under uniform tension for initial flaw shape a /2 c = 0.5. Courtesy of T.M. Hsu
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Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2016
DOI: 10.31399/asm.tb.ascaam.t59190001
EISBN: 978-1-62708-296-9
... parts. It also describes the mechanism behind dendritic grain crystallization and how factors such as surface tension, capillary length, and lattice symmetry affect dendritic arm size and spacing. The section that follows examines the morphology of the silicon crystals that form in aluminum-silicon...
Abstract
This chapter serves as a study and guide on the main phase constituents of cast aluminum-silicon alloys, alpha-Al solid solution and Si crystals. The first section focuses on the structure of Al-Si castings in the as-cast state, covering the morphology of the alpha-Al solid solution grains and the process by which they form. It describes how cooling rates, temperature gradients, and local concentrations influence the topology of the crystallization front, and how they play a role in determining the morphology and dispersion degree of the grains observed in cross sections of cast parts. It also describes the mechanism behind dendritic grain crystallization and how factors such as surface tension, capillary length, and lattice symmetry affect dendritic arm size and spacing. The section that follows examines the morphology of the silicon crystals that form in aluminum-silicon castings and its effect on properties and processing characteristics. It discusses the faceted nature of primary Si crystals and the modification techniques used to optimize their shape. It also describes the morphology of the (alpha-Al + Si) eutectic, which can be lamellar or rodlike in shape, and explains how it can be modified through temperature control or alloy additions to improve properties such as tensile strength and plasticity and reduce shrinkage.
Book Chapter
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2007
DOI: 10.31399/asm.tb.smnm.t52140071
EISBN: 978-1-62708-264-8
... 3 mm ( 1 8 in.) deep. After gently mixing with the end of a straw, blow vigorously through the straw until an array of soap bubbles fills the entire glass. The surface tension forces in the liquid soap film are similar to the surface tension forces in the solid-solid surfaces...
Abstract
Grain size has a determining effect on the mechanical properties of steel and responds favorably to forging and heat treating. This chapter explains how to measure and quantify grain size and how to control it through thermal cycling and forging operations. It describes how surface tension acting on grain-boundary segments contributes to grain growth and how the formation of new grains, driven by phase transformations and recrystallization, lead to a reduction in average grain size. It also discusses the effect of alloying elements on grain growth rates, particularly the curbing effect of particle and solute drag.
Book Chapter
Series: ASM Technical Books
Publisher: ASM International
Published: 01 October 2011
DOI: 10.31399/asm.tb.mnm2.t53060469
EISBN: 978-1-62708-261-7
... Abstract This appendix is a collection of tables containing thermal, electrical, mechanical, and physical property data for metals under various conditions. It also includes the periodic table of elements. electrical properties melting points metals periodic table surface tension...
Image
Published: 01 April 2004
Book Chapter
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2007
DOI: 10.31399/asm.tb.smnm.t52140055
EISBN: 978-1-62708-264-8
..., it does become sucked in by a force called surface tension. Surface tension is a force acting along the plane of a surface. The flux removes an oxide from the copper surface and generates the desired surface tension force at the point where the clean surface contacts the molten solder, causing the solder...
Abstract
Steels contain a wide range of elements, including alloys as well as residual processing impurities. This chapter describes the chemical composition of low-alloy AISI steels, which are classified based on the amounts of chromium, molybdenum, and nickel they contain. It explains why manganese is sometimes added to steel and how unintended consequences, such as the development of sulfide stringers, can offset the benefits. It also examines the effect of alloying elements on the iron-carbon phase diagram, particularly their effect on transformation temperatures.
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in Solidification, Segregation, and Nonmetallic Inclusions
> Metallography of Steels: Interpretation of Structure and the Effects of Processing
Published: 01 August 2018
sulfide–containing eutectic) that was liquid during solidification and, due to surface tension, compacted to droplets as it solidified over the dendrites (mechanism proposed in Ref 18 ).
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Image
Published: 01 April 2004
Fig. 5.13 Flip-chip land designed to cope with surface topology. The solder is initially confined by surface tension to the central circle but will slowly flow through the constricting necks into the overspill areas. The ensuing reduction in solder volume, and hence bond height, enables
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Book Chapter
Book: Principles of Brazing
Series: ASM Technical Books
Publisher: ASM International
Published: 01 August 2005
DOI: 10.31399/asm.tb.pb.t51230001
EISBN: 978-1-62708-351-5
... Relationship between surface energy and surface tension Fig. 1.12 Surface tension forces acting when a liquid droplet wets a solid surface, according to the classical model Fig. 1.13 Numerical model of a liquid droplet of constant volume wetted on a plane at contact angles of (a) 45°, (b...
Abstract
Brazing and soldering jointly represent one of several methods for joining solid materials. This chapter summarizes the principal characteristics of the various joining methods. It then discusses key parameters of brazing including surface energy and tension, wetting and contact angle, fluid flow, filler spreading characteristics, surface roughness of components, dissolution of parent materials, new phase formations, significance of the joint gap, and the strength of metals. The chapter also describes issues in processing aspects that must be considered when designing a joint, and the health, safety, and environmental aspects of brazing.
Image
Published: 01 November 2019
Figure 15 Image of 208 PQFP mounted to test plate. At least one of the leads needs to be in contact with the mounting plate to the die. Note: the water stays in the cavity due to surface tension, defining the upper plate of the capacitor.
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