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Published: 01 April 2004
Fig. 1.8 Surface tension forces acting when a liquid droplet wets a solid surface, according to the classical model More
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Published: 01 August 2005
Fig. 1.11 Relationship between surface energy and surface tension More
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Published: 01 August 2005
Fig. 1.12 Surface tension forces acting when a liquid droplet wets a solid surface, according to the classical model More
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Published: 01 November 2007
Fig. 6.1 Surface tension forces that allow a wire to float on water More
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Published: 01 November 2007
Fig. 8.2 Surface tension forces acting on grain-boundary segments produce pressure differences across the boundaries More
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Published: 01 August 2005
Fig. 1.14 Surface tension, γ LV , of liquid elemental metals at their melting points [ Howe 1993 ] More
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Published: 01 August 2005
Fig. 2.29 Reduction in the surface tension of molten aluminum produced by various alloying additions. Adapted from Korol’kov [1956] More
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Published: 01 March 2012
Fig. 5.18 Surface tension balance at the three-phase (α-β- L ) junction and the resulting curvature of the solid-liquid interface. Source: Ref 5.6 More
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 April 2004
DOI: 10.31399/asm.tb.ps.t62440001
EISBN: 978-1-62708-352-2
... of these joining methods. It presents a comparison between solders and brazes. Further details on pressure welding and diffusion bonding are also provided. Key parameters of soldering are discussed, including surface energy and surface tension, wetting and contact angle, fluid flow, filler spreading...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2016
DOI: 10.31399/asm.tb.ascaam.t59190001
EISBN: 978-1-62708-296-9
... parts. It also describes the mechanism behind dendritic grain crystallization and how factors such as surface tension, capillary length, and lattice symmetry affect dendritic arm size and spacing. The section that follows examines the morphology of the silicon crystals that form in aluminum-silicon...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2007
DOI: 10.31399/asm.tb.smnm.t52140071
EISBN: 978-1-62708-264-8
... 3 mm ( 1 8 in.) deep. After gently mixing with the end of a straw, blow vigorously through the straw until an array of soap bubbles fills the entire glass. The surface tension forces in the liquid soap film are similar to the surface tension forces in the solid-solid surfaces...
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Published: 01 August 2005
Fig. 5.21 Propagation of surface flaw under uniform tension for initial flaw shape a /2 c = 0.3. Courtesy of T.M. Hsu More
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Published: 01 August 2005
Fig. 5.22 Propagation of surface flaw under uniform tension for initial flaw shape a /2 c = 0.5. Courtesy of T.M. Hsu More
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 August 2005
DOI: 10.31399/asm.tb.pb.t51230001
EISBN: 978-1-62708-351-5
... Abstract Brazing and soldering jointly represent one of several methods for joining solid materials. This chapter summarizes the principal characteristics of the various joining methods. It then discusses key parameters of brazing including surface energy and tension, wetting and contact angle...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 October 2011
DOI: 10.31399/asm.tb.mnm2.t53060469
EISBN: 978-1-62708-261-7
... Abstract This appendix is a collection of tables containing thermal, electrical, mechanical, and physical property data for metals under various conditions. It also includes the periodic table of elements. electrical properties melting points metals periodic table surface tension...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2007
DOI: 10.31399/asm.tb.smnm.t52140055
EISBN: 978-1-62708-264-8
..., it does become sucked in by a force called surface tension. Surface tension is a force acting along the plane of a surface. The flux removes an oxide from the copper surface and generates the desired surface tension force at the point where the clean surface contacts the molten solder, causing the solder...
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Published: 01 April 2004
Fig. 1.7 Diagram used to explain the relationship between surface energy and surface tension More
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Published: 01 August 2018
sulfide–containing eutectic) that was liquid during solidification and, due to surface tension, compacted to droplets as it solidified over the dendrites (mechanism proposed in Ref 18 ). More
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Published: 01 April 2004
Fig. 5.13 Flip-chip land designed to cope with surface topology. The solder is initially confined by surface tension to the central circle but will slowly flow through the constricting necks into the overspill areas. The ensuing reduction in solder volume, and hence bond height, enables More
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Published: 01 November 2019
Figure 15 Image of 208 PQFP mounted to test plate. At least one of the leads needs to be in contact with the mounting plate to the die. Note: the water stays in the cavity due to surface tension, defining the upper plate of the capacitor. More