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surface preparation

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Series: ASM Technical Books
Publisher: ASM International
Published: 01 March 2001
DOI: 10.31399/asm.tb.secwr.9781627083157
EISBN: 978-1-62708-315-7
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110447
EISBN: 978-1-62708-247-1
... Abstract There are several analytical methods available that can be used in-line on whole wafers as well as off-line on de-processed products that are returned from the field. These techniques are surface analytical techniques that can be used to characterize the bulk of the material. The main...
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2011
DOI: 10.31399/asm.tb.jub.t53290165
EISBN: 978-1-62708-306-5
..., the processes involved in precleaning and surface preparation, types of fluxes used, solder joint design, and solder heating methods. alloying elements brazing filler metals brazing solder joints soldering fluxes soldering surface preparation BRAZING AND SOLDERING processes use a...
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2010
DOI: 10.31399/asm.tb.scm.t52870235
EISBN: 978-1-62708-314-0
... Abstract This chapter explains how polymeric adhesives are applied to composite as well as metal parts, forming bonded structures. It describes surface preparation practices and techniques, epoxy selection and use, and bonding procedures. adhesive bonding epoxy adhesives surface...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 March 2002
DOI: 10.31399/asm.tb.stg2.t61280149
EISBN: 978-1-62708-267-9
... information on brazing processes, atmospheres, filler metals, and surface preparation procedures. It also includes examples of nickel-base welded components for aerospace use. brazing fusion welding solid-state welding superalloys transient liquid phase bonding...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110153
EISBN: 978-1-62708-247-1
... contours means less dwell time per surface area and therefore rapidly increasing preparation times. A decrease in polishing bit diameter, from 5 mm to 1 mm, is an approximate 25x increase in preparation time. Until just a few short years ago, sample preparation and SIL or Numerically Increasing...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110144
EISBN: 978-1-62708-247-1
... bearing gasses. Surface bombardment can reduce selectivity especially with heavier gasses such as argon. Pocket depth can become non-uniform. Pocket milling and polishing allows a select area of the product in wafer, board, module or package form to be prepared with a small diameter tip...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110402
EISBN: 978-1-62708-247-1
... Abstract Cross-sectioning refers to the process of exposing the internal layers and printed devices below the surface by cleaving through the wafer. This article discusses in detail the steps involved in common cross-sectioning methods. These include sample preparation, scribing, indenting, and...
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 April 2013
DOI: 10.31399/asm.tb.imub.t53720161
EISBN: 978-1-62708-305-8
... in handling specimens of difficult shapes or sizes during the subsequent steps of metallographic preparation and examination. A secondary purpose is to protect and preserve extreme edges or surface defects during metallographic preparation. The method of mounting should in no way be injurious to the...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110461
EISBN: 978-1-62708-247-1
... the die surface. (b) Optical images of a TEM section, mounted on 3mm diameter grid. Figure 7 An illustration of crystallographic orientations in a silicon wafer with wafer normal parallel to [001] direction. The procedures for the planar TEM sample preparation lift-out technique [21...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 September 2008
DOI: 10.31399/asm.tb.fahtsc.t51130417
EISBN: 978-1-62708-284-6
... tempered tooth inside are obtained. Figures 27 ( a to d ) show various automobile parts that were induction surface hardened using the single-shot or scan-hardening technique (Ref 19) . They were prepared for macroscopic and microscopic examinations of the hardened layer. The segments of the...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2010
DOI: 10.31399/asm.tb.scm.t52870351
EISBN: 978-1-62708-314-0
... mode. Failure of the adhesive itself (cohesive failure) is the desired failure mode. If the adhesive pulls off of the adherend (adhesive failure), it is not a valid test and is usually indicative of improper surface preparation. Surface preparation methods for aluminum, titanium, and composite...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110563
EISBN: 978-1-62708-247-1
... identifying them. The chapter also provides information on the testing of MEMS devices. It covers the two common challenges in sample preparation for MEMS: decapping, or opening up the package, without disturbing the MEMS elements; and removing MEMS elements for analysis. Finally, the chapter discusses the...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110413
EISBN: 978-1-62708-247-1
... only a very small area of the sample can be imaged. AFM requires a sharp tip to be scanned across a sample surface, thus only a very small area can be imaged, and the apparent shape of the sample surface can be distorted by tip convolution effects. The SEM requires little or no sample preparation and...
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2009
DOI: 10.31399/asm.tb.sfa.t52780093
EISBN: 978-1-62708-268-6
... Abstract After the fault-tree, a failure-cause identification method has identified potential failure causes and the failure analysis team has prepared a failure mode assessment and assignment (FMA&A). The team knows specifically what to search for when examining components and...
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2010
DOI: 10.31399/asm.tb.scm.t52870307
EISBN: 978-1-62708-314-0
... surface should be clean of all dirt and grease. If the part contains a peel ply, it should be removed. The surface can be prepared either by scuff sanding with 150- to 180-grit sandpaper or by lightly grit blasting. For aerospace applications, the standard finishing system is an epoxy primer followed by a...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110025
EISBN: 978-1-62708-247-1
... Abstract In embedded systems, the separation between system level, board level, and individual component level failure analysis is slowly disappearing. In order to localize the initial defect area, prepare the sample for root cause analysis, and image the exact root cause, the overall...
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 April 2013
DOI: 10.31399/asm.tb.imub.t53720117
EISBN: 978-1-62708-305-8
..., and general procedures of tensile testing. Three distinct aspects of standard test methods for tension testing of metallic materials are discussed: test piece preparation, geometry, and material condition; test setup and equipment; and test procedure. mechanical properties metallic materials...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110323
EISBN: 978-1-62708-247-1
... identification, and circuit editing. The article also presents methods to prepare electron beam probing samples where some remaining silicon is required for the transistor functions and transmission electron microscope samples from units where the substrate silicon has been partially or completely removed...
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 March 2002
DOI: 10.31399/asm.tb.stg2.t61280203
EISBN: 978-1-62708-267-9
... polished finish A frequent reason for surface finishing of superalloy components is to prepare them for a subsequent treatment, such as for the application of a coating. For strength reasons, a frequent surface treatment given to superalloys is shot (or bead) peening (note Example 4 at the end of...