This chapter discusses some of the challenges associated with the analysis of composite structures. It begins with a review of lamina fundamentals and the stress-strain relationships in a single ply under various types of loads. It demonstrates the use of classical lamination theory, discusses the effects of interlaminar free-edge stresses, and explains how to predict the failure of composites using stress and strain criteria as well as the Azzi-Tsai-Hill maximum work theory and the Tsai-Wu failure criterion.

This appendix provides a detailed overview of the crystal structure of metals. It describes primary bonding mechanisms, space lattices and crystal systems, unit cell parameters, slip systems, and crystallographic planes and directions as well as plastic deformation mechanisms, crystalline imperfections, and the formation of surface or planar defects. It also discusses the use of X-ray diffraction for determining crystal structure.

This chapter examines the effect of heat treating and other processes on the microstructure-property relationships that occur in superalloys. It discusses precipitation and grain-boundary hardening and how they influence the phases, structures, and properties of various alloys. It explains how the delta phase, which is used to control grain size in IN-718, improves strength and prevents stress-rupture embrittlement. It describes heat treatments for different product forms, discusses the effect of tramp elements on grain-boundary ductility, and explains how section size and test location influence measured properties. It also provides information and data on the physical and mechanical properties of superalloys, particularly tensile strength, creep-rupture, fatigue, and fracture, and discusses related factors such as directionality, porosity, orientation, elongation, and the effect of coating and welding processes.

This chapter reviews failure aspects of structural ferrous powder metallurgy (PM) parts, which form the bulk of the PM industry. The focus is on conventional PM technology of parts in the density range of 6 to 7.2 g/cc. The chapter briefly introduces the processing steps that are essential to understanding failure analysis of PM parts. This is followed by a section on case hardening of PM parts. The methods used for analyzing the failures are then discussed. Some case studies are given that illustrate different failures and the methods of prevention of these failures.

In embedded systems, the separation between system level, board level, and individual component level failure analysis is slowly disappearing. In order to localize the initial defect area, prepare the sample for root cause analysis, and image the exact root cause, the overall functionality has to be maintained during the process. This leads to the requirement of adding additional techniques that help isolate and image defects that are buried deeply within the board structure. This article demonstrates an approach of advanced board level failure analysis by using several non-destructive localization techniques. The techniques considered for advanced fault isolation are magnetic current imaging for shorts and opens; infrared thermography for electrical shorts; time-domain-reflectometry for shorts and opens; scanning acoustic microscopy; and 2D/3D X-Ray microscopy. The individual methods and their operational principles are introduced along with case studies that will show the value of using them on board level defect analysis.

Semiconductor memories are superb drivers for process yield and reliability improvement because of their highly structured architecture and use of aggressive layout rules. This combination provides outstanding failure signature analysis possibilities for the entire design, manufacturing, and test process. This article discusses five key disciplines of the signature analysis process that need to be orchestrated within the organization: design for test practices, test floor data collection methodology, post-test data analysis tools, root cause theorization, and physical failure analysis strategies.

Ceramics normally have high melting temperatures, excellent chemical stability and, due to the absence of conduction electrons, tend to be good electrical and thermal insulators. They are also inherently hard and brittle, and when loaded in tension, have almost no tolerance for flaws. This chapter describes the applications, properties, and behaviors of some of the more widely used structural ceramics, including alumina, aluminum titanate, silicon carbide, silicon nitride, zirconia, zirconia-toughened alumina (ZTA), magnesia-partially stabilized zirconia (Mg-PSZ), and yttria-tetragonal zirconia polycrystalline (Y-TZP). It also provides information on materials selection, design optimization, and joining methods, and covers every step of the ceramic production process.

This chapter discusses the various failure analysis techniques for microelectromechanical systems (MEMS), focusing on conventional semiconductor manufacturing processes and materials. The discussion begins with a section describing the advances in integration and packaging technologies that have helped drive the further proliferation of MEMS devices in the marketplace. It then shows some examples of the top MEMS applications and quickly discusses the fundamentals of their workings. The next section describes common failure mechanisms along with techniques and challenges in identifying them. The chapter also provides information on the testing of MEMS devices. It covers the two common challenges in sample preparation for MEMS: decapping, or opening up the package, without disturbing the MEMS elements; and removing MEMS elements for analysis. Finally, the chapter discusses the aspects of failure analysis techniques that are of particular interest to MEMS.

In some cases, the failure analysis team finds that all components meet their requirements, the system was properly assembled, and it was not operated or tested in an out-of-specification manner, yet it still failed. When this occurs, the only conclusion the failure analysis team can reach is that it missed something in its analysis or that the design is defective. This chapter focuses on the latter possibility by discussing the various factors that a failure analysis team should consider to identify the causes of defects in system design. These include requirements identification and verification, circuit performance, mechanical failures, materials compatibility, and environmental factors. Examples that illustrate the value of design analysis are also presented.

The complexity of semiconductor chips and their packages has continuously challenged the known methods to analyze them. With larger laminates and the inclusion of multiple stacked die, methods to analyze modern semiconductor products are being pushed toward their limits to support these 2.5D and 3D packages. This article focuses on these methods of fault isolation, non-destructive imaging, and destructive techniques through an iterative process for failure analysis of complex packages.

X-ray imaging systems have long played a critical role in failure analysis laboratories. This article begins by listing several favorable traits that make X-rays uniquely well suited for non-destructive evaluation and testing. It then provides information on X-ray equipment and X-ray microscopy and its application in failure analysis of integrated circuit (IC) packaging and IC boards. The final section is devoted to the discussion on nanoscale 3D X-ray microscopy and its applications.

This article reviews the basic physics behind active photon injection for local photocurrent generation in silicon and thermal laser stimulation along with standard scanning optical microscopy failure analysis tools. The discussion includes several models for understanding the local thermal effects on metallic lines, junctions, and complete devices. The article also provides a description and case study examples of multiple photocurrent and thermal injection techniques. The photocurrent examples are based on Optical Beam-Induced Current and Light-Induced Voltage Alteration. The thermal stimulus examples are Optical Beam-Induced Resistance Change/Thermally-Induced Voltage Alteration and Seebeck Effect Imaging. Lastly, the article discusses the application of solid immersion lenses to improve spatial resolution.

Failure analysis of steel welds may be divided into three categories. They include failures due to design deficiencies, weld-related defects usually found during inspection, and failures in field service. This chapter emphasizes the failures due to various discontinuities in the steel weldment. These include poor workmanship, a variety of hydrogen-assisted cracking failures, stress-corrosion cracking, fatigue, and solidification cracking in steel welds. Hydrogen-assisted cracking can appear in four common forms, namely underbead or delayed cracking, weld metal fisheyes, ferrite vein cracking, and hydrogen-assisted reduced ductility.

This chapter briefly outlines some of the basic aspects of failure analysis, describing some of the basic steps and major concerns in conducting a failure analysis. A brief review of failure types from fracture, distortion, wear-assisted failure, and environmentally assisted failure (corrosion) is also provided.

The management of a failure analysis (FA) laboratory requires a broad range of activities to optimize the efficiency of the operation. The purpose of this article is to stimulate readers to consider the various aspects of FA laboratory operations and their respective business management requirements. The various aspects include: staffing, laboratory organization, lab design and operations, strategic development, financial management, and metrics and measurements. References for further reading and examples of resource materials are also included.

This chapter focuses on what can cause a system to fail and addresses the challenge in approaching a system failure. It then examines the steps involved in the four-step problem-solving process: defining the problem, identifying all potential failure causes and evaluating the likelihood of each, identifying the potential solutions, and identifying the best solution. The chapter concludes by describing the responsibilities of a failure analysis team.

Scanning Probe Microscope (SPM) has an increasing important role in the development of nanoscale semiconductor technologies. This article presents a detailed discussion on various SPM techniques including Atomic Force Microscopy (AFM), Scanning Kelvin Probe Microscopy, Scanning Capacitance Microscopy, Scanning Spreading Resistance Microscopy, Conductive-AFM, Magnetic Force Microscopy, Scanning Surface Photo Voltage Microscopy, and Scanning Microwave Impedance Microscopy. An overview of each SPM technique is given along with examples of how each is used in the development of novel technologies, the monitoring of manufacturing processes, and the failure analysis of nanoscale semiconductor devices.

Optoelectronic components can be readily classified as active light-emitting components (such as semiconductor lasers and light emitting diodes), electrically active but non-emitting components, and inactive components. This chapter focuses on the first category, and particularly on semiconductor lasers. The discussion begins with the basics of semiconductor lasers and the material science behind some causes of device failure. It then covers some of the common failure mechanisms, highlighting the need to identify failures as wearout or maverick failures. The chapter also covers the capabilities of many key optoelectronic failure analysis tools. The final section describes the common steps that should be followed so as to assure product reliability of optoelectronic components.