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structure analysis

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Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2010
DOI: 10.31399/asm.tb.scm.t52870421
EISBN: 978-1-62708-314-0
... Abstract This chapter discusses some of the challenges associated with the analysis of composite structures. It begins with a review of lamina fundamentals and the stress-strain relationships in a single ply under various types of loads. It demonstrates the use of classical lamination theory...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 March 2012
DOI: 10.31399/asm.tb.pdub.t53420363
EISBN: 978-1-62708-310-2
... Abstract This appendix provides a detailed overview of the crystal structure of metals. It describes primary bonding mechanisms, space lattices and crystal systems, unit cell parameters, slip systems, and crystallographic planes and directions as well as plastic deformation mechanisms...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 March 2002
DOI: 10.31399/asm.tb.stg2.t61280211
EISBN: 978-1-62708-267-9
... Abstract This chapter examines the effect of heat treating and other processes on the microstructure-property relationships that occur in superalloys. It discusses precipitation and grain-boundary hardening and how they influence the phases, structures, and properties of various alloys. It...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 October 2005
DOI: 10.31399/asm.tb.faesmch.9781627083010
EISBN: 978-1-62708-301-0
Series: ASM Technical Books
Publisher: ASM International
Published: 01 September 2008
DOI: 10.31399/asm.tb.fahtsc.t51130395
EISBN: 978-1-62708-284-6
... hardness conforming to specification and product with low hardness were subjected to standard metallographic analysis. The product with low hardness revealed a predominantly ferritic structure with free copper ( Fig. 16 ), even though the blend graphite addition was 0.8% ( Fig. 17 ). Thus, undersintering...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110025
EISBN: 978-1-62708-247-1
... functionality has to be maintained during the process. This leads to the requirement of adding additional techniques that help isolate and image defects that are buried deeply within the board structure. This article demonstrates an approach of advanced board level failure analysis by using several non...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110506
EISBN: 978-1-62708-247-1
... Abstract Semiconductor memories are superb drivers for process yield and reliability improvement because of their highly structured architecture and use of aggressive layout rules. This combination provides outstanding failure signature analysis possibilities for the entire design...
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 October 2012
DOI: 10.31399/asm.tb.lmub.t53550511
EISBN: 978-1-62708-307-2
...-tetragonal zirconia polycrystalline (Y-TZP). It also provides information on materials selection, design optimization, and joining methods, and covers every step of the ceramic production process. brazing ceramic processing diffusion bonding structural ceramics toughened ceramics weibull analysis...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110563
EISBN: 978-1-62708-247-1
... product or product family. The commonality in MEMS devices with respect to FA is that the structures are free moving and have some electrical function. A useful framework for proceeding down a failure analysis flow is to first try to isolate the source of the failure to a) the MEMS, b) the electronics...
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2009
DOI: 10.31399/asm.tb.sfa.t52780147
EISBN: 978-1-62708-268-6
... analysis to evaluate spring performance at tolerance extremes. Chapter 1 mentions the Apache helicopter main rotor blade failures. McDonnell Douglas Helicopter Company engineers designed the Apache helicopter blade (a bonded stainless steel, carbon fiber, and titanium structure) to withstand a direct...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110550
EISBN: 978-1-62708-247-1
... these 2.5D and 3D packages. This article focuses on these methods of fault isolation, non-destructive imaging, and destructive techniques through an iterative process for failure analysis of complex packages. 2.5D packaging 3D packaging destructive techniques failure analysis fault isolation...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110062
EISBN: 978-1-62708-247-1
... semiconductor packaging structures have prompted X-ray equipment manufacturers to significantly improve the 3D micro-CT imaging capability [11 , 12] . Most X-ray equipment manufacturers now provide 3D models with fully automated data acquisition, reconstruction, and data analysis packages. In a typical 3D...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110196
EISBN: 978-1-62708-247-1
... Abstract This article reviews the basic physics behind active photon injection for local photocurrent generation in silicon and thermal laser stimulation along with standard scanning optical microscopy failure analysis tools. The discussion includes several models for understanding the local...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 September 2008
DOI: 10.31399/asm.tb.fahtsc.t51130503
EISBN: 978-1-62708-284-6
... Abstract Failure analysis of steel welds may be divided into three categories. They include failures due to design deficiencies, weld-related defects usually found during inspection, and failures in field service. This chapter emphasizes the failures due to various discontinuities in the steel...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 September 2008
DOI: 10.31399/asm.tb.fahtsc.t51130111
EISBN: 978-1-62708-284-6
... all significant features have been carefully documented by photography (Ref 2) . In addition to locating the failure origin, visual analysis is necessary to reveal stress concentrations, material imperfections, presence of surface coatings, case-hardened regions, welds, and other structural...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2003
DOI: 10.31399/asm.tb.cfap.9781627082815
EISBN: 978-1-62708-281-5
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110032
EISBN: 978-1-62708-247-1
... Abstract The management of a failure analysis (FA) laboratory requires a broad range of activities to optimize the efficiency of the operation. The purpose of this article is to stimulate readers to consider the various aspects of FA laboratory operations and their respective business...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2009
DOI: 10.31399/asm.tb.sfa.t52780001
EISBN: 978-1-62708-268-6
... likelihood of each, identifying the potential solutions, and identifying the best solution. The chapter concludes by describing the responsibilities of a failure analysis team. failure analysis problem-solving process system failure THIS BOOK FOCUSES ON solving systems failures. Other books...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110485
EISBN: 978-1-62708-247-1
... structure of a small area of an aluminum-copper bond pad. The grain structure and grain boundaries are clearly visible. For this particular analysis, known good bond pads were compared to problematic pads in order to understand if there was a discernable difference in the surface and grain structure between...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110524
EISBN: 978-1-62708-247-1
... capabilities of many key optoelectronic failure analysis tools. The final section describes the common steps that should be followed so as to assure product reliability of optoelectronic components. failure analysis light emitting diodes optoelectronic devices product reliability semiconductor lasers...