Skip Nav Destination
Close Modal
By
Douglas Hunt, Pradip Pichumani, Kevin Distelhurst, Michael Coster
By
Christian Schmidt
By
Xianghong Tom Tong, Wen-hsien Chuang, Hyuk Ju Ryu, Prasoon Joshi, Di Xu ...
By
Hemachandar Tanukonda Devarajulu, Deepak Goyal, Mayue Xie
Search Results for
structural defects
Update search
Filter
- Title
- Authors
- Author Affiliations
- Full Text
- Abstract
- Keywords
- DOI
- ISBN
- EISBN
- Issue
- ISSN
- EISSN
- Volume
- References
Filter
- Title
- Authors
- Author Affiliations
- Full Text
- Abstract
- Keywords
- DOI
- ISBN
- EISBN
- Issue
- ISSN
- EISSN
- Volume
- References
Filter
- Title
- Authors
- Author Affiliations
- Full Text
- Abstract
- Keywords
- DOI
- ISBN
- EISBN
- Issue
- ISSN
- EISSN
- Volume
- References
Filter
- Title
- Authors
- Author Affiliations
- Full Text
- Abstract
- Keywords
- DOI
- ISBN
- EISBN
- Issue
- ISSN
- EISSN
- Volume
- References
Filter
- Title
- Authors
- Author Affiliations
- Full Text
- Abstract
- Keywords
- DOI
- ISBN
- EISBN
- Issue
- ISSN
- EISSN
- Volume
- References
Filter
- Title
- Authors
- Author Affiliations
- Full Text
- Abstract
- Keywords
- DOI
- ISBN
- EISBN
- Issue
- ISSN
- EISSN
- Volume
- References
NARROW
Format
Topics
Book Series
Date
Availability
1-20 of 659
Search Results for structural defects
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
1
Sort by
Book Chapter
Crystal Structure Defects and Imperfections
Available to PurchaseSeries: ASM Technical Books
Publisher: ASM International
Published: 01 October 2021
DOI: 10.31399/asm.tb.ciktmse.t56020001
EISBN: 978-1-62708-389-8
... and their relevance in design and manufacturing. It begins with a review of compositional impurities, the physical arrangement of atoms in solid solution, and the factors that determine maximum solubility. It then describes different types of structural imperfections, including point, line, and planar defects...
Abstract
Alloying, heat treating, and work hardening are widely used to control material properties, and though they take different approaches, they all focus on imperfections of one type or other. This chapter provides readers with essential background on these material imperfections and their relevance in design and manufacturing. It begins with a review of compositional impurities, the physical arrangement of atoms in solid solution, and the factors that determine maximum solubility. It then describes different types of structural imperfections, including point, line, and planar defects, and how they respond to applied stresses and strains. The chapter makes extensive use of graphics to illustrate crystal lattice structures and related concepts such as vacancies and interstitial sites, ion migration, volume expansion, antisite defects, edge and screw dislocations, slip planes, twinning planes, and dislocation passage through precipitates. It also points out important structure-property correlations.
Book Chapter
Crystalline Imperfections—Problems and Solutions
Available to PurchaseSeries: ASM Technical Books
Publisher: ASM International
Published: 01 October 2021
DOI: 10.31399/asm.tb.ciktmse.t56020013
EISBN: 978-1-62708-389-8
... Abstract This chapter provides readers with worked solutions to more than 25 problems related to compositional impurities and structural defects. The problems deal with important issues and challenges such as the design of low-density steels, the causes and effects of distortion in different...
Abstract
This chapter provides readers with worked solutions to more than 25 problems related to compositional impurities and structural defects. The problems deal with important issues and challenges such as the design of low-density steels, the causes and effects of distortion in different crystal structures, the ability to predict the movement of dislocations, the influence of impurities on defects, the relationship between gain size and material properties, the identification of specific types of defects, the selection of compatible metals for vacuum environments, and the effect of twinning planes on stacking sequences. The chapter also includes problems on how the formation of precipitates can produce slip planes and how grain boundaries can act as obstacles to dislocation motion.
Book Chapter
Failures Due to Lack of Quality Control or Improper Quality Control
Available to PurchaseSeries: ASM Technical Books
Publisher: ASM International
Published: 01 December 2018
DOI: 10.31399/asm.tb.fibtca.t52430351
EISBN: 978-1-62708-253-2
... Abstract Boiler tube failures associated with material defects are often the result of poor quality control, whether in primary production, on-site fabrication, storage and handling, or installation. This chapter examines quality-related failures stemming from compositional and structural...
Abstract
Boiler tube failures associated with material defects are often the result of poor quality control, whether in primary production, on-site fabrication, storage and handling, or installation. This chapter examines quality-related failures stemming from compositional and structural defects, forming and welding defects, design defects, improper cleaning methods, and ineffective maintenance. It also includes case studies and illustrations.
Image
TEM image of the TSV structure with a sidewall defect (Top). STEM image (lo...
Available to Purchase
in 3D Hot-Spot Localization by Lock-in Thermography
> Microelectronics Failure Analysis: Desk Reference
Published: 01 November 2019
Figure 17 TEM image of the TSV structure with a sidewall defect (Top). STEM image (lower left) and EDS maps (lower middle and right) of the defect revealing the migration of Cu from the TSVs filling through its side wall isolation resulting in a short path.
More
Series: ASM Technical Books
Publisher: ASM International
Published: 01 October 2021
DOI: 10.31399/asm.tb.ciktmse.9781627083898
EISBN: 978-1-62708-389-8
Book Chapter
2.5D and 3D Packaging Failure Analysis Techniques
Available to PurchaseSeries: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110550
EISBN: 978-1-62708-247-1
... divided by the combined resistance, gives a percentage of the length of the structure where the fail exists. (This assumes the resistance of the defect itself is negligible and there is one defect, which may not always be true). Capacitance Measurements Localization information on an open test site...
Abstract
The complexity of semiconductor chips and their packages has continuously challenged the known methods to analyze them. With larger laminates and the inclusion of multiple stacked die, methods to analyze modern semiconductor products are being pushed toward their limits to support these 2.5D and 3D packages. This article focuses on these methods of fault isolation, non-destructive imaging, and destructive techniques through an iterative process for failure analysis of complex packages.
Book Chapter
Structure of Metals and Alloys
Available to PurchaseSeries: ASM Technical Books
Publisher: ASM International
Published: 31 December 2020
DOI: 10.31399/asm.tb.phtbp.t59310001
EISBN: 978-1-62708-326-3
... crystal structures presented here depict a perfectly ordered crystalline lattice, real materials are rarely perfect. They usually contain imperfections or defects that affect their physical, chemical, mechanical, and electronic properties. However, depending on the desired properties exhibited...
Abstract
The building block of all matter, including metals, is the atom. This chapter initially provides information on atomic bonding and the crystal structure of metals and alloys, followed by a description of three crystal lattice structures of metals: face-centered cubic, hexagonal close-packed, and body-centered cubic. It then describes the four main divisions of crystal defects, namely point defects, line defects, planar defects, and volume defects. The chapter provides information on grain boundaries of metals, processes involved in atomic diffusion, and key properties of a solid solution. It also explains the aspects of a phase diagram that shows what phase or phases are present in the alloy under conditions of thermal equilibrium. Finally, a discussion on the applications of equilibrium phase diagrams is presented.
Book Chapter
Crystalline Imperfections and Plastic Deformation
Available to PurchaseSeries: ASM Technical Books
Publisher: ASM International
Published: 01 June 2008
DOI: 10.31399/asm.tb.emea.t52240017
EISBN: 978-1-62708-251-8
... Abstract In a perfect crystalline structure, there is an orderly repetition of the lattice in every direction in space. Real crystals contain a considerable number of imperfections, or defects, that affect their physical, chemical, mechanical, and electronic properties. Defects play...
Abstract
In a perfect crystalline structure, there is an orderly repetition of the lattice in every direction in space. Real crystals contain a considerable number of imperfections, or defects, that affect their physical, chemical, mechanical, and electronic properties. Defects play an important role in processes such as deformation, annealing, precipitation, diffusion, and sintering. All defects and imperfections can be conveniently classified under four main divisions: point defects, line defects, planar defects, and volume defects. This chapter provides a detailed discussion on the causes, nature, and impact of these defects in metals. It also describes the mechanisms that cause plastic deformation in metals.
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2006
DOI: 10.31399/asm.tb.ex2.t69980141
EISBN: 978-1-62708-342-3
... Abstract This chapter explains the basic terminology and principles of metallurgy as they apply to extrusion. It begins with an overview of crystal structure in metals and alloys, including crystal defects and orientation. This is followed by sections discussing the development...
Abstract
This chapter explains the basic terminology and principles of metallurgy as they apply to extrusion. It begins with an overview of crystal structure in metals and alloys, including crystal defects and orientation. This is followed by sections discussing the development of the continuous cast microstructure of aluminum and copper alloys. The discussion provides information on billet and grain segregation and defects in continuous casting. The chapter then discusses the processes involved in the deformation of pure metals and alloys at room temperature. Next, it describes the characteristics of pure metals and alloys at higher temperatures. The processes involved in extrusion are then covered. The chapter provides details on how the toughness and fracture characteristics of metals and alloys affect the extrusion process. The weld seams in hollow profiles, the production of composite profiles, and the processing of composite materials, as well as the extrusion of metal powders, are discussed. The chapter ends with a discussion on the factors that define the extrudability of metallic materials and how these attributes are characterized.
Book Chapter
Non-destructive Techniques for Advanced Board Level Failure Analysis
Available to PurchaseSeries: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110025
EISBN: 978-1-62708-247-1
... functionality has to be maintained during the process. This leads to the requirement of adding additional techniques that help isolate and image defects that are buried deeply within the board structure. This article demonstrates an approach of advanced board level failure analysis by using several non...
Abstract
In embedded systems, the separation between system level, board level, and individual component level failure analysis is slowly disappearing. In order to localize the initial defect area, prepare the sample for root cause analysis, and image the exact root cause, the overall functionality has to be maintained during the process. This leads to the requirement of adding additional techniques that help isolate and image defects that are buried deeply within the board structure. This article demonstrates an approach of advanced board level failure analysis by using several non-destructive localization techniques. The techniques considered for advanced fault isolation are magnetic current imaging for shorts and opens; infrared thermography for electrical shorts; time-domain-reflectometry for shorts and opens; scanning acoustic microscopy; and 2D/3D X-Ray microscopy. The individual methods and their operational principles are introduced along with case studies that will show the value of using them on board level defect analysis.
Book Chapter
Introduction to Fatigue and Fracture
Available to PurchaseSeries: ASM Technical Books
Publisher: ASM International
Published: 01 November 2012
DOI: 10.31399/asm.tb.ffub.t53610001
EISBN: 978-1-62708-303-4
... cracking and thus should be considered when predicting useful product life. brittle fracture fatigue cycles linear elastic fracture mechanics material defects stress intensity structural design IT IS OFTEN STATED that history repeats itself. Yet, when it comes to the failure of structural...
Abstract
This chapter provides a brief review of industry’s battle with fatigue and fracture and what has been learned about the underlying failure mechanisms and their effect on product lifetime and service. It recounts some of the tragic events that led to the discovery of fatigue and brittle fracture and explains how they reshaped design philosophies, procedures, and tools. It also discusses the influence of material and manufacturing defects, operating conditions, stress concentration and intensity, temperature and pressure, and cyclic loading, all of which play a role in the onset of fatigue cracking and thus should be considered when predicting useful product life.
Book Chapter
Structure of Metals and Alloys
Available to PurchaseSeries: ASM Technical Books
Publisher: ASM International
Published: 01 October 2011
DOI: 10.31399/asm.tb.mnm2.t53060013
EISBN: 978-1-62708-261-7
... Abstract This chapter introduces many of the key concepts on which metallurgy is based. It begins with an overview of the atomic nature of matter and the forces that link atoms together in crystal lattice structures. It discusses the types of imperfections (or defects) that occur in the crystal...
Abstract
This chapter introduces many of the key concepts on which metallurgy is based. It begins with an overview of the atomic nature of matter and the forces that link atoms together in crystal lattice structures. It discusses the types of imperfections (or defects) that occur in the crystal structure of metals and their role in mechanical deformation, annealing, precipitation, and diffusion. It describes the concept of solid solutions and the effect of temperature on solubility and phase transformations. The chapter also discusses the formation of solidification structures, the use of equilibrium phase diagrams, the role of enthalpy and Gibb’s free energy in chemical reactions, and a method for determining phase compositions along the solidus and liquidus lines.
Book Chapter
Silicon Device Backside De-Processing and Fault Isolation Techniques
Available to PurchaseSeries: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110323
EISBN: 978-1-62708-247-1
... was identified using this method. The resistance of structure containing the defect was approximately 10kΩ, whereas the resistance of an identical nearby passing reference structure was approximately 700Ω. Such small differences are typically not detectable using two point EBAC. Figure 17 A TEM image...
Abstract
This article presents methods that enable one to consistently, uniformly and quickly remove substrate silicon from units without imparting damage to the structure of interest. It provides examples of electron beam probing and backside nano-probing techniques. The electron beam probing techniques are E-beam Logic State Imaging, Electron-beam Signal Image Mapping, and E-beam Device Perturbation. Backside nano-probing techniques discussed include: Electron Beam Absorbed Current, Electron Beam Induced Resistance Change, four terminal resistance measurements, resistive gate defect identification, and circuit editing. The article also presents methods to prepare electron beam probing samples where some remaining silicon is required for the transistor functions and transmission electron microscope samples from units where the substrate silicon has been partially or completely removed.
Book Chapter
Review of Metallic Structure
Available to PurchaseSeries: ASM Technical Books
Publisher: ASM International
Published: 01 March 2012
DOI: 10.31399/asm.tb.pdub.t53420363
EISBN: 978-1-62708-310-2
..., crystalline imperfections, and the formation of surface or planar defects. It also discusses the use of X-ray diffraction for determining crystal structure. crystalline structures line defects metallic structure planar defects plastic deformation point defects volume defects X-ray diffraction...
Abstract
This appendix provides a detailed overview of the crystal structure of metals. It describes primary bonding mechanisms, space lattices and crystal systems, unit cell parameters, slip systems, and crystallographic planes and directions as well as plastic deformation mechanisms, crystalline imperfections, and the formation of surface or planar defects. It also discusses the use of X-ray diffraction for determining crystal structure.
Book Chapter
Failure Analysis: Why and for Whom?
Available to PurchaseSeries: ASM Technical Books
Publisher: ASM International
Published: 01 October 2005
DOI: 10.31399/asm.tb.faesmch.t51270003
EISBN: 978-1-62708-301-0
... as an unacceptable gap between its expected and actual performance. It is a condition that makes the structure unable to perform its intended function safely, reliably, and economically. Such an unacceptable difference can be due to many reasons. A later chapter explains that the causes of failures rest in defects...
Abstract
This chapter discusses the importance of failure analysis and the role it plays in a society driven by technological advancement. It explains why failure rates are highest in the early and later stages of the life of any product and shows the extent to which failure rates increase when products are subjected to an aggressive operating environment.
Series: ASM Technical Books
Publisher: ASM International
Published: 01 July 1997
DOI: 10.31399/asm.tb.wip.t65930039
EISBN: 978-1-62708-359-1
... is included that encompasses techniques used to characterize the locations and structure of internal and surface defects, including radiography, ultrasonic testing, and liquid penetrant inspection. The next group of characterization procedures discussed is destructive tests, requiring the removal of specimens...
Abstract
This article reviews nondestructive and destructive test methods used to characterize welds. The first process of characterization discussed involves information that may be obtained by direct visual inspection and measurement of the weld. An overview of nondestructive evaluation is included that encompasses techniques used to characterize the locations and structure of internal and surface defects, including radiography, ultrasonic testing, and liquid penetrant inspection. The next group of characterization procedures discussed is destructive tests, requiring the removal of specimens from the weld. The third component of weld characterization is the measurement of mechanical and corrosion properties. Following the discussion on the characterization procedures, the second part of this article provides examples of how two particular welds were characterized according to these procedures.
Book Chapter
Fault Isolation Using Time Domain Reflectometry, Electro Optical Terahertz Pulse Reflectometry and Time Domain Transmissometry
Available to PurchaseSeries: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110132
EISBN: 978-1-62708-247-1
...-level interconnect based on waveform comparison between known-good and bare-substrate reference units [9] Figure 6 EOTPR waveform shows the waveform signatures of subtle design elements of the same structure as in Fig. 5 . Physical failure analysis showed that the defect is an additional...
Abstract
Time-domain based characterization methods, mainly time-domain reflectometry (TDR) and time-domain transmissometry (TDT), have been used to locate faults in twisted cables, telegraph lines, and connectors in the electrical and telecommunication industry. This article provides a brief review of conventional TDR and its application limitations to advanced packages in semiconductor industry. The article introduces electro optical terahertz pulse reflectometry (EOTPR) and discusses how its improvements of using high frequency impulse signal addressed application challenges and quickly made it a well-adopted tool in the industry. The third part of this article introduces a new method which combines impulse signal and the TDT concept, and discusses a combo TDR and TDT method. Cases studies and application notes are shared and discussed for each technique. Application benefits and limitations of these techniques (TDR, EOTPR, and combo TDR/TDT) are summarized and compared.
Book Chapter
Nondestructive Inspection
Available to PurchaseSeries: ASM Technical Books
Publisher: ASM International
Published: 01 November 2010
DOI: 10.31399/asm.tb.scm.t52870333
EISBN: 978-1-62708-314-0
..., although most composite structure is usually tested at 1 to 5 MHz. Higher frequencies (short wavelengths) are more sensitive to small defects, while lower frequencies (long wavelengths) can penetrate to greater depths. As the ultrasonic beam passes through the composite, it is attenuated or lost due...
Abstract
This chapter discusses the use of nondestructive inspection methods, including visual, ultrasonic, radiographic, and thermographic techniques, and the types of flaws and damages they can reveal in composite parts and assemblies. It describes the basic principles behind each method along with best practices and procedures.
Book Chapter
Fracture Control and Damage Tolerance Analysis
Available to PurchaseSeries: ASM Technical Books
Publisher: ASM International
Published: 01 November 2012
DOI: 10.31399/asm.tb.ffub.t53610303
EISBN: 978-1-62708-303-4
... operations without catastrophic failure by fracture . Very seldom does a fracture occur due to an unforeseen overload on an undamaged structure. Fractures are usually the end result of crack growth from a small defect or flaw. Due to repeated or sustained “normal” service loads, a crack may develop from...
Abstract
Fracture control can be defined as a concerted effort to maintain operating safety without catastrophic failure by fracture. It requires an understanding of how cracks affect structural integrity and strength and the time that a crack can grow before it exceeds permissible size. The chapter describes some of methods used to determine maximum permissible crack size and predict growth rates. It explains how the information can then be used to control fractures through periodic inspection, fail-safe features, mandated retirement, and proof testing. It presents a number of fracture control plans optimized for different circumstances, examines the damage tolerance requirements used by different industries, and discusses various approaches for fatigue design.
Book Chapter
Common Causes of Failures
Available to PurchaseSeries: ASM Technical Books
Publisher: ASM International
Published: 01 October 2005
DOI: 10.31399/asm.tb.faesmch.t51270005
EISBN: 978-1-62708-301-0
.... By proper inspection procedures, it was possible to reject defective structural members in an aircraft industry and obtain free replacement from the suppliers. Example: Blisters in Aluminum Alloy Extrusions In one batch of aluminum alloy extrusions to be used for aircraft wing roots, blisters ( Fig...
Abstract
This chapter identifies the primary causes of service failures and discusses the types of defects from which they stem. It presents more than a dozen examples of failures attributed to such causes as design defects, material defects, and manufacturing or processing defects as well as assembly errors, abnormal operating conditions, and inadequate maintenance. It also describes the precise usage of terms such as defect, flaw, imperfection, and discontinuity.
1