Boiler tube failures associated with material defects are often the result of poor quality control, whether in primary production, on-site fabrication, storage and handling, or installation. This chapter examines quality-related failures stemming from compositional and structural defects, forming and welding defects, design defects, improper cleaning methods, and ineffective maintenance. It also includes case studies and illustrations.

The building block of all matter, including metals, is the atom. This chapter initially provides information on atomic bonding and the crystal structure of metals and alloys, followed by a description of three crystal lattice structures of metals: face-centered cubic, hexagonal close-packed, and body-centered cubic. It then describes the four main divisions of crystal defects, namely point defects, line defects, planar defects, and volume defects. The chapter provides information on grain boundaries of metals, processes involved in atomic diffusion, and key properties of a solid solution. It also explains the aspects of a phase diagram that shows what phase or phases are present in the alloy under conditions of thermal equilibrium. Finally, a discussion on the applications of equilibrium phase diagrams is presented.

In a perfect crystalline structure, there is an orderly repetition of the lattice in every direction in space. Real crystals contain a considerable number of imperfections, or defects, that affect their physical, chemical, mechanical, and electronic properties. Defects play an important role in processes such as deformation, annealing, precipitation, diffusion, and sintering. All defects and imperfections can be conveniently classified under four main divisions: point defects, line defects, planar defects, and volume defects. This chapter provides a detailed discussion on the causes, nature, and impact of these defects in metals. It also describes the mechanisms that cause plastic deformation in metals.

This chapter explains the basic terminology and principles of metallurgy as they apply to extrusion. It begins with an overview of crystal structure in metals and alloys, including crystal defects and orientation. This is followed by sections discussing the development of the continuous cast microstructure of aluminum and copper alloys. The discussion provides information on billet and grain segregation and defects in continuous casting. The chapter then discusses the processes involved in the deformation of pure metals and alloys at room temperature. Next, it describes the characteristics of pure metals and alloys at higher temperatures. The processes involved in extrusion are then covered. The chapter provides details on how the toughness and fracture characteristics of metals and alloys affect the extrusion process. The weld seams in hollow profiles, the production of composite profiles, and the processing of composite materials, as well as the extrusion of metal powders, are discussed. The chapter ends with a discussion on the factors that define the extrudability of metallic materials and how these attributes are characterized.

In embedded systems, the separation between system level, board level, and individual component level failure analysis is slowly disappearing. In order to localize the initial defect area, prepare the sample for root cause analysis, and image the exact root cause, the overall functionality has to be maintained during the process. This leads to the requirement of adding additional techniques that help isolate and image defects that are buried deeply within the board structure. This article demonstrates an approach of advanced board level failure analysis by using several non-destructive localization techniques. The techniques considered for advanced fault isolation are magnetic current imaging for shorts and opens; infrared thermography for electrical shorts; time-domain-reflectometry for shorts and opens; scanning acoustic microscopy; and 2D/3D X-Ray microscopy. The individual methods and their operational principles are introduced along with case studies that will show the value of using them on board level defect analysis.

This chapter introduces many of the key concepts on which metallurgy is based. It begins with an overview of the atomic nature of matter and the forces that link atoms together in crystal lattice structures. It discusses the types of imperfections (or defects) that occur in the crystal structure of metals and their role in mechanical deformation, annealing, precipitation, and diffusion. It describes the concept of solid solutions and the effect of temperature on solubility and phase transformations. The chapter also discusses the formation of solidification structures, the use of equilibrium phase diagrams, the role of enthalpy and Gibb’s free energy in chemical reactions, and a method for determining phase compositions along the solidus and liquidus lines.

This appendix provides a detailed overview of the crystal structure of metals. It describes primary bonding mechanisms, space lattices and crystal systems, unit cell parameters, slip systems, and crystallographic planes and directions as well as plastic deformation mechanisms, crystalline imperfections, and the formation of surface or planar defects. It also discusses the use of X-ray diffraction for determining crystal structure.

Many of the structural characteristics of steel products are a result of changes that occur during solidification, particularly volume contractions and solute redistribution. This chapter discusses the solidification process and how it affects the quality and behaviors of steel. It explains how steel shrinks as it solidifies, causing issues such as pipe and voids, and how differences in the solubility of solid and liquid steel lead to compositional heterogeneities or segregation. It describes the dendritic nature of solidification, peritectic and eutectic reactions, microporosity, macro- and microsegregation, and hot cracking, as well as the effects of solidification and remelting on castings, ingots, and continuous cast products. It explains how to determine where defects originate in continuous casters and how to control alumina, sulfide, and nitride inclusions.

This chapter discusses the effects of hot working on the structure and properties of steel. It explains how working steels at high temperatures promotes diffusion, which helps close cavities and pores, and how it changes the shape and distribution of segregates, offsetting their effect. It describes the effect of hot working on nonmetallic inclusions and the many properties influenced by them. It discusses the recrystallization mechanism by which hot working produces microstructural changes and explains how to control it by adjusting temperature, degree of reduction, and cooling rates. It describes special cases of segregation, including banding and why it occurs, and the application of closed die forging. The chapter also presents several examples of hot working defects, including forging laps, cracks, and overheated or burned steel.

This article presents methods that enable one to consistently, uniformly and quickly remove substrate silicon from units without imparting damage to the structure of interest. It provides examples of electron beam probing and backside nano-probing techniques. The electron beam probing techniques are E-beam Logic State Imaging, Electron-beam Signal Image Mapping, and E-beam Device Perturbation. Backside nano-probing techniques discussed include: Electron Beam Absorbed Current, Electron Beam Induced Resistance Change, four terminal resistance measurements, resistive gate defect identification, and circuit editing. The article also presents methods to prepare electron beam probing samples where some remaining silicon is required for the transistor functions and transmission electron microscope samples from units where the substrate silicon has been partially or completely removed.

This chapter presents an overview of microprocessor and application specific integrated circuit (IC) testing. It begins with a description of key industry trends that will impact how ICs will be tested in the future. Next, it provides a brief description of the most common tests applied in the IC industry, where technical issues that are causing methodology changes are emphasized. These include functional testing, structural testing, scan-based delay testing, built-in self-testing, memory testing, analog circuit testing, system-on-a-chip testing, and reliability testing. Trends discussed have driven the development of novel focus areas in test and the chapter discusses several of those areas, including test data volume containment, test power containment, and novel methods of defect-based test.

Deformation within a crystal lattice is governed principally by the presence of dislocations, which are two-dimensional defects in the lattice structure. Slip from shear stress is the most common deformation mechanism within crystalline lattices of metallic materials, although deformation of crystal lattices can also occur by other processes such as twinning and, in special circumstances, by the migration of vacant lattice sites. This appendix describes the notation used to specify lattice planes and directions and discusses the mechanisms of slip and twinning as well as the effect of stacking faults.

This chapter discusses the various methods used to join titanium alloy assemblies, focusing on welding processes and procedures. It explains how welding alters the structure and properties of titanium and how it is influenced by composition, surface qualities, and other factors. It describes several welding processes, including arc welding, resistance welding, and friction stir welding, and addresses related issues such as welding defects, quality control, and stress relieving. The chapter also covers mechanical fastening techniques along with adhesive bonding and brazing.

This chapter describes the metallurgy, composition, and properties of steels and other alloys. It provides information on the atomic structure of metals, the nature of alloy phases, and the mechanisms involved in phase transformations, including time-temperature effects and the role of diffusion, nucleation, and growth. It also discusses alloying, heat treating, and defect formation and briefly covers condenser tube materials.

The complexity of semiconductor chips and their packages has continuously challenged the known methods to analyze them. With larger laminates and the inclusion of multiple stacked die, methods to analyze modern semiconductor products are being pushed toward their limits to support these 2.5D and 3D packages. This article focuses on these methods of fault isolation, non-destructive imaging, and destructive techniques through an iterative process for failure analysis of complex packages.

This chapter provides a short introduction to phase transformations, namely, the liquid-to-solid phase transformations that occur during solidification and the solid-to-solid transformations that are important in processing, such as heat treatment. It also introduces the concept of free energy that governs whether or not a phase transformation is possible, and then the kinetic considerations that determine the rate at which transformations take place. The chapter also describes important solid-state transformations such as spinodal decomposition and martensitic transformation.

This chapter examines the static, fatigue, and damage tolerance properties of glass, aramid, and carbon fiber systems. It also explains how delaminations, voids, porosity, fiber distortion, and fastener hole defects affect impact resistance and strength.

This chapter reviews the causes and cases associated with the problems originated by tempering of steels. To provide background on this phenomenon, a brief description of the martensite reactions and the steel heat treatment of tempering is given to review the different stages of microstructural transformation. A section describing the types of embrittlement from tempering, along with mechanical tests for the determination of temper embrittlement (TE), is presented. Various factors involved in the interaction of the TE phenomenon with hydrogen embrittlement and liquid-metal embrittlement are also provided. The cases covered are grinding cracks on steel cam shaft and transgranular and intergranular crack path in commercial steels.

With the commercialization of heavier and lighter ion beams, adoption of focused ion beam (FIB) use for analysis of challenging regions of interest (ROI) has grown. In this chapter, the authors focus on highlighting commercially available and complementary FIB technologies and their implementation challenges and application trends.

This chapter describes the physical characteristics, properties, and behaviors of solid solutions under equilibrium conditions. It begins with a review of a single-component pure metal system and its unary phase diagram. It then examines the solid solution formed by copper and nickel atoms. It discusses the difference between interstitial and substitutional solid solutions and the factors that determine the type of solution that two metals are likely to form. It also addresses the development of intermediate phases, the role of free energy, transformation kinetics, liquid-to-solid and solid-state phase transformations, and the allotropic nature of metals.