Failure analysis can sometimes involve considerations of statistics and probability. This chapter reviews some of the basic types of statistical distributions in order to understand some basic principles in their use. The main focus is on the uses of the normal distribution, which is the most commonly used statistical distribution. The chapter also includes a section discussing the reliability and probability of passing.

A successful heat treating operation is determined by the ability to satisfy the customer's quality requirements consistently and economically. This chapter reviews the steps that are important to produce quality parts in heat treating with a brief practical explanation of each. The steps include selecting proper material and design of the part being treated; determining whether the process is capable of heat treatment; using statistical process control, control charting, and in-process inspection and testing; and applying statistical quality control and final testing (sampling) to verify the results.

This chapter surveys both basic quality and basic reliability concepts as an introduction to the failure analysis professional. It begins with a section describing the distinction between quality and reliability and moves on to provide an overview of the concept of experiment design along with an example. The chapter then discusses the purposes of reliability engineering and introduces four basic statistical distribution functions useful in reliability engineering, namely normal, lognormal, exponential, and Weibull. It also provides information on three fundamental acceleration models used by reliability engineers: Arrhenius, Eyring, and power law models. The chapter concludes with information on failure rates and mechanisms and the two techniques for uncovering reliability issues, namely burn-in and outlier screening.

This appendix identifies producers, suppliers, and service providers experienced with superalloy materials and applications. It also identifies potential sources of engineering information and property data.

The results of certain heat treating processes must be verified for case quality and case depth by destructively sectioning a part or parts that were subjected to the process. Test coupons or test pins are often used for diffusion processes such as carburizing, carbonitriding, nitriding, and ferritic nitrocarburizing to provide an accurate heat treating process evaluation. This appendix briefly describes the advantages and selection and design considerations of test coupons. A typical example of the use of test pins for monitoring carburizing and hardening of gears is provided.

The inspection of castings normally involves checking for shape and dimensions, coupled with aided and unaided visual inspection for external discontinuities and surface quality. This chapter discusses methods for determining surface quality, internal discontinuities, and dimensional inspection. Casting defects including porosity, oxide films, inclusions, hot tears, metal penetration, and surface defects are reviewed. Liquid penetrant inspection, magnetic particle inspection, eddy current inspection, radiographic inspection, ultrasonic inspection, and leak testing for castings are discussed. The chapter provides information on the procedures involved in the inspection of castings that are limited to visual and dimensional inspections, weight testing, and hardness testing. It also discusses the use of computer equipment in foundry inspection operations.

Electronics spans a number of devices, their configurations, and properties. A challenge is to identify those electronic subjects essential for failure analysis. This article reviews the normal operation and terminal characteristics of MOSFET. It describes the electronic behavior of bridges, opens, and parametric delay defects, which is essential for understanding the symptoms of a failing IC. These electronic principles are then applied to a CMOS failure analysis technique using a power supply signature analysis.

Semiconductor memories are superb drivers for process yield and reliability improvement because of their highly structured architecture and use of aggressive layout rules. This combination provides outstanding failure signature analysis possibilities for the entire design, manufacturing, and test process. This article discusses five key disciplines of the signature analysis process that need to be orchestrated within the organization: design for test practices, test floor data collection methodology, post-test data analysis tools, root cause theorization, and physical failure analysis strategies.

After the failure analysis team hypothesizes failure causes, prepares a failure mode assessment and assignment, and evaluates all potential failure causes, it may find in some cases that several causes are still suspect but cannot be confirmed. In this situation, an experiment is necessary to confirm or rule out suspected causes. This chapter discusses two predominant methods for doing this, namely analysis of variance (ANOVA) and Taguchi methods (a more powerful technique based on ANOVA).

This chapter presents guidelines for product designers to choose the best process and alloys while designing a casting. The discussion covers some of the factors pertinent to the selection of the best process for the product function and performance, namely geometric factors, mechanical properties, tooling cost per piece, and overall cost factors. The chapter contains tables listing several markets, products, popular processes, and common alloys and the common processes used for a variety of markets and products.

A product pedigree describes its design and how it was built and shows that it was built in accordance with the drawings and other documentation defining the product configuration. Evaluating the pedigree of a failed product can help to rule in or rule out hypothesized failure causes. This chapter describes various areas that can be examined by the failure analysis team to assess the pedigree of the failed system. If the failure analysis team suspects product pedigree anomalies it should confirm conformance through independent means.

Photon emission (PE) is one of the major optical techniques for contactless isolation of functional faults in integrated circuits (ICs) in full electrical operation. This article describes the fundamental mechanisms of PE in silicon based ICs. It presents the opportunities of contactless characterization for the most important electronic device, the MOS - Field Effect Transistor, the heart of ICs and their basic digital element, the CMOS inverter. The article discusses the specification and selection of detectors for proper PE applications. The main topics are image resolution, sensitivity, and spectral range of the detectors. The article also discusses the value and application of spectral information in the PE signal. It describes state of the art IC technologies. Finally, the article discusses the applications of PE in ICs and also I/O devices, integrated bipolar transistors in BiCMOS technologies, and parasitic bipolar effects like latch up.

This chapter presents an overview of microprocessor and application specific integrated circuit (IC) testing. It begins with a description of key industry trends that will impact how ICs will be tested in the future. Next, it provides a brief description of the most common tests applied in the IC industry, where technical issues that are causing methodology changes are emphasized. These include functional testing, structural testing, scan-based delay testing, built-in self-testing, memory testing, analog circuit testing, system-on-a-chip testing, and reliability testing. Trends discussed have driven the development of novel focus areas in test and the chapter discusses several of those areas, including test data volume containment, test power containment, and novel methods of defect-based test.

Failure mode assessment and assignment (FMA&A) is a tool designed to help organize the evaluation of hypothesized failure modes. This chapter begins by describing the process of preparing an FMA&A. It then describes the follow-on activities to evaluate the hypothesized failure cause. The chapter also provides information on evaluating the hypothesized potential causes.

This chapter discusses composite testing procedures, including tension, compression, shear, flexure, and fracture toughness testing as well as adhesive shear, peel, and honeycomb flatwise tension testing. It also discusses specimen preparation, environmental conditioning, and data analysis.

Ceramics normally have high melting temperatures, excellent chemical stability and, due to the absence of conduction electrons, tend to be good electrical and thermal insulators. They are also inherently hard and brittle, and when loaded in tension, have almost no tolerance for flaws. This chapter describes the applications, properties, and behaviors of some of the more widely used structural ceramics, including alumina, aluminum titanate, silicon carbide, silicon nitride, zirconia, zirconia-toughened alumina (ZTA), magnesia-partially stabilized zirconia (Mg-PSZ), and yttria-tetragonal zirconia polycrystalline (Y-TZP). It also provides information on materials selection, design optimization, and joining methods, and covers every step of the ceramic production process.

This chapter targets areas that determine if a change occurred and if the change induced the failure: change or what's different analysis. It describes the different sources of changes that induce process deficiencies: design, process, test and inspection, environmental, supplier lot, aging, and supplier changes. The chapter presents an example of a cluster bomb failure to explain how the failure analysis team found and corrected the failure cause.

This chapter discusses the operating mechanism, applications, advantages, and limitations of Brinell hardness testing, Rockwell hardness testing, Vickers hardness testing, Scleroscope hardness testing, and microhardness testing. In addition, the general precautions and selection criteria to be considered are described and details of equipment setup provided.

In forgings of both ferrous and nonferrous metals, the flaws that most often occur are caused by conditions that exist in the ingot, by subsequent hot working of the ingot or the billet, and by hot or cold working during forging. The inspection methods most commonly used to detect these flaws include visual, magnetic particle, liquid penetrant, ultrasonic, eddy current, and radiographic inspection. This chapter provides a detailed discussion on the characteristics, process steps, applications, advantages, and limitations of these methods. It also describes the flaws caused by the forging operation and the principal factors that influence the selection of a nondestructive inspection method for forgings.