This chapter provides guidelines for conducting metallographic evaluations and offers suggestions on how to effectively report the results. It explains how the approach depends on the objective of the evaluation, which is usually to measure a structural feature, test a hypothesis, or investigate structure-related effects. The chapter addresses each case, tailoring its guidelines and suggestions accordingly.

Root cause of failure in automotive electronics cannot be explained by the failure signatures of failed devices. Deeper investigations in these cases reveals that a superimposition of impact factors, which can never be represented by usual qualification testing, caused the failure. This article highlights some of the most frequent early life failure types in automotive applications. It describes some of the critical things to be considered while handling packages and printed circuit board layout. The article also provides information on failure anamnesis that shows how to use history, failure signatures, environmental conditions, regional failure occurrences, user profile issues, and more in the failure analysis process to improve root cause findings.

This article discusses various factors influencing general polymeric behavior, ductile-brittle transitions, crazing, and the brittle fracture of polymeric materials. The discussion covers the effects of environment on glassy thermoplastic, several parametric descriptions of craze initiation, the kinetics of craze growth, and the effect of crazing on toughness of the plastic. In addition, the article provides information on various tests to determine stress-to-craze value, strain-to-craze value, and fracture toughness of the plastic.

This article is a detailed account of the mechanisms of fatigue failure of polymers, namely thermal fatigue failure and mechanical fatigue failure. The mechanical fatigue failure is discussed in terms of fatigue crack initiation and fatigue crack propagation.

This chapter discusses the conditions and sequence of events that lead to stress-corrosion cracking (SCC) and the mechanisms by which it progresses. It explains that the stresses involved in SCC are relatively small and, in most cases, work in combination with the development of a surface film. It describes bulk and surface reactions that contribute to SCC, including dissolution, mass transport, absorption, diffusion, and embrittlement, and their role in crack nucleation and growth. It also discusses crack tip chemistry, grain-boundary interactions, and the effect of stress-intensity on crack propagation rates, and describes several mechanical fracture models, including corrosion tunnel, film-induced cleavage, and tarnish rupture models.

Diagnosing the root cause of a failure is particularly challenging if the symptom of the failure is not consistently observable. This article focuses on Laser Assisted Device Alteration/Soft Defect Localization (LADA/SDL), a global fault isolation technique, for detecting such failures. The discussion begins with a section describing the three steps in LADA/SDL analysis setup: create the test loop with the fail flag and loop trigger, select the laser dwell time, and select the shmoo bias point. An overview of LADA/SDL workflow is then presented followed by a brief section on time-resolved LADA. The closing pages of the article consider in detail SDL laser interaction physics and LADA laser interaction physics.

This chapters discusses the basic steps in the failure analysis process. It covers examination procedures, selection and preservation of fracture surfaces, macro and microfractography, metallographic analysis, mechanical testing, chemical analysis, and simulated service testing.

The scanning acoustic microscope (SAM) is an important tool for development of improved molded and flip chip packages. The SAM used for integrated circuit inspection is a hybrid instrument with characteristics of both the Stanford SAM and the C-scan recorder. This chapter presents the historical development of SAM for integrated circuit package inspection, SAM theory, and analysis considerations. Case studies are presented to illustrate the practical applications of SAM. Other non-destructive imaging tools are briefly discussed, as well as SAM challenges and methods including spectral signature analysis and GHz-SAM.

This chapter presents a fracture-mechanics-based approach to damage tolerance, accounting for mechanical, metallurgical, and environmental factors that drive crack development and growth. It begins with a review of stress-intensity factors corresponding to a wide range of crack geometries, specimen configurations, and loading conditions. The discussion covers two- and three-dimensional cracks as well as the use of correction factors and problem-simplification techniques for dealing with nonstandard configurations. The chapter goes on to describe how fatigue loading affects crack growth rates in each of the three stages of progression. Using images, diagrams, and data plots, it reveals how cracks advance in step with successive stress cycles and explains how fatigue crack growth rates can be determined by examining striations on fracture specimens and correlating their widths with stress profiles. It also describes how material-related factors, load history, corrosion, and temperature affect crack growth rates, and discusses the steps involved in life assessment.

Compared with other deformation processes used to produce semifinished products, the hot-working extrusion process has the advantage of applying pure compressive forces in all three force directions, enhancing workability. The available variations in the extrusion process enable a wide spectrum of materials to be extruded. This chapter focuses on the processes involved in the extrusion of semifinished products in various metals and their alloys, namely tin, lead, lead-base soft solders, tin-base soft solders, zinc, magnesium, aluminum, copper, titanium, zirconium, iron, nickel, and powder metals. It discusses their properties and applications as well as suitable equipment for extrusion. It further discusses the processes involved in the extrusion of semifinished products in exotic alloys and extrusion of semifinished products from metallic composite materials.