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Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2010
DOI: 10.31399/asm.tb.scm.t52870307
EISBN: 978-1-62708-314-0
..., and heat damage. It is therefore important to minimize forces and heat generation during machining. During metallic machining, the chips help to remove much of the heat generated during the cutting operation. Because of the much lower thermal conductivity of the fibers (especially glass and aramid), heat...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2010
DOI: 10.31399/asm.tb.omfrc.t53030067
EISBN: 978-1-62708-349-2
... will destroy the polishing cloth and cause significant damage to the sample. To make these types of specimens ready for grinding and final polishing, it is necessary that the honeycomb is impregnated with a mounting resin. This is accomplished using a thin abrasive blade and making cuts through the honeycomb...
Series: ASM Technical Books
Publisher: ASM International
Published: 30 November 2023
DOI: 10.31399/asm.tb.ceeg.t59370145
EISBN: 978-1-62708-447-5
... (or reverbs); stack melting furnaces (also called stack melters), tower melting furnaces, or jet melting furnaces; and electric coreless induction furnaces are detailed in this chapter. Factors influencing the choice of the melting, holding, and dozing equipment are presented. Equipment for recycling machined...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110144
EISBN: 978-1-62708-247-1
... pocket access. Stacked die requires strategies to determine which die are sacrificially removed as the target die is approached for analysis and/or deprocessing. Background Package sample preparation has moved into the mainstream of FA in the last 5-10 years. While Moore’s law is concluding...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2023
DOI: 10.31399/asm.tb.edfatr.t56090131
EISBN: 978-1-62708-462-8
... neural networks have been trained to detect and classify PCB defects, improve signal-to-noise ratios in SEM images, recognize wafer failure patterns, and predict failure modes. It explains how new packaging strategies, particularly stacking and disintegration, complicate fault isolation and evaluates...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110550
EISBN: 978-1-62708-247-1
... Abstract The complexity of semiconductor chips and their packages has continuously challenged the known methods to analyze them. With larger laminates and the inclusion of multiple stacked die, methods to analyze modern semiconductor products are being pushed toward their limits to support...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 March 2000
DOI: 10.31399/asm.tb.aet.t68260055
EISBN: 978-1-62708-336-2
... with section contact and discharging belts. Source: SMS Engineering Inc. Due to constant demand for rising productivity and cost effectiveness for the future, greater automation continues to grow in the extrusion industry. Demands for cutting and stacking sections have been satisfied. One of the most...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2023
DOI: 10.31399/asm.tb.edfatr.t56090021
EISBN: 978-1-62708-462-8
... through-silicon via (TSV) technology, allowing for direct 3D stacking of static random access memory (SRAM) on top of logic dies for a smaller package footprint and micro-bump pitch of 30 μm. To ensure reliable TSV interconnectivity, Samsung will leverage their cutting-edge extreme ultraviolet (EUV...
Book Chapter

By Soumya Subramonian
Series: ASM Technical Books
Publisher: ASM International
Published: 01 August 2012
DOI: 10.31399/asm.tb.smfpa.t53500001
EISBN: 978-1-62708-317-1
... and Stresses The cutting forces do not act linearly along the cutting edge. Instead, the vertical force, F V , and horizontal force, F H , act in a small area near the cutting edge, as shown in Fig. 1.3 ( Ref 1.2 ). Fig. 1.3 Force distribution in the workpiece during blanking. Source: Ref...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2010
DOI: 10.31399/asm.tb.sap.t53000017
EISBN: 978-1-62708-313-3
... at high temperatures. Similar considerations apply to the hardening of the γ′ phase. Solid-solution hardening also has the effect of decreasing the stacking fault energy (SFE) in the crystal lattice, leading primarily to inhibition of dislocation cross slip, which is the main deformation mode...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 October 2021
DOI: 10.31399/asm.tb.ciktmse.9781627083898
EISBN: 978-1-62708-389-8
Series: ASM Technical Books
Publisher: ASM International
Published: 01 June 2008
DOI: 10.31399/asm.tb.emea.t52240017
EISBN: 978-1-62708-251-8
... lattice parameters. Grain boundaries and phase boundaries are independent of crystal structure, while coherent phase boundaries, twin boundaries, and stacking faults depend on the crystalline structure. 2.4.1 Grain Boundaries The most important surface defect is the grain boundary. Most metals...
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2013
DOI: 10.31399/asm.tb.mfub.t53740163
EISBN: 978-1-62708-308-9
... (60 in.) thick, though some sacrifice in quality occurs near both ends of this range. With very thin material, operators may have some difficulty in keeping heat input low to avoid melting the kerf edges and to minimize distortion. Steel under 6.4 mm (0.250 in.) thick often is stacked for cutting...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 March 2002
DOI: 10.31399/asm.tb.mgppis.t60400169
EISBN: 978-1-62708-258-7
..., the next important step is usually cutting a metallographic specimen (or specimens) from the material that has been submitted. In most cases, the submitted material will be too large for a metallographic investigation, and appropriately sized specimens must be removed. The key is to think before you cut...
Series: ASM Technical Books
Publisher: ASM International
Published: 30 November 2023
DOI: 10.31399/asm.tb.ceeg.t59370187
EISBN: 978-1-62708-447-5
... moving to an in-line automated x -ray unit (automated defect recognition, ADR) to have its internal soundness checked. Surface defects are checked visually by an operator before the castings are stacked on racks for heat treatment. Fig. 10.2 Low-pressure permanent mold casting machine. Source...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 September 2008
DOI: 10.31399/asm.tb.fahtsc.t51130537
EISBN: 978-1-62708-284-6
...–1500 (b) Free-cutting carbon steels 1137 830–855 1525–1575 1138 815–845 1500–1550 1140 815–845 1500–1550 1141 800–845 1475–1550 1144 800–845 1475–1550 1145 800–845 1475–1550 1146 800–845 1475–1550 1151 800–845 1475–1550 1536 815–845 1500–1550 1541...
Series: ASM Technical Books
Publisher: ASM International
Published: 31 December 2020
DOI: 10.31399/asm.tb.phtbp.t59310001
EISBN: 978-1-62708-326-3
... diagrams face-centered cubic grain boundaries hexagonal close-packed line defects planar defects point defects solid solution solubility limit volume defects THE BUILDING BLOCK of all matter, including metals, is the atom, which means “unable to be cut” in Greek. The concept of the atom...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 September 2005
DOI: 10.31399/asm.tb.gmpm.t51250089
EISBN: 978-1-62708-345-4
... Abstract Metal removal processes for gear manufacture can be grouped into two general categories: rough machining (or gear cutting) and finishing (or high-precision machining). This chapter discusses the processes involved in machining for bevel and other gears. The chapter describes the type...
Series: ASM Technical Books
Publisher: ASM International
Published: 30 November 2023
DOI: 10.31399/asm.tb.ceeg.9781627084475
EISBN: 978-1-62708-447-5
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2023
DOI: 10.31399/asm.tb.edfatr.9781627084628
EISBN: 978-1-62708-462-8