1-20 of 70 Search Results for

sputtering

Follow your search
Access your saved searches in your account

Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Series: ASM Technical Books
Publisher: ASM International
Published: 01 July 2009
DOI: 10.31399/asm.tb.bcp.t52230131
EISBN: 978-1-62708-298-3
... resistance, and density. It explains how beryllide intermetallics are formed using sputter deposition, diffusion, and powder metal methods. beryllides intermetallic compounds mechanical properties oxidation resistance thermal properties 11.1 Background and Historical Information 11.2...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 July 2009
DOI: 10.31399/asm.tb.bcp.t52230361
EISBN: 978-1-62708-298-3
...Abstract Abstract This chapter discusses coating technologies that are applicable to beryllium, including physical and chemical vapor deposition, thermal evaporation, electroplating, sputtering, ion plating, and plasma arc spraying. It describes the advantages and disadvantages of each method...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110413
EISBN: 978-1-62708-247-1
... Reflectivity, color, phase contrast, bright field/dark field, polarization Sample loading Slow – requires vacuum Fast – no vacuum Sample preparation May require sectioning or delayering, Insulating samples may need sputter coating Usually none - dielectrics are transparent, No problem with insulating...
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 January 2015
DOI: 10.31399/asm.tb.spsp2.t54410551
EISBN: 978-1-62708-265-5
... heating of the specimen is generated by energy input of the plasma at normal current densities of approximately 0.2 mA/cm 2 (1.3 mA/in. 2 ) ( Ref 22.17 ). Plasma carburizing is accomplished by establishing a vacuum, heating the load to carburizing temperatures while sputter cleaning in a hydrogen...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110447
EISBN: 978-1-62708-247-1
... layer using O 2 + as sputter projectile. The profile clearly shows the sputter beam induced diffusion of the mobile ions through the dielectric layer and, pilling up at the SiO 2 /Si interface. Figure 16 Depth profiles of Li + , Na + and K + implants in a 200 nm SiO 2 dielectric layer...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110323
EISBN: 978-1-62708-247-1
.... Figure 26 Completed backside silicon removed inverted cross-section TEM sample. Figure 4 This figure shows secondary electron emission yield plotted as a function of time during backside silicon substrate sputtering. A clear uptick in the signal occurs when the remaining silicon...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110335
EISBN: 978-1-62708-247-1
... 1 pA - 2.5 μA Operating beam energy range 10 keV - 35 keV 0.5 keV - 30 keV 2 - 30 keV Probe size at 30 keV 0.35 nm for He + , 1.9 nm for Ne + [2] 5 nm @ 1 pA [2] 25nm (@1 pA) [3] Sputter yield @ 30 kV (Si atoms per incident ion) 1.15 for Ne + [7] 2.42 for Ga + [7] 2.73...
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2003
DOI: 10.31399/asm.tb.cfap.t69780383
EISBN: 978-1-62708-281-5
... removal of atoms or clusters from solid surfaces. Mass analysis of the sputtered particles is the basis of the static SIMS technique. Simultaneous Auger electron spectroscopy analysis of the bottom of the etch crater produces chemical depth profiles. Fig. 20 Comparison of zinc LMM Auger peak...
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2013
DOI: 10.31399/asm.tb.mfub.t53740325
EISBN: 978-1-62708-308-9
... of atoms, ions, or molecules of the coating species. There are three main techniques for applying PVD coatings: thermal evaporation, sputtering, and ion plating. Thermal evaporation involves heating of the material until it forms a vapor that condenses on a substrate to form a coating. Sputtering involves...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110351
EISBN: 978-1-62708-247-1
... and Ga ion sputtering into Si and Cu samples at a range of energies from 9 KeV to 35 keV. [95] Figure 48 A neon beam was used to machine a trench through Si and stop on transistor diffusion fins and poly (metal-gate) regions from the backside of a 22 nm device. [99] Figure 41...
Series: ASM Technical Books
Publisher: ASM International
Published: 30 April 2021
DOI: 10.31399/asm.tb.tpsfwea.t59300335
EISBN: 978-1-62708-323-2
... or sputter materials so that ions, atoms, or molecules of an additive material are coated onto a substrate. Most of these coatings are only a few micrometers thick, and most are now applied in graded format. If a substrate is a soft steel, a base coating of something with a hardness of 500 HV may be applied...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2000
DOI: 10.31399/asm.tb.htgpge.t67320159
EISBN: 978-1-62708-347-8
... pressure in the vessel is set to between 0.1 to 10 torr (0.13–13.3 × 10 2 Pa). At this point, electric voltage is switched on and a glow discharge takes place; the nitrogen ions thus produced strike the surface of the cathode with high kinetic energy emitting heat that results in a sputtering...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 March 2001
DOI: 10.31399/asm.tb.secwr.t68350125
EISBN: 978-1-62708-315-7
.... Corrosion and wear resistance. Dry lubricants. Thicker engineering coatings Sputtering RT–0.7 T m of metal coatings. Best >200 for nonmetals Line of sight Metals, alloys, glasses, oxides. TiN and other compounds (a) Electronic, optical, wear resistance. Architectural (decorative). Generally...
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 July 2009
DOI: 10.31399/asm.tb.bcp.t52230523
EISBN: 978-1-62708-298-3
.... , 1982b . Chemical Vapor Deposition, Surface Cleaning, Finishing, and Coating , Vol 5 , Metals Handbook , 9th ed. , American Society for Metals , p 381 – 386 Bohdansky J. , and Roth J. , 1984 . Light Ion Sputtering of Low Z Materials in the Temperature Range 20–1100 °C , J. Nucl...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 March 2002
DOI: 10.31399/asm.tb.mgppis.t60400149
EISBN: 978-1-62708-258-7
...). 500× Fig. 6.23 A vacuum sputtering device used to deposit a thin coating of gold, or some other element, onto the surface of a SEM or EMPA specimen. Source: Polaron Instruments, Inc. Abstract Abstract Several specialized instruments are available for the metallographer to use...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110513
EISBN: 978-1-62708-247-1
... probe, mounted close to the throttle housing. Fig. 5 If the capacitance of a charged capacitor is reduced, the voltage increases. The same applies if charge separation happens within spraying/sputtering of powders, liquids and sometimes even within high-speed gas flows. Fig. 6...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 July 2009
DOI: 10.31399/asm.tb.bcp.9781627082983
EISBN: 978-1-62708-298-3
Series: ASM Technical Books
Publisher: ASM International
Published: 01 August 2018
DOI: 10.31399/asm.tb.msisep.t59220085
EISBN: 978-1-62708-259-4
... in a specimen. This technique has its own difficulties and requires constant care. Some recommended publications for the beginner to advanced user are included in Refs 12 to 14 . Fig. 6.9 Sample removal and thinning using FIB. In a sample where the microstructure was revealed by FIB sputtering...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110402
EISBN: 978-1-62708-247-1
... generally do not require a coating, as sputter coatings of heavy elements such as Pt, Cr, or Au could damage delicate surface structures. However, if coatings are applied for charge reduction in the SEM, very short sputter cycles should be used to minimize possible damage to the surface. A very thin coating...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110144
EISBN: 978-1-62708-247-1
... temperature and preventing heat absorption and metallization sputtering. [5] Figure 5 Decapsulation of laser-ablated PBGA microcircuit using downstream microwave plasma. This takes about two hours on an older 300-watt system, and less than 20 minutes on the newer 500-watt systems. [6...