This article provides an overview of how to use the scanning electron microscope (SEM) for imaging integrated circuits. The discussion covers the principles of operation and practical techniques of the SEM. The techniques include sample mounting, sample preparation, sputter coating, sample tilt and image composition, focus and astigmatism correction, dynamic focus and image correction, raster alignment, and adjusting brightness and contrast. The article also provides information on achieving ultra-high resolution in the SEM. It concludes with information on the general characteristics and applications of environmental SEM.

This chapter explains how to prepare material samples for optical microscopy, the most common method for characterizing the microstructure of cast iron and steel. It provides information on sectioning, mounting, polishing, etching, and recording. It describes the nature of surface roughness, the factors that contribute to it, and its effect on image quality. It discusses the use of fixturing and holding devices, includes photographic examples of polishing defects and drying marks, and provides an overview of micrographic etchants and the features they reveal. It also describes the steps involved in replicating part surfaces.

This chapter discusses the practices and procedures used to reveal and record macrostructural features such as hardening depth, weld thickness, crack size, porosity, hot folds, and machining and tooling marks. It provides information on sectioning, sample location, orientation, surface grinding, and etching. It describes macrographic etchants and the features they reveal along with common etching problems and how to avoid them. It explains how to evaluate etching results and how they can be improved using remedial processes such as light grinding. It also discusses photographic reproduction, lighting, and image enhancement techniques.

This chapters discusses the basic steps in the failure analysis process. It covers examination procedures, selection and preservation of fracture surfaces, macro and microfractography, metallographic analysis, mechanical testing, chemical analysis, and simulated service testing.

This chapter discusses composite testing procedures, including tension, compression, shear, flexure, and fracture toughness testing as well as adhesive shear, peel, and honeycomb flatwise tension testing. It also discusses specimen preparation, environmental conditioning, and data analysis.

This chapter instructs the metallographer on the basic skills required to prepare a polished metallographic specimen. It is organized in a chronological sequence starting with the information-gathering process on the material being investigated, then moving on to sectioning, mounting, grinding, and polishing processes, and ending with methods used to properly store metallographic specimens. The discussion covers the preparation procedures, the materials being investigated, and equipment used to perform these procedures.

This chapter discusses the important role of metallography and the metallographer in predicting and understanding the properties of metals and alloys. Examples are presented of a metallographer working as part of a team in a research laboratory of a large steel company and a metallographer working alone at a small iron foundry. The three basic areas in all metallography laboratories are discussed: the specimen preparation area, the polishing/etching area, and the observation/micrography area. Important safety issues in a metallographic laboratory are also considered.

This chapter discusses the important aspects that a metallographer should understand in order to effectively reveal a microstructure. It begins by exploring etching response and how it can be a tool for revealing various microstructural features. The next part of the chapter discusses methods for revealing microstructure in the as-polished (unetched) specimen, then guidelines for selecting and using etchants when needed. The chapter discusses different types of etchants in terms of their ingredients, etching procedure, and major uses. The etchants discussed include basic etchants (nital and picral and their variations) and tint etchants for carbon and low-alloy steels and cast irons, and basic etchants for stainless steels. Finally, information is provided on different illumination methods (differential interference contrast and dark-field illumination) that can be used to highlight certain features in microstructures.

This chapter describes the various features of the metallurgical microscope. Key concepts are defined such as resolving power, the virtual image, bright- and dark-field illumination, numerical aperture, focal length, image contrast, depth of field, and spherical and chromatic aberration. Metallurgical microscope features such as apochromatic objectives, hyperplane oculars, vertical illuminators, counting reticles, widefield oculars, polarization filters, field diaphragms, interferometers, and tungsten-halogen lamps are explained. The optical system, nosepiece, types of objectives (the lens assembly close to the specimen) and eyepieces, and components of the illumination system are all explained. The last part of this chapter describes special procedures involved in using and calibrating the metallurgical microscope.

Several specialized instruments are available for the metallographer to use as tools to gather key information on the characteristics of the microstructure being analyzed. These include microscopes that use electrons as a source of illumination instead of light and x-ray diffraction equipment. This chapter describes how these instruments can be used to gather important information about a microstructure. The instruments covered include image analyzers, transmission electron microscopes, scanning electron microscopes, electron probe microanalyzers, scanning transmission electron microscopes, x-ray diffractometers, microhardness testers, and hot microhardness testers. A list of other instruments that are usually located in a research laboratory or specialized testing laboratory is also provided.

Microstructures can be altered intentionally or unintentionally. In some cases, metallographers must diagnose what may have happened to the steel or cast iron based on the microstructural details. This chapter discusses how microstructure in steels and cast irons can be intentionally altered during heat treatment, solidification, and deformation (hot and cold working). Some specific examples are then shown to illustrate what can go wrong through unintentional changes in microstructure, for example, the loss of carbon from the surface of the steel by the process known as decarburization or the buildup of brittle carbides on the grain boundaries of an austenitic stainless steel by the process known as sensitization.

Corrosion testing and monitoring are powerful tools in the fight to control corrosion. This chapter provides a general overview of three major categories of corrosion tests, namely laboratory tests, pilot-plant tests, and field tests. It begins with brief sections describing the purposes of corrosion tests, the logical steps in a test program, and the preparation and cleaning of test specimens. The focus then moves on to discuss the types and applications of these test categories and the associated evaluation procedures. Excluding electrochemical tests which are addressed separately in this chapter, the other laboratory tests covered under this category are simulated atmosphere tests, salt-spray tests, and immersion tests. Only corrosion testing in the atmosphere is discussed in the section on field tests. Corrosion monitoring techniques are finally considered, covering the characteristics of corrosion monitoring techniques, the factors to be considered in selecting a corrosion-monitoring method, and the strategies in corrosion monitoring.

This chapter explains how to prepare metallographic samples for light microscopy and how to anticipate and avoid related problems. It describes standard practices and procedures for sectioning, mounting, grinding, and polishing and identifies common defects along with their causes and cures. It also provides recommendations for handling specific materials and addresses safety concerns.

This chapter describes the methods and equipment applicable to metallographic studies and discusses the preparation of specimens for examination by light optical microscopy. Five major operations for preparation of metallographic specimens are discussed: sectioning, mounting, grinding, polishing, and etching. The discussion covers their basic principles, advantages, types, and applications, as well as the equipment setup. The chapter includes tables that list etchants used for microscopic examination. It also provides information on microscopic examination, microphotography, and the effects of grain size on the structural properties of the material.

This chapter addresses the challenge of selecting an appropriate stress-corrosion cracking (SCC) test to evaluate the serviceability of a material for a given application. It begins by establishing a generic model in which SCC is depicted in two stages, initiation and propagation, that further subdivide into several zones plus a transition region. It then discusses SCC test standards before describing basic test objectives and selection criteria. The chapter explains how to achieve the required loading conditions for different tests and how to prepare test specimens to determine elastic strain, plastic strain, and residual stress responses. It also describes the difference between smooth and precracked specimens and how they are used, provides information on slow-strain-rate testing and how to assess the results, and discusses various test environments and procedures, including tests for weldments. The chapter concludes with a section on how to interpret time to failure, threshold stress, percent survival, stress intensity, and propagation rate data, and assess the precision of the associated tests.

The ultimate goal of the failure analysis process is to find physical evidence that can identify the root cause of the failure. Transmission electron microscopy (TEM) has emerged as a powerful tool to characterize subtle defects. This article discusses the sample preparation procedures based on focused ion beam milling used for TEM sample preparation. It describes the principles behind commonly used imaging modes in semiconductor failure analysis and how these operation modes can be utilized to selectively maximize signal from specific beam-specimen interactions to generate useful information about the defect. Various elemental analysis techniques, namely energy dispersive spectroscopy, electron energy loss spectroscopy, and energy-filtered TEM, are described using examples encountered in failure analysis. The origin of different image contrast mechanisms, their interpretation, and analytical techniques for composition analysis are discussed. The article also provides information on the use of off-axis electron holography technique in failure analysis.

The objective of mechanical testing of an engineered material is to provide data necessary for the analysis, design, and fabrication of structural components using the material. The testing of filament-wound composite materials offers unique challenges because of the special characteristics of composites. This chapter describes suitable static mechanical test techniques for characterizing laminated composite materials. The approach is to provide recommended techniques, based on consensus opinions of fabricators and users of filament-wound composites, and to survey available techniques that have been used successfully in the field. The chapter describes the effects of various factors on the properties of composite constituents, including fibers, resins, and unidirectional plies. Some aspects of specimen selection are also described. The chapter provides information on pressure bottles and tubular parts that have been developed as standard test specimens for combined load testing of composites.

This chapter provides an overview of the tools and techniques used to examine failure specimens and the wealth of information that can be obtained from fracture surfaces, cracks, wear patterns, and other such features. It discusses the use of metallography, fractography, and optical and electron microscopy. It presents a number of images recorded using these methods and explains what they reveal about the mode of fracture and the state of the component prior to failure.

This chapter discusses the basic steps of a failure investigation. It explains that the first step is to gather and document information about the failed component and its operating history. It advises investigators to visit the failure site as soon as possible to record damages and collect test specimens for subsequent examination and chemical analysis. It also discusses the role of mechanical property testing, the use of nondestructive evaluation, and the final step of generating a report.