Superalloys are susceptible to damage from a variety of surface contaminants. They may also require special surface finishes for subsequent processing steps such as coating applications. This chapter describes some of the cleaning and finishing procedures that have been developed for superalloys and how they work. It discusses the effect of metallic contaminants, tarnish, oxide, and scale and how they can be detected and removed. It also discusses chemical and mechanical surface finishing techniques and where they are used, and presents several application examples.

This chapter describes the methods and equipment applicable to metallographic studies and discusses the preparation of specimens for examination by light optical microscopy. Five major operations for preparation of metallographic specimens are discussed: sectioning, mounting, grinding, polishing, and etching. The discussion covers their basic principles, advantages, types, and applications, as well as the equipment setup. The chapter includes tables that list etchants used for microscopic examination. It also provides information on microscopic examination, microphotography, and the effects of grain size on the structural properties of the material.

This chapter provides an overview of the possible mechanisms of failure for heat treated steel components and discusses the techniques for examining fractures, ductile and brittle failures, intergranular failure mechanisms, and fatigue. It begins with a description of the general sources of component failure. This is followed by a section on the stages of a failure analysis, which can proceed one after the other or occur at the same time. These stages of analysis are collection of background data, preliminary visual examination, nondestructive testing, selection and preservation of specimens, mechanical testing, macroexamination, microexamination, metallographic examination, determination of the fracture mechanism, chemical analysis, exemplar testing, and analysis and writing the report. The chapter ends with a discussion on various processes involved in the determination of the fracture mechanism.

The ultimate goal of the failure analysis process is to find physical evidence that can identify the root cause of the failure. Transmission electron microscopy (TEM) has emerged as a powerful tool to characterize subtle defects. This article discusses the sample preparation procedures based on focused ion beam milling used for TEM sample preparation. It describes the principles behind commonly used imaging modes in semiconductor failure analysis and how these operation modes can be utilized to selectively maximize signal from specific beam-specimen interactions to generate useful information about the defect. Various elemental analysis techniques, namely energy dispersive spectroscopy, electron energy loss spectroscopy, and energy-filtered TEM, are described using examples encountered in failure analysis. The origin of different image contrast mechanisms, their interpretation, and analytical techniques for composition analysis are discussed. The article also provides information on the use of off-axis electron holography technique in failure analysis.

Cross-sectioning refers to the process of exposing the internal layers and printed devices below the surface by cleaving through the wafer. This article discusses in detail the steps involved in common cross-sectioning methods. These include sample preparation, scribing, indenting, and cleaving. The article also provides information on options for mounting, handling, and cleaning of samples during and after the cleaving process. The general procedures, tools required, and considerations that need to be taken into account to perform these techniques are considered.

This chapter covers a wide range of finishing and coating operations, including cleaning, honing, polishing and buffing, and lapping. It discusses the use of rust-preventative compounds, conversion coatings, and plating metals as well as weld overlay, thermal spray, and ceramic coatings and various pack cementation and deposition processes. It also discusses the selection and use of industrial paints and paint application methods.

After the fault-tree, a failure-cause identification method has identified potential failure causes and the failure analysis team has prepared a failure mode assessment and assignment (FMA&A). The team knows specifically what to search for when examining components and subassemblies from the failed system. There are numerous techniques and technologies available for examining and analyzing components and subassemblies, which are categorized as follows: optical approaches, dimensional inspection and related approaches, nondestructive test approaches, mechanical and environmental approaches, and chemical and composition analysis for assessing material characteristics. This chapter is a detailed account of the working principle and the steps involved in these techniques and technologies.

This chapter explains how polymeric adhesives are applied to composite as well as metal parts, forming bonded structures. It describes surface preparation practices and techniques, epoxy selection and use, and bonding procedures.

Adhesive bonding is a widely used industrial joining process in which a polymeric material is used to join two separate pieces (the adherends or substrates). This chapter begins with a discussion on the advantages and disadvantages of adhesive bonding, followed by a section providing information on the theory of adhesion. The chapter then describes the considerations for designing adhesively bonded joints and for testing or characterizing adhesive materials. The following section covers the characteristics of the most important synthetic adhesive systems and five groups of adhesives, namely structural, hot melt, pressure sensitive, water based, and ultraviolet and electron beam cured. The chapter ends with a discussion on some general guidelines for adhesive bonding and the basic steps in the adhesive bonding process.

This chapter discusses the primary methods used to repair composites, including fill repairs, injection repairs, bolted repairs, and bonded repairs. It also discusses issues associated with field repairs.

Superalloys, except those with high aluminum and titanium contents, are welded with little difficulty. They can also be successfully brazed. This chapter describes the welding and brazing processes most often used and the factors that must be considered when making application decisions. It discusses the basic concepts of fusion welding and the differences between solid-solution-hardened and precipitation-hardened wrought superalloys. It addresses joint integrity, design, weld-related cracking, and the effect of grain size, precipitates, and contaminants. It covers common fusion welding techniques, defect prevention, fixturing, heat treatments, and general practices, including the use of filler metals. It also discusses several solid-state welding methods, superplastic forming, and transient liquid phase bonding, a type of diffusion welding process. The chapter includes extensive information on brazing processes, atmospheres, filler metals, and surface preparation procedures. It also includes examples of nickel-base welded components for aerospace use.

This chapter presents various case histories that illustrate a variety of failure mechanisms experienced by the high-strength steel components in aerospace applications. The components covered are catapult holdback bar, AISI 420 stainless steel roll pin, main landing gear (MLG) lever, inboard flap hinge bolt, nose landing gear piston axle, multiple-leg aircraft-handling sling, aircraft hoist sling, internal spur gear, and MLG axle. In addition, the chapter provides information on full-scale fatigue testing, nondestructive testing, and failure analysis of fin attach bolts.

Liquid penetrant, magnetic particle, and eddy current inspection are used to detect surface flaws. This chapter is a detailed account of the physical principles, process description, equipment requirements, selection criteria, advantages, limitations, and applications of these surface flaw detection techniques.

The decomposition of austenite, during controlled cooling or quenching, produces a wide variety of microstructures in response to such factors as steel composition, temperature of transformation, and cooling rate. This chapter provides a detailed discussion on the isothermal transformation and continuous cooling transformation diagrams that characterize the conditions that produce the various microstructures. It discusses the mechanism and process variables of quenching of steel, explaining the factors involved in the mechanism of quenching. In addition, the chapter provides information on the causes and characteristics of residual stresses, distortion, and quench cracking of steel.