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Book Chapter
Book: Principles of Soldering
Series: ASM Technical Books
Publisher: ASM International
Published: 01 April 2004
DOI: 10.31399/asm.tb.ps.t62440049
EISBN: 978-1-62708-352-2
... Abstract This chapter presents an overview and survey of solder alloy systems. Extensive reference is made to phase diagrams and their interpretation. The chapter describes the effect of metallic impurities on different solders. The chapter concludes with a review of the key characteristics...
Abstract
This chapter presents an overview and survey of solder alloy systems. Extensive reference is made to phase diagrams and their interpretation. The chapter describes the effect of metallic impurities on different solders. The chapter concludes with a review of the key characteristics of eutectic alloys and of the factors most effective at depressing the melting point of solders by eutectic alloying.
Image
Published: 01 April 2004
Fig. 3.5 (a-f) Spread tests of four common solders, melted on NiCr/Au substrates at 10 °C (18 °F) superheat, in controlled atmospheres. There is negligible benefit from a hydrogen-rich atmosphere. Although somewhat subjective, the solders melted in the 40% hydrogen atmosphere do appear
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Image
Published: 01 April 2004
Fig. 3.5 (g-l) Spread tests of four common solders, melted on NiCr/Au substrates at 10 °C (18 °F) superheat, in controlled atmospheres. There is negligible benefit from a hydrogen-rich atmosphere. Although somewhat subjective, the solders melted in the 40% hydrogen atmosphere do appear
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Image
Published: 01 April 2004
Fig. 3.14 Oxide thickness versus oxidation time for a range of solders held in air 140 °C (284 °F) above their melting point. Adapted from Dong, Schwarz, and Roth [1977 ]
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Image
Published: 01 April 2004
Fig. 3.15 Oxide growth on molten solders at an oxygen partial pressure of 1 Pa (1.5 × 10 –4 psi). Adapted from Kuhmann et al. [1998 ]
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Image
Published: 01 April 2004
Fig. 4.24 Void content versus joint length for a range of representative solders. The substrates were square coupons of polished alumina metallized with thin-film titanium/gold, applied by sputtering. The joints were made at a superheat of 25 °C, and the void level was assessed by quantitative
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Image
Published: 01 April 2004
Fig. 5.3 Stress-rupture life of joints made with low-melting-point solders, tested at room temperature. Silver-tin solder is more resilient than lead-tin eutectic, while indium-tin alloys are less able to resist creep.
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Image
Published: 01 April 2004
Fig. 5.27 Yield strength of composite solders at room temperature plotted as a function of volume fraction of the added intermetallic powder [ Yost, Hosking, and Frear 1993 ]
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Image
Published: 01 April 2004
Fig. 5.31 Tensile strength and elongation to failure of Ag-96.5Sn solders doped with cerium and lanthanum. The samples were chill-cast ingots of solder, 20 mm (0.8 in.) long by 10 mm (0.4 in.) in diameter, tested at room temperature and a strain rate of 4 × 10 –3 /s. RE, rare earth
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Image
Published: 01 April 2004
Fig. 5.32 Tensile strength and elongation to failure of Sn-9Zn solders doped with lanthanum. The samples were chill-cast ingots of solder, 25 mm (1 in.) long by 5 mm (0.2 in.) in diameter, tested at room temperature and a strain rate of 5 × 10 –3 /s. RE, rare earth
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Image
Published: 01 April 2004
Fig. 5.33 Stress-rupture life of Sn-3.5Ag and Sn-3.5Ag-0.25RE solders for an applied stress of 20 MPa (2900 psi) at 50° C (122 °F)
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Image
Published: 01 April 2004
Fig. 5.35 Contact angle and spread area of Ag-96.5Sn solders doped with cerium and lanthanum melted on copper at 300 °C (572 °F) for 30 s under cover of RMA flux. RE, rare earth
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Image
Published: 01 April 2004
Fig. 5.36 Wetting force of Sn-9Zn solders doped with lutetium on copper using rosin-activated flux at 245 °C (473 °F) in air. RE, rare earth
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Book Chapter
Series: ASM Technical Books
Publisher: ASM International
Published: 31 December 2024
DOI: 10.31399/asm.tb.hisppa.t56110245
EISBN: 978-1-62708-483-3
... Abstract This chapter discusses the critical soldering faults that lead to quality degradation and potential failure of a soldered connection. It then describes the types of nondestructive evaluations used to inspect soldered and brazed joints, including dimensional and visual inspection...
Abstract
This chapter discusses the critical soldering faults that lead to quality degradation and potential failure of a soldered connection. It then describes the types of nondestructive evaluations used to inspect soldered and brazed joints, including dimensional and visual inspection, ultrasonic testing, radiographic examination, dye penetrant inspection, and leak testing, including overpressure tests. The chapter also provides an overview of destructive physical analysis.
Book Chapter
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2011
DOI: 10.31399/asm.tb.jub.t53290165
EISBN: 978-1-62708-306-5
... Abstract Brazing and soldering processes use a molten filler metal to wet the mating surfaces of a joint, with or without the aid of a fluxing agent, leading to the formation of a metallurgical bond between the filler and the respective components. This chapter discusses the characteristics...
Abstract
Brazing and soldering processes use a molten filler metal to wet the mating surfaces of a joint, with or without the aid of a fluxing agent, leading to the formation of a metallurgical bond between the filler and the respective components. This chapter discusses the characteristics, advantages, and disadvantages of brazing and soldering. The first part focuses on the fundamentals of the brazing process and provides information on filler metals and specific brazing methods. The soldering portion of the chapters provides information on solder alloys used, selection criteria for base metal, the processes involved in precleaning and surface preparation, types of fluxes used, solder joint design, and solder heating methods.
Series: ASM Technical Books
Publisher: ASM International
Published: 01 April 2004
DOI: 10.31399/asm.tb.ps.9781627083522
EISBN: 978-1-62708-352-2
Book Chapter
Series: ASM Technical Books
Publisher: ASM International
Published: 31 December 2024
DOI: 10.31399/asm.tb.hisppa.t56110113
EISBN: 978-1-62708-483-3
... Abstract This chapter details various induction soldering processes, including soldering with manually fed solder, soldering with filler metal (preplaced) preforms, soldering with solder coating, and soldering with an automated solder wire feeder. induction soldering solder filler metals...
Abstract
This chapter details various induction soldering processes, including soldering with manually fed solder, soldering with filler metal (preplaced) preforms, soldering with solder coating, and soldering with an automated solder wire feeder.
Book Chapter
Book: Principles of Soldering
Series: ASM Technical Books
Publisher: ASM International
Published: 01 April 2004
DOI: 10.31399/asm.tb.ps.t62440189
EISBN: 978-1-62708-352-2
... Abstract This chapter presents several materials and processes related to soldering technology. It first provides information on lead-free solders, followed by sections devoted to flip-chip processes, diffusion soldering, and modeling. Scanning acoustic microscopy and fine-focus x-ray...
Abstract
This chapter presents several materials and processes related to soldering technology. It first provides information on lead-free solders, followed by sections devoted to flip-chip processes, diffusion soldering, and modeling. Scanning acoustic microscopy and fine-focus x-ray techniques are also discussed. The chapter describes several evaluation procedures and tests developed to measure solderability and standards for process calibration. The chapter also describes the characteristics of reinforced solders, amalgams used as solders, and other strategies to boost the strength of solders. Further, the chapter considers methods for quantifying the mechanical integrity of joints and predicting their dimensional stability under specified environmental conditions. It discusses the effects of rare earth elements on the properties of solders. The chapter concludes with information on advanced joint characterization techniques.
Book Chapter
Series: ASM Technical Books
Publisher: ASM International
Published: 31 December 2024
DOI: 10.31399/asm.tb.hisppa.t56110001
EISBN: 978-1-62708-483-3
... Abstract This chapter provides an introduction to induction soldering. It also illustrates the classification of the different soldering processes according to the heat source, as described in the German standard, Soldering: Categorization of Processes According to Energy Sources, Process...
Abstract
This chapter provides an introduction to induction soldering. It also illustrates the classification of the different soldering processes according to the heat source, as described in the German standard, Soldering: Categorization of Processes According to Energy Sources, Process Descriptions.
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