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soldering

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Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2011
DOI: 10.31399/asm.tb.jub.t53290165
EISBN: 978-1-62708-306-5
...Abstract Abstract Brazing and soldering processes use a molten filler metal to wet the mating surfaces of a joint, with or without the aid of a fluxing agent, leading to the formation of a metallurgical bond between the filler and the respective components. This chapter discusses...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 April 2004
DOI: 10.31399/asm.tb.ps.t62440189
EISBN: 978-1-62708-352-2
...Abstract Abstract This chapter presents several materials and processes related to soldering technology. It first provides information on lead-free solders, followed by sections devoted to flip-chip processes, diffusion soldering, and modeling. Scanning acoustic microscopy and fine-focus x-ray...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 April 2004
DOI: 10.31399/asm.tb.ps.9781627083522
EISBN: 978-1-62708-352-2
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Published: 01 November 2011
Fig. 5.8 Effects of the heat of welding, brazing, or soldering on the properties (top) and microstructure (bottom) of a work-hardened metal. Source: Ref 5.6 , p 476 More
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Published: 01 November 2011
Fig. 5.9 Effect of the heat of welding, brazing, or soldering on the properties (top) and microstructure (bottom) of an age-hardened precipitation hardenable alloy. Source: Ref 5.6 , p 478 More
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Published: 01 November 2011
Fig. 7.12 Joint designs frequently used in soldering. Source: Ref 7.10 More
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Published: 01 November 2011
Fig. 7.13 Schematic of the wave soldering process. The three important process control regions are: (A) entry, (B) interior, and (C) peel-back region. The v is velocity of printed circuit board. Source: Ref 7.12 More
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Published: 01 April 2004
Fig. 3.6 Wetting of copper by Pb-63Sn solder using rosin flux. Soldering with flux generally benefits from a protective atmosphere (unless the atmosphere detrimentally affects the chemistry of the fluxing action), because the flux has to work less to protect the substrate and filler from More
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Published: 01 April 2004
Fig. 3.27 Fluxless soldering of a GaAs monolithic microwave integrated circuit, approximately 3 × 5 mm (0.12 × 0.12 in.) achieved by application of a compressive load of 100 g/mm 2 (140 psi) during the heating cycle. Source: BAE Systems More
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Published: 01 June 1988
Fig. 10.15 Nest fixture used in induction soldering when the preform is difficult to hold in place; the nest also permits component alignment prior to joining if preassembly is inconvenient. From J. Libsch and P. Capolongo, Lepel Review , Vol 1, No. 5, p 1 ( Ref 9 ) More
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Published: 01 June 1988
Fig. 10.16 High-production induction soldering fixture utilizing a turntable and conveyor-type coil which allows continuous part movement; the inset shows an indexing arrangment for applications where localized heating is required. From J. Libsch and P. Capolongo, Lepel Review , Vol 1, No. 5, p More
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Published: 01 June 1988
Fig. 10.17 Multiple-position fixture for soldering of four assemblies at once; pressure pads ensure proper component positioning during induction soldering; the sketch at bottom illustrates positions of induction coil and solder ring. From J. Libsch and P. Capolongo, Lepel Review , Vol 1, No. 5 More
Series: ASM Technical Books
Publisher: ASM International
Published: 01 April 2004
DOI: 10.31399/asm.tb.ps.t62440049
EISBN: 978-1-62708-352-2
...Abstract Abstract This chapter presents an overview and survey of solder alloy systems. Extensive reference is made to phase diagrams and their interpretation. The chapter describes the effect of metallic impurities on different solders. The chapter concludes with a review of the key...
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Published: 01 December 2009
Fig. 12.8 Defective solder joints. Note the poor solder joints on the left side of the component. Such defects can induce open circuits or create a short circuit if the solder forms a bridge between components. Solder spatter of the type shown here can also be induced by excess energy More
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Published: 01 April 2004
Fig. 5.21 (a) Solder spread sample on a gold-plated substrate. The solder is Pb-60Sn, and the substrate is copper plated with 5 μm (200 μin.) of nickel and then 5 μm (200 μin.) of gold. At least three distinct microstructural bands are visible. (b) Micrograph of a joint made using the same More
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Published: 01 December 2006
Fig. 2.1 Soft solder with one or more flux cores (tube solder), extruded and drawn to the finished dimensions and coiled on plastic spools. Source: Collin More
Series: ASM Technical Books
Publisher: ASM International
Published: 01 August 1999
DOI: 10.31399/asm.tb.caaa.t67870161
EISBN: 978-1-62708-299-0
...Abstract Abstract This chapter describes the factors that affect the corrosion performance of aluminum assemblies joined by methods such as welding, brazing, soldering, and adhesive bonding. The factors covered include galvanic effects, crevices, and assembly stresses in products susceptible...
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 April 2004
DOI: 10.31399/asm.tb.ps.t62440245
EISBN: 978-1-62708-352-2
...Abstract Abstract This appendix contains a brief list of general references related to soldering technology. soldering Soldering Soldering • Brandon D. G. and Kaplan W. D. 1997 Joining Processes: An Introduction , JohnWiley & Sons • Frear D.R...
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 April 2004
DOI: 10.31399/asm.tb.ps.t6244000x
EISBN: 978-1-62708-352-2
...Abstract Abstract This chapter describes the origins of solders and soldering, covering the composition of solders and applications of soldering. soldering solders Origins of Solders and Soldering The word solder derives from the Old French, soudure , which in turn stems from...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 April 2004
DOI: 10.31399/asm.tb.ps.t62440103
EISBN: 978-1-62708-352-2
...Abstract Abstract Materials used in joining, whether solders, fluxes, or atmospheres, are becoming increasingly subjected to restrictions on the grounds of health, safety, and pollution concerns. These regulations can limit the choice of materials and processes that are deemed acceptable...