1-20 of 481 Search Results for

soldering

Follow your search
Access your saved searches in your account

Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2011
DOI: 10.31399/asm.tb.jub.t53290165
EISBN: 978-1-62708-306-5
... Abstract Brazing and soldering processes use a molten filler metal to wet the mating surfaces of a joint, with or without the aid of a fluxing agent, leading to the formation of a metallurgical bond between the filler and the respective components. This chapter discusses the characteristics...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 April 2004
DOI: 10.31399/asm.tb.ps.t62440189
EISBN: 978-1-62708-352-2
... Cadmium 320.8 Toxic vapor Lead 327.5 Toxic Availability of potential alloying elements in lead-free solder Table 5.2 Availability of potential alloying elements in lead-free solder Metal World production in 2000 (a) , tonnes Silver 17,700 Bismuth 5,880 Copper...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 April 2004
DOI: 10.31399/asm.tb.ps.9781627083522
EISBN: 978-1-62708-352-2
Image
Published: 01 November 2019
Figure 3 Example experimental design to evaluate and qualify low-residue soldering for military and commercial applications [2] . More
Image
Published: 01 November 2011
Fig. 5.8 Effects of the heat of welding, brazing, or soldering on the properties (top) and microstructure (bottom) of a work-hardened metal. Source: Ref 5.6 , p 476 More
Image
Published: 01 November 2011
Fig. 5.9 Effect of the heat of welding, brazing, or soldering on the properties (top) and microstructure (bottom) of an age-hardened precipitation hardenable alloy. Source: Ref 5.6 , p 478 More
Image
Published: 01 November 2011
Fig. 7.12 Joint designs frequently used in soldering. Source: Ref 7.10 More
Image
Published: 01 November 2011
Fig. 7.13 Schematic of the wave soldering process. The three important process control regions are: (A) entry, (B) interior, and (C) peel-back region. The v is velocity of printed circuit board. Source: Ref 7.12 More
Image
Published: 01 June 1988
Fig. 10.15 Nest fixture used in induction soldering when the preform is difficult to hold in place; the nest also permits component alignment prior to joining if preassembly is inconvenient. From J. Libsch and P. Capolongo, Lepel Review , Vol 1, No. 5, p 1 ( Ref 9 ) More
Image
Published: 01 June 1988
Fig. 10.16 High-production induction soldering fixture utilizing a turntable and conveyor-type coil which allows continuous part movement; the inset shows an indexing arrangment for applications where localized heating is required. From J. Libsch and P. Capolongo, Lepel Review , Vol 1, No. 5 More
Image
Published: 01 June 1988
Fig. 10.17 Multiple-position fixture for soldering of four assemblies at once; pressure pads ensure proper component positioning during induction soldering; the sketch at bottom illustrates positions of induction coil and solder ring. From J. Libsch and P. Capolongo, Lepel Review , Vol 1 More
Image
Published: 01 April 2004
Fig. 3.6 Wetting of copper by Pb-63Sn solder using rosin flux. Soldering with flux generally benefits from a protective atmosphere (unless the atmosphere detrimentally affects the chemistry of the fluxing action), because the flux has to work less to protect the substrate and filler from More
Image
Published: 01 April 2004
Fig. 3.27 Fluxless soldering of a GaAs monolithic microwave integrated circuit, approximately 3 × 5 mm (0.12 × 0.12 in.) achieved by application of a compressive load of 100 g/mm 2 (140 psi) during the heating cycle. Source: BAE Systems More
Series: ASM Technical Books
Publisher: ASM International
Published: 01 April 2004
DOI: 10.31399/asm.tb.ps.t62440049
EISBN: 978-1-62708-352-2
...Low-melting-point eutectic composition alloys used as solders Table 2.2 Low-melting-point eutectic composition alloys used as solders Composition, wt% Eutectic temperature Ag Bi In Pb Sn Other °C °F ... 49.0 21.0 18.0 12.0 ... 57 135 ... 33.7 66.3...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 August 1999
DOI: 10.31399/asm.tb.caaa.t67870161
EISBN: 978-1-62708-299-0
... Abstract This chapter describes the factors that affect the corrosion performance of aluminum assemblies joined by methods such as welding, brazing, soldering, and adhesive bonding. The factors covered include galvanic effects, crevices, and assembly stresses in products susceptible to stress...
Image
Published: 01 November 2019
Figure 4 3D X-Ray tomography of the failing solder bump interface. Missing solder observed between the interposer and the laminate at the fail location. More
Image
Published: 01 December 2009
Fig. 12.8 Defective solder joints. Note the poor solder joints on the left side of the component. Such defects can induce open circuits or create a short circuit if the solder forms a bridge between components. Solder spatter of the type shown here can also be induced by excess energy More
Image
Published: 01 December 2006
Fig. 2.1 Soft solder with one or more flux cores (tube solder), extruded and drawn to the finished dimensions and coiled on plastic spools. Source: Collin More
Image
Published: 01 April 2004
Fig. 5.21 (a) Solder spread sample on a gold-plated substrate. The solder is Pb-60Sn, and the substrate is copper plated with 5 μm (200 μin.) of nickel and then 5 μm (200 μin.) of gold. At least three distinct microstructural bands are visible. (b) Micrograph of a joint made using the same More
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 April 2004
DOI: 10.31399/asm.tb.ps.t62440245
EISBN: 978-1-62708-352-2
... Abstract This appendix contains a brief list of general references related to soldering technology. Soldering Soldering • Brandon D. G. and Kaplan W. D. 1997 Joining Processes: An Introduction , JohnWiley & Sons • Frear D.R. Jones W.B...