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Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2011
DOI: 10.31399/asm.tb.jub.t53290165
EISBN: 978-1-62708-306-5
... Abstract Brazing and soldering processes use a molten filler metal to wet the mating surfaces of a joint, with or without the aid of a fluxing agent, leading to the formation of a metallurgical bond between the filler and the respective components. This chapter discusses the characteristics...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2011
DOI: 10.31399/asm.tb.jub.t53290001
EISBN: 978-1-62708-306-5
... examining the various joining processes, namely fusion welding, solid-state welding, brazing, soldering, mechanical fastening, and adhesive bonding. In addition, it provides information on several design considerations related to the joining process and selection of the appropriate process for joining...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2011
DOI: 10.31399/asm.tb.jub.t53290137
EISBN: 978-1-62708-306-5
... Abstract Solid-state welding processes are those that produce coalescence of the faying surfaces at temperatures below the melting point of the base metals being joined without the addition of brazing or solder filler metal. This chapter discusses solid-state welding processes such as diffusion...
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2011
DOI: 10.31399/asm.tb.jub.t53290023
EISBN: 978-1-62708-306-5
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2011
DOI: 10.31399/asm.tb.jub.t53290061
EISBN: 978-1-62708-306-5
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2011
DOI: 10.31399/asm.tb.jub.t53290079
EISBN: 978-1-62708-306-5
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2011
DOI: 10.31399/asm.tb.jub.t53290099
EISBN: 978-1-62708-306-5
...: 10.31399/asm.hb.v06.a0001343 and B.K. Damkroger, and “Solid-State Transformations in Weldments” by P.R. Visnu doi: 10.31399/asm.hb.v06.a0001341 , all in Welding, Brazing, and Soldering , Vol 6, ASM Handbook , ASM International, 1993; and “Fatigue and Fracture Control of Weldments” by T. Jutla in...
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2011
DOI: 10.31399/asm.tb.jub.t53290207
EISBN: 978-1-62708-306-5
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2011
DOI: 10.31399/asm.tb.jub.t53290243
EISBN: 978-1-62708-306-5
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2011
DOI: 10.31399/asm.tb.jub.t53290279
EISBN: 978-1-62708-306-5
... (diffusion welding, explosion welding, friction welding, or ultrasonic welding), brazing, or soldering where alloying between the metals is normally insignificant. In these cases, only the differences in the physical and mechanical properties of the base metals and their influence on the serviceability of...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2011
DOI: 10.31399/asm.tb.jub.9781627083065
EISBN: 978-1-62708-306-5
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2001
DOI: 10.31399/asm.tb.aub.t61170528
EISBN: 978-1-62708-297-6
... lead used in battery grids, type metals, and bearings. It, likewise, discusses the use of tin in various types of solder and in bearings and provides composition and property data for application-specific designations and grades. The article also discusses the effect of impurities in tin-lead solders...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2001
DOI: 10.31399/asm.tb.aub.t61170351
EISBN: 978-1-62708-297-6
... article also explains how primary alloying elements affect corrosion and wear behaviors and how they influence fabrication processes such as forming, forging, welding, brazing, and soldering. alloying elements aluminum alloys corrosion behavior wear behavior Composition Cast aluminum alloys...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110603
EISBN: 978-1-62708-247-1
... inspection followed by material evaluation and characterization. These processes are typically followed by evaluation of the packages to identify defects, degradations, and failure mechanisms that are caused by the processes (e.g., cleaning, solder dipping of leads, reballing) used in creating counterfeit...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110062
EISBN: 978-1-62708-247-1
... layers and a multitude of materials. Figure 4 Four 28nm FPGA are micro Cu-pillar solder bumped on a TSV interposer with four RDLs on its topside. The interposer is C4 solder bumped onto a package substrate having at least 12 (6-2-6) build-up layers [14] . This limits access to the defect...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110550
EISBN: 978-1-62708-247-1
... important to note that a good ground alongside the structure is needed for a good capacitance measurement. This can be an adjacent passing structure, or a ground or voltage plane above or below the structure. Table 1 shows an example of the capacitance measurements made on a laminate to solder-bump to...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110010
EISBN: 978-1-62708-247-1
... has been extended to IC packages. As it doesn’t not induce large die stresses, a pFIB is extremely useful for WLP open failures as the solder ball and die pad can be cross sectioned without fear of inducing artifacts. This is especially beneficial when materials such as solder or gold being cross...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110447
EISBN: 978-1-62708-247-1
... root cause of a physical failure and implement, when possible early detection methods. One example is solderability failure investigated with Auger found to correlate with oxide thickness on the solder ball. A faster screening method with SEM-EDX to determine oxide thickness is proposed as a more...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2007
DOI: 10.31399/asm.tb.smnm.t52140055
EISBN: 978-1-62708-264-8
... concept of wetting, which is well illustrated by the soldering process, must be understood. A good solder joint at a fitting occurs when the molten solder metal runs into the thin joint between a copper pipe and the fitting being attached to it. If the solder at the joint region is simply melted without...
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 March 2012
DOI: 10.31399/asm.tb.pdub.t53420087
EISBN: 978-1-62708-310-2
.... Fig. 5.4 Crystalline structures on cooling in a eutectic phase diagram Because eutectic alloys have a single melting/solidification point, eutectic compositions include important types of commercial alloys. Traditional lead-tin solder alloys are based on their eutectic compositions. Casting...