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soldering
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Book Chapter
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2011
DOI: 10.31399/asm.tb.jub.t53290165
EISBN: 978-1-62708-306-5
... Abstract Brazing and soldering processes use a molten filler metal to wet the mating surfaces of a joint, with or without the aid of a fluxing agent, leading to the formation of a metallurgical bond between the filler and the respective components. This chapter discusses the characteristics...
Abstract
Brazing and soldering processes use a molten filler metal to wet the mating surfaces of a joint, with or without the aid of a fluxing agent, leading to the formation of a metallurgical bond between the filler and the respective components. This chapter discusses the characteristics, advantages, and disadvantages of brazing and soldering. The first part focuses on the fundamentals of the brazing process and provides information on filler metals and specific brazing methods. The soldering portion of the chapters provides information on solder alloys used, selection criteria for base metal, the processes involved in precleaning and surface preparation, types of fluxes used, solder joint design, and solder heating methods.
Book Chapter
Book: Principles of Soldering
Series: ASM Technical Books
Publisher: ASM International
Published: 01 April 2004
DOI: 10.31399/asm.tb.ps.t62440189
EISBN: 978-1-62708-352-2
... Cadmium 320.8 Toxic vapor Lead 327.5 Toxic Availability of potential alloying elements in lead-free solder Table 5.2 Availability of potential alloying elements in lead-free solder Metal World production in 2000 (a) , tonnes Silver 17,700 Bismuth 5,880 Copper...
Abstract
This chapter presents several materials and processes related to soldering technology. It first provides information on lead-free solders, followed by sections devoted to flip-chip processes, diffusion soldering, and modeling. Scanning acoustic microscopy and fine-focus x-ray techniques are also discussed. The chapter describes several evaluation procedures and tests developed to measure solderability and standards for process calibration. The chapter also describes the characteristics of reinforced solders, amalgams used as solders, and other strategies to boost the strength of solders. Further, the chapter considers methods for quantifying the mechanical integrity of joints and predicting their dimensional stability under specified environmental conditions. It discusses the effects of rare earth elements on the properties of solders. The chapter concludes with information on advanced joint characterization techniques.
Series: ASM Technical Books
Publisher: ASM International
Published: 01 April 2004
DOI: 10.31399/asm.tb.ps.9781627083522
EISBN: 978-1-62708-352-2
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in Reliability and Quality Basics for Failure Analysts[1]
> Microelectronics Failure Analysis: Desk Reference
Published: 01 November 2019
Figure 3 Example experimental design to evaluate and qualify low-residue soldering for military and commercial applications [2] .
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Image
Published: 01 November 2011
Fig. 5.8 Effects of the heat of welding, brazing, or soldering on the properties (top) and microstructure (bottom) of a work-hardened metal. Source: Ref 5.6 , p 476
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Published: 01 November 2011
Fig. 5.9 Effect of the heat of welding, brazing, or soldering on the properties (top) and microstructure (bottom) of an age-hardened precipitation hardenable alloy. Source: Ref 5.6 , p 478
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Published: 01 November 2011
Fig. 7.12 Joint designs frequently used in soldering. Source: Ref 7.10
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Published: 01 November 2011
Fig. 7.13 Schematic of the wave soldering process. The three important process control regions are: (A) entry, (B) interior, and (C) peel-back region. The v is velocity of printed circuit board. Source: Ref 7.12
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Published: 01 June 1988
Fig. 10.15 Nest fixture used in induction soldering when the preform is difficult to hold in place; the nest also permits component alignment prior to joining if preassembly is inconvenient. From J. Libsch and P. Capolongo, Lepel Review , Vol 1, No. 5, p 1 ( Ref 9 )
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Published: 01 June 1988
Fig. 10.16 High-production induction soldering fixture utilizing a turntable and conveyor-type coil which allows continuous part movement; the inset shows an indexing arrangment for applications where localized heating is required. From J. Libsch and P. Capolongo, Lepel Review , Vol 1, No. 5
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Image
Published: 01 June 1988
Fig. 10.17 Multiple-position fixture for soldering of four assemblies at once; pressure pads ensure proper component positioning during induction soldering; the sketch at bottom illustrates positions of induction coil and solder ring. From J. Libsch and P. Capolongo, Lepel Review , Vol 1
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Image
Published: 01 April 2004
Fig. 3.6 Wetting of copper by Pb-63Sn solder using rosin flux. Soldering with flux generally benefits from a protective atmosphere (unless the atmosphere detrimentally affects the chemistry of the fluxing action), because the flux has to work less to protect the substrate and filler from
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Published: 01 April 2004
Fig. 3.27 Fluxless soldering of a GaAs monolithic microwave integrated circuit, approximately 3 × 5 mm (0.12 × 0.12 in.) achieved by application of a compressive load of 100 g/mm 2 (140 psi) during the heating cycle. Source: BAE Systems
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Book Chapter
Book: Principles of Soldering
Series: ASM Technical Books
Publisher: ASM International
Published: 01 April 2004
DOI: 10.31399/asm.tb.ps.t62440049
EISBN: 978-1-62708-352-2
...Low-melting-point eutectic composition alloys used as solders Table 2.2 Low-melting-point eutectic composition alloys used as solders Composition, wt% Eutectic temperature Ag Bi In Pb Sn Other °C °F ... 49.0 21.0 18.0 12.0 ... 57 135 ... 33.7 66.3...
Abstract
This chapter presents an overview and survey of solder alloy systems. Extensive reference is made to phase diagrams and their interpretation. The chapter describes the effect of metallic impurities on different solders. The chapter concludes with a review of the key characteristics of eutectic alloys and of the factors most effective at depressing the melting point of solders by eutectic alloying.
Series: ASM Technical Books
Publisher: ASM International
Published: 01 August 1999
DOI: 10.31399/asm.tb.caaa.t67870161
EISBN: 978-1-62708-299-0
... Abstract This chapter describes the factors that affect the corrosion performance of aluminum assemblies joined by methods such as welding, brazing, soldering, and adhesive bonding. The factors covered include galvanic effects, crevices, and assembly stresses in products susceptible to stress...
Abstract
This chapter describes the factors that affect the corrosion performance of aluminum assemblies joined by methods such as welding, brazing, soldering, and adhesive bonding. The factors covered include galvanic effects, crevices, and assembly stresses in products susceptible to stress-corrosion cracking.
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in 2.5D and 3D Packaging Failure Analysis Techniques
> Microelectronics Failure Analysis: Desk Reference
Published: 01 November 2019
Figure 4 3D X-Ray tomography of the failing solder bump interface. Missing solder observed between the interposer and the laminate at the fail location.
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Image
Published: 01 December 2009
Fig. 12.8 Defective solder joints. Note the poor solder joints on the left side of the component. Such defects can induce open circuits or create a short circuit if the solder forms a bridge between components. Solder spatter of the type shown here can also be induced by excess energy
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Published: 01 December 2006
Fig. 2.1 Soft solder with one or more flux cores (tube solder), extruded and drawn to the finished dimensions and coiled on plastic spools. Source: Collin
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Published: 01 April 2004
Fig. 5.21 (a) Solder spread sample on a gold-plated substrate. The solder is Pb-60Sn, and the substrate is copper plated with 5 μm (200 μin.) of nickel and then 5 μm (200 μin.) of gold. At least three distinct microstructural bands are visible. (b) Micrograph of a joint made using the same
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Book Chapter
Book: Principles of Soldering
Series: ASM Technical Books
Publisher: ASM International
Published: 01 April 2004
DOI: 10.31399/asm.tb.ps.t62440245
EISBN: 978-1-62708-352-2
... Abstract This appendix contains a brief list of general references related to soldering technology. Soldering Soldering • Brandon D. G. and Kaplan W. D. 1997 Joining Processes: An Introduction , JohnWiley & Sons • Frear D.R. Jones W.B...
Abstract
This appendix contains a brief list of general references related to soldering technology.
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