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soldered joints

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Image
Published: 01 April 2004
Fig. 4.37 Shear strength of soldered joints in brass testpieces as a function of joint thickness. Narrow joint gaps are progressively more difficult to fill, thus decreasing the measured shear strength of thin joints. A gaseous flux is better able to penetrate narrower joint gaps than a liquid More
Series: ASM Technical Books
Publisher: ASM International
Published: 01 August 1999
DOI: 10.31399/asm.tb.caaa.t67870161
EISBN: 978-1-62708-299-0
... Abstract This chapter describes the factors that affect the corrosion performance of aluminum assemblies joined by methods such as welding, brazing, soldering, and adhesive bonding. The factors covered include galvanic effects, crevices, and assembly stresses in products susceptible to stress...
Image
Published: 01 December 2009
Fig. 12.8 Defective solder joints. Note the poor solder joints on the left side of the component. Such defects can induce open circuits or create a short circuit if the solder forms a bridge between components. Solder spatter of the type shown here can also be induced by excess energy More
Image
Published: 01 August 1999
Fig. 5 Approximate electrode potentials across soldered aluminum joints More
Image
Published: 01 April 2004
Fig. 2.47 Effect of thickness of copper-tin intermetallic compounds in soldered joints on tensile strength at room temperature More
Image
Published: 01 April 2004
Fig. 4.26 Scanning acoustic microscope image of the soldered joint shown in Fig. 4.25 . Voids in the joint gap correspond to the light areas. More
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2011
DOI: 10.31399/asm.tb.jub.t53290165
EISBN: 978-1-62708-306-5
... Abstract Brazing and soldering processes use a molten filler metal to wet the mating surfaces of a joint, with or without the aid of a fluxing agent, leading to the formation of a metallurgical bond between the filler and the respective components. This chapter discusses the characteristics...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 April 2004
DOI: 10.31399/asm.tb.ps.t62440189
EISBN: 978-1-62708-352-2
... characteristics Table 5.9 Technology characteristics Compression bump bonding Solder bump bonding Short (coin) interconnects Tall (pillar) interconnects Filled joint gap Open joint gap Fluxless Flux usually required Low residual stress Residual stress Service temperature...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 April 2004
DOI: 10.31399/asm.tb.ps.t62440049
EISBN: 978-1-62708-352-2
... The phases are generally hard with low fracture toughness. However, their thermal expansivities lie between the substrate and solder, which probably plays a role in decreasing the stress concentration in joints. Property Cu 6 Sn 5 Cu 3 Sn Ni 3 Sn 4 Hardness, HV 378 343 365...
Image
Published: 01 April 2004
the piezoelectric elements and the substrate, the soldered joints must be of a specified thickness. This was achieved using tungsten spacer wires in each joint and a spring-loaded jig to apply a compressive stress to each element during the process cycle. Also shown is the mask used to apply the metallization More
Image
Published: 01 November 2019
Figure 6 Live overlay of CAD design in the X-ray image. Missing heel fillet and complete missing solder can be identified at two gullwing solder joints. Image provided by Phoenix Xx-ray. More
Image
Published: 01 November 2019
Figure 7 (a) Volume rendering of a flip chip packaging with voxel size of 7 um. (b) Volume rendering of two neighboring BGA solder joints with cross sectional images to show solder contact with pad. More
Image
Published: 01 April 2004
Fig. 3.21 Effect of fast atom cleaning on the strength of high melting point Pb-3Sn solder joints made without breaking vacuum between cleaning and soldering. Adapted from: Kohono et al. [1996 ]. More
Image
Published: 01 April 2004
Fig. 5.38 Series of micrographs showing the progressive change in joint microstructure that occurs on making a diffusion-soldered joint using tin in combination with silver metallizations applied to copper substrates. 400├Ś More
Series: ASM Technical Books
Publisher: ASM International
Published: 01 April 2004
DOI: 10.31399/asm.tb.ps.t62440145
EISBN: 978-1-62708-352-2
... May incorporate salts and gaseous inclusions Variable; often excellent Thick film Variable Dense coatings are achievable Often contain glass and possibly organic residues Variable; dependent on materials and processing conditions Fig. 4.37 Shear strength of soldered joints in brass...
Image
Published: 01 April 2004
Fig. 5.37 Schematic illustration of the steps involved in making a diffusion-soldered joint More
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 April 2004
DOI: 10.31399/asm.tb.ps.t62440001
EISBN: 978-1-62708-352-2
... into account the metallurgical driving force for spreading. Fig. 1.18 Effect of the surface roughness of copper substrates on the fracture toughness of joints made with silver-tin eutectic solder. It is worth noting that the joints under which the test joints were made are relatively extreme in terms...
Image
Published: 01 November 2019
Figure 3 Thermal image with no illumination and external forward bias of the top fraction of a single crystalline solar panel with failed solder joints at two of the cells. More
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 April 2004
DOI: 10.31399/asm.tb.ps.t6244000x
EISBN: 978-1-62708-352-2
... has been found in King Tutankhamun's tomb (1350 B.C .), although there is some debate among scholars about the deliberateness of the metallurgy of this joint. Solders comprising alloys of lead and tin were almost certainly used during the Iron Age [ Tylecote 1962 ]. By the Roman Imperial period...
Image
Published: 01 April 2004
Fig. 4.32 Experimentally derived relationship between pressure variation and void level obtained in large-area soldered joints using the pressure variation method. Adapted from Mizuishi, Tokuda, and Fujita [1988 ] More