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solderability

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Published: 01 April 2004
Fig. 4.1 Solderability shelf life of gold-coated components. Thicker and denser coatings are more impervious to oxygen and water vapor and therefore confer greater protection to the underlying metal. More
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Published: 01 April 2004
Fig. 5.16 Typical trace of the wetting force during a solderability test cycle, with the corresponding position of the specimen relative to the solder bath More
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2011
DOI: 10.31399/asm.tb.jub.t53290165
EISBN: 978-1-62708-306-5
... Abstract Brazing and soldering processes use a molten filler metal to wet the mating surfaces of a joint, with or without the aid of a fluxing agent, leading to the formation of a metallurgical bond between the filler and the respective components. This chapter discusses the characteristics...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 April 2004
DOI: 10.31399/asm.tb.ps.t62440049
EISBN: 978-1-62708-352-2
...Low-melting-point eutectic composition alloys used as solders Table 2.2 Low-melting-point eutectic composition alloys used as solders Composition, wt% Eutectic temperature Ag Bi In Pb Sn Other °C °F ... 49.0 21.0 18.0 12.0 ... 57 135 ... 33.7 66.3...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 April 2004
DOI: 10.31399/asm.tb.ps.9781627083522
EISBN: 978-1-62708-352-2
Series: ASM Technical Books
Publisher: ASM International
Published: 01 April 2004
DOI: 10.31399/asm.tb.ps.t62440189
EISBN: 978-1-62708-352-2
... Cadmium 320.8 Toxic vapor Lead 327.5 Toxic Availability of potential alloying elements in lead-free solder Table 5.2 Availability of potential alloying elements in lead-free solder Metal World production in 2000 (a) , tonnes Silver 17,700 Bismuth 5,880 Copper...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 August 1999
DOI: 10.31399/asm.tb.caaa.t67870161
EISBN: 978-1-62708-299-0
... Abstract This chapter describes the factors that affect the corrosion performance of aluminum assemblies joined by methods such as welding, brazing, soldering, and adhesive bonding. The factors covered include galvanic effects, crevices, and assembly stresses in products susceptible to stress...
Image
Published: 01 December 2009
Fig. 12.8 Defective solder joints. Note the poor solder joints on the left side of the component. Such defects can induce open circuits or create a short circuit if the solder forms a bridge between components. Solder spatter of the type shown here can also be induced by excess energy More
Image
Published: 01 November 2019
Figure 4 3D X-Ray tomography of the failing solder bump interface. Missing solder observed between the interposer and the laminate at the fail location. More
Image
Published: 01 December 2006
Fig. 2.1 Soft solder with one or more flux cores (tube solder), extruded and drawn to the finished dimensions and coiled on plastic spools. Source: Collin More
Image
Published: 01 April 2004
Fig. 3.6 Wetting of copper by Pb-63Sn solder using rosin flux. Soldering with flux generally benefits from a protective atmosphere (unless the atmosphere detrimentally affects the chemistry of the fluxing action), because the flux has to work less to protect the substrate and filler from More
Image
Published: 01 April 2004
Fig. 5.21 (a) Solder spread sample on a gold-plated substrate. The solder is Pb-60Sn, and the substrate is copper plated with 5 μm (200 μin.) of nickel and then 5 μm (200 μin.) of gold. At least three distinct microstructural bands are visible. (b) Micrograph of a joint made using the same More
Image
Published: 01 June 2016
Fig. 7.17 Soldered power transistor on an aluminum heat sink with a cold-sprayed copper layer. Source: Ref 7.14 More
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Published: 01 November 2019
Fig 28 Solder bump cracks from metal fatigue induced by cycling of high lateral stress forces. More
Image
Published: 01 November 2019
Figure 19 3D tomography of the solder bumps connecting the laminate to the interposer along with micropillars connecting the HBM modules to each other and to the interposer More
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Published: 01 November 2019
Figure 20 Solder bridging noted at the suspect location. Virtual cross sections taken at various z heights (a, b, c & d), show solder bridging localized close to the interposer-solder bump connection. More
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Published: 01 November 2019
Figure 28 High magnification SEM image of a solder bump close to the interposer corner. Cracking across the solder bump top was noted. Crack propagation observed in the underfill parallel and below the interposer More
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Published: 01 November 2019
Figure 12 Scanning electron micrograph of a cracked solder bump; ion beam milling was used to clean up the smear caused by manual cross sectioning and reveal the details of the failure. This device was subject to a temperature cycle stress. More
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Published: 01 November 2019
Figure 4 Four 28nm FPGA are micro Cu-pillar solder bumped on a TSV interposer with four RDLs on its topside. The interposer is C4 solder bumped onto a package substrate having at least 12 (6-2-6) build-up layers [14] . More
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Published: 01 November 2019
Figure 3 Example experimental design to evaluate and qualify low-residue soldering for military and commercial applications [2] . More