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solder joints

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Published: 01 December 2009
Fig. 12.8 Defective solder joints. Note the poor solder joints on the left side of the component. Such defects can induce open circuits or create a short circuit if the solder forms a bridge between components. Solder spatter of the type shown here can also be induced by excess energy More
Series: ASM Technical Books
Publisher: ASM International
Published: 31 December 2024
DOI: 10.31399/asm.tb.hisppa.t56110119
EISBN: 978-1-62708-483-3
... Abstract This chapter focuses on factors that influence the mechanical properties of a soldered joint, including solder material, base material, solder joint design, soldering surface, soldering temperature, and test methodology. induction soldering mechanical properties solder joint...
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Published: 31 December 2024
Fig. 6.9 Examples of overlapping solder joints. (a) Plate-to-plate joint. (b) Tube-to-flange joint. Adapted from Ref 6.3 More
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Published: 31 December 2024
Fig. 6.14 Design examples for solder joints More
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Published: 01 April 2004
Fig. 2.47 Effect of thickness of copper-tin intermetallic compounds in soldered joints on tensile strength at room temperature More
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Published: 01 April 2004
Fig. 4.26 Scanning acoustic microscope image of the soldered joint shown in Fig. 4.25 . Voids in the joint gap correspond to the light areas. More
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Published: 01 April 2004
Fig. 4.37 Shear strength of soldered joints in brass testpieces as a function of joint thickness. Narrow joint gaps are progressively more difficult to fill, thus decreasing the measured shear strength of thin joints. A gaseous flux is better able to penetrate narrower joint gaps than a liquid More
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Published: 31 December 2024
Fig. 6.1 A solder joint gap between dissimilar materials changes with temperature. At room temperature, it is S RT (lower half of figure); at soldering temperature, it has shrunk to S LT (upper half of figure). More
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Published: 31 December 2024
Fig. 6.8 (a) Solder joint design prone to entrapped residual flux. (b) Witness hole shown in solder joint. to combat the void created. (c) Solder preplaced at bottom gap, so that capillary flow causes the flux residues to exit from the top of the joint. More
Image
Published: 31 December 2024
Fig. 11.135 Cross section of a solder joint that required a desoldering operation. 1, inductor coil; 2, header; 3, lid wall; 4, printed circuit board (PCB); 5, PCB standoffs; 6, solder joint More
Series: ASM Technical Books
Publisher: ASM International
Published: 31 December 2024
DOI: 10.31399/asm.tb.hisppa.t56110123
EISBN: 978-1-62708-483-3
... Abstract This chapter describes important aspects of the interrelationship between the workpiece and the inductor coil, an understanding of which is essential for achieving an efficient soldering process and a solder joint with the desired performance and reliability. It also discusses...
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Published: 01 April 2004
Fig. 2.4 Shear strength of α-brass joints made with lead-tin solder containing varying concentrations of antimony More
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2011
DOI: 10.31399/asm.tb.jub.t53290165
EISBN: 978-1-62708-306-5
... Abstract Brazing and soldering processes use a molten filler metal to wet the mating surfaces of a joint, with or without the aid of a fluxing agent, leading to the formation of a metallurgical bond between the filler and the respective components. This chapter discusses the characteristics...
Series: ASM Technical Books
Publisher: ASM International
Published: 31 December 2024
DOI: 10.31399/asm.tb.hisppa.t56110079
EISBN: 978-1-62708-483-3
... Abstract This chapter explains the fundamentals of soldering technology and provides an overview of the soldering process. It discusses the wetting of the molten solder filler metal to the base material surface and the design aspects when induction heating is used to make the solder joint...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 August 1999
DOI: 10.31399/asm.tb.caaa.t67870161
EISBN: 978-1-62708-299-0
... Abstract This chapter describes the factors that affect the corrosion performance of aluminum assemblies joined by methods such as welding, brazing, soldering, and adhesive bonding. The factors covered include galvanic effects, crevices, and assembly stresses in products susceptible to stress...
Series: ASM Technical Books
Publisher: ASM International
Published: 31 December 2024
DOI: 10.31399/asm.tb.hisppa.t56110099
EISBN: 978-1-62708-483-3
... in completing the solder joint through induction heating. The chapter focuses on the selection of fluxes and the use of inert gases or even vacuum to realize an oxide-free base material surface both before and during the soldering process. aluminum aluminum alloys copper copper alloys fluxes...
Series: ASM Technical Books
Publisher: ASM International
Published: 31 December 2024
DOI: 10.31399/asm.tb.hisppa.t56110001
EISBN: 978-1-62708-483-3
... ). The welded joint and the adhesive joint are counterparts to the soldered joint ( Ref 1.2 ). The welded joint is the fusion bond formed between two or more materials that results from the partial melting of those materials. The soldered joint is the filler metal bond between two or more materials that results...
Series: ASM Technical Books
Publisher: ASM International
Published: 31 December 2024
DOI: 10.31399/asm.tb.hisppa.9781627084833
EISBN: 978-1-62708-483-3
Series: ASM Technical Books
Publisher: ASM International
Published: 31 December 2024
DOI: 10.31399/asm.tb.hisppa.t56110245
EISBN: 978-1-62708-483-3
... Abstract This chapter discusses the critical soldering faults that lead to quality degradation and potential failure of a soldered connection. It then describes the types of nondestructive evaluations used to inspect soldered and brazed joints, including dimensional and visual inspection...
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 31 December 2024
DOI: 10.31399/asm.tb.hisppa.t56110113
EISBN: 978-1-62708-483-3
... solder joints solder wire feeders induction heating THE SOLDERING PROCESS DEVELOPMENT must also consider the form and method to supply filler metal to the joint. The general forms of the solder are paste, wire, or a preform. The paste and preform are usually deposited and formed, respectively...