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solder joints

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Image
Published: 01 December 2009
Fig. 12.8 Defective solder joints. Note the poor solder joints on the left side of the component. Such defects can induce open circuits or create a short circuit if the solder forms a bridge between components. Solder spatter of the type shown here can also be induced by excess energy More
Image
Published: 01 April 2004
Fig. 2.47 Effect of thickness of copper-tin intermetallic compounds in soldered joints on tensile strength at room temperature More
Image
Published: 01 April 2004
Fig. 4.26 Scanning acoustic microscope image of the soldered joint shown in Fig. 4.25 . Voids in the joint gap correspond to the light areas. More
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Published: 01 April 2004
Fig. 4.37 Shear strength of soldered joints in brass testpieces as a function of joint thickness. Narrow joint gaps are progressively more difficult to fill, thus decreasing the measured shear strength of thin joints. A gaseous flux is better able to penetrate narrower joint gaps than a liquid More
Image
Published: 01 April 2004
Fig. 2.4 Shear strength of α-brass joints made with lead-tin solder containing varying concentrations of antimony More
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2011
DOI: 10.31399/asm.tb.jub.t53290165
EISBN: 978-1-62708-306-5
... Abstract Brazing and soldering processes use a molten filler metal to wet the mating surfaces of a joint, with or without the aid of a fluxing agent, leading to the formation of a metallurgical bond between the filler and the respective components. This chapter discusses the characteristics...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 August 1999
DOI: 10.31399/asm.tb.caaa.t67870161
EISBN: 978-1-62708-299-0
... Abstract This chapter describes the factors that affect the corrosion performance of aluminum assemblies joined by methods such as welding, brazing, soldering, and adhesive bonding. The factors covered include galvanic effects, crevices, and assembly stresses in products susceptible to stress...
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Published: 01 April 2004
the piezoelectric elements and the substrate, the soldered joints must be of a specified thickness. This was achieved using tungsten spacer wires in each joint and a spring-loaded jig to apply a compressive stress to each element during the process cycle. Also shown is the mask used to apply the metallization More
Image
Published: 01 November 2019
Figure 6 Live overlay of CAD design in the X-ray image. Missing heel fillet and complete missing solder can be identified at two gullwing solder joints. Image provided by Phoenix Xx-ray. More
Image
Published: 01 November 2019
Figure 7 (a) Volume rendering of a flip chip packaging with voxel size of 7 um. (b) Volume rendering of two neighboring BGA solder joints with cross sectional images to show solder contact with pad. More
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Published: 01 April 2004
Fig. 3.21 Effect of fast atom cleaning on the strength of high melting point Pb-3Sn solder joints made without breaking vacuum between cleaning and soldering. Adapted from: Kohono et al. [1996 ]. More
Image
Published: 01 April 2004
Fig. 5.38 Series of micrographs showing the progressive change in joint microstructure that occurs on making a diffusion-soldered joint using tin in combination with silver metallizations applied to copper substrates. 400× More
Series: ASM Technical Books
Publisher: ASM International
Published: 01 April 2004
DOI: 10.31399/asm.tb.ps.t62440049
EISBN: 978-1-62708-352-2
... not automatically imply a lack of wetting. For example, all solders will wet platinum, but only gold-base solders will spread on this metal. Limited erosion of the parent metals at the joint interface. The associated alloying, which must occur to form a metallic bond, should not result in the formation of either...
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Published: 01 April 2004
Fig. 5.37 Schematic illustration of the steps involved in making a diffusion-soldered joint More
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Published: 01 November 2019
Figure 3 Thermal image with no illumination and external forward bias of the top fraction of a single crystalline solar panel with failed solder joints at two of the cells. More
Series: ASM Technical Books
Publisher: ASM International
Published: 01 April 2004
DOI: 10.31399/asm.tb.ps.t62440189
EISBN: 978-1-62708-352-2
... of solders. Further, the chapter considers methods for quantifying the mechanical integrity of joints and predicting their dimensional stability under specified environmental conditions. It discusses the effects of rare earth elements on the properties of solders. The chapter concludes with information...
Image
Published: 01 April 2004
Fig. 4.32 Experimentally derived relationship between pressure variation and void level obtained in large-area soldered joints using the pressure variation method. Adapted from Mizuishi, Tokuda, and Fujita [1988 ] More
Series: ASM Technical Books
Publisher: ASM International
Published: 01 April 2004
DOI: 10.31399/asm.tb.ps.t62440145
EISBN: 978-1-62708-352-2
... containing soldered joints is given in Table 4.1 . Those constraints that are directly linked to the product itself include the cost tolerance of the product to the joining process, the scale and throughput of production that will have to be satisfied, and the statutory regulations that apply. The operating...
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 April 2004
DOI: 10.31399/asm.tb.ps.t6244000x
EISBN: 978-1-62708-352-2
... be construed as a manufactured solder alloy has been found in King Tutankhamun's tomb (1350 B.C .), although there is some debate among scholars about the deliberateness of the metallurgy of this joint. Solders comprising alloys of lead and tin were almost certainly used during the Iron Age [ Tylecote...
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 April 2004
DOI: 10.31399/asm.tb.ps.t62440001
EISBN: 978-1-62708-352-2
... characteristics, surface roughness of components, dissolution of parent materials and intermetallic growth, significance of the joint gap, and the strength of metals. The chapter also examines the principal aspects related to the design and application of soldering processes. brazing contact angle...