This chapter presents an overview and survey of solder alloy systems. Extensive reference is made to phase diagrams and their interpretation. The chapter describes the effect of metallic impurities on different solders. The chapter concludes with a review of the key characteristics of eutectic alloys and of the factors most effective at depressing the melting point of solders by eutectic alloying.

Brazing and soldering processes use a molten filler metal to wet the mating surfaces of a joint, with or without the aid of a fluxing agent, leading to the formation of a metallurgical bond between the filler and the respective components. This chapter discusses the characteristics, advantages, and disadvantages of brazing and soldering. The first part focuses on the fundamentals of the brazing process and provides information on filler metals and specific brazing methods. The soldering portion of the chapters provides information on solder alloys used, selection criteria for base metal, the processes involved in precleaning and surface preparation, types of fluxes used, solder joint design, and solder heating methods.

This chapter presents several materials and processes related to soldering technology. It first provides information on lead-free solders, followed by sections devoted to flip-chip processes, diffusion soldering, and modeling. Scanning acoustic microscopy and fine-focus x-ray techniques are also discussed. The chapter describes several evaluation procedures and tests developed to measure solderability and standards for process calibration. The chapter also describes the characteristics of reinforced solders, amalgams used as solders, and other strategies to boost the strength of solders. Further, the chapter considers methods for quantifying the mechanical integrity of joints and predicting their dimensional stability under specified environmental conditions. It discusses the effects of rare earth elements on the properties of solders. The chapter concludes with information on advanced joint characterization techniques.

This chapter considers the materials and processing aspects of soldering and the manner in which these interrelate in the development of joining processes. It discusses the processes involved in eliminating or suppressing metallurgical and mechanical constraints as well as constraints imposed by the components.

Soldering and brazing represent one of several types of methods for joining solid materials. These methods may be classified as mechanical fastening, adhesive bonding, soldering and brazing, welding, and solid-state joining. This chapter summarizes the principal characteristics of these joining methods. It presents a comparison between solders and brazes. Further details on pressure welding and diffusion bonding are also provided. Key parameters of soldering are discussed, including surface energy and surface tension, wetting and contact angle, fluid flow, filler spreading characteristics, surface roughness of components, dissolution of parent materials and intermetallic growth, significance of the joint gap, and the strength of metals. The chapter also examines the principal aspects related to the design and application of soldering processes.

Joining comprises a large number of processes used to assemble individual parts into a larger, more complex component or assembly. The selection of an appropriate design to join parts is based on several considerations related to both the product and the joining process. Many product design departments now improve the ease with which products are assembled by using design for assembly (DFA) techniques, which seek to ensure ease of assembly by developing designs that are easy to assemble. This chapter discusses the general guidelines for DFA and concurrent engineering rules before examining the various joining processes, namely fusion welding, solid-state welding, brazing, soldering, mechanical fastening, and adhesive bonding. In addition, it provides information on several design considerations related to the joining process and selection of the appropriate process for joining.

Materials used in joining, whether solders, fluxes, or atmospheres, are becoming increasingly subjected to restrictions on the grounds of health, safety, and pollution concerns. These regulations can limit the choice of materials and processes that are deemed acceptable for industrial use. The chapter addresses this issue with a focus on soldering fluxes. The chapter also describes factors related to soldering under a protective atmosphere, provides information on chemical fluxes for soldering of various metals, and discusses the processes involved in fluxless soldering processes.

Brazing and soldering jointly represent one of several methods for joining solid materials. This chapter summarizes the principal characteristics of the various joining methods. It then discusses key parameters of brazing including surface energy and tension, wetting and contact angle, fluid flow, filler spreading characteristics, surface roughness of components, dissolution of parent materials, new phase formations, significance of the joint gap, and the strength of metals. The chapter also describes issues in processing aspects that must be considered when designing a joint, and the health, safety, and environmental aspects of brazing.

X-ray imaging systems have long played a critical role in failure analysis laboratories. This article begins by listing several favorable traits that make X-rays uniquely well suited for non-destructive evaluation and testing. It then provides information on X-ray equipment and X-ray microscopy and its application in failure analysis of integrated circuit (IC) packaging and IC boards. The final section is devoted to the discussion on nanoscale 3D X-ray microscopy and its applications.

This chapter discusses the various methods used to join titanium alloy assemblies, focusing on welding processes and procedures. It explains how welding alters the structure and properties of titanium and how it is influenced by composition, surface qualities, and other factors. It describes several welding processes, including arc welding, resistance welding, and friction stir welding, and addresses related issues such as welding defects, quality control, and stress relieving. The chapter also covers mechanical fastening techniques along with adhesive bonding and brazing.

Beryllium has been successfully joined by fusion welding, brazing, solid-state bonding, and soldering. This chapter describes these processes in detail along with their advantages and disadvantages. It also addresses application considerations such as surface preparation, joint design, and testing.

This chapter considers the role of materials in brazing operations and the manner in which they impact on the choice of processing conditions and their optimization. The concepts covered are metallurgical and mechanical constraints, and constraints imposed by the components and their solutions as well as service environment considerations.

This chapter describes the processes involved in the fabrication of wrought and cast metal products. It discusses deformation processes including bending and forming, material removal processes such as milling, cutting, and grinding, and joining methods including welding, soldering, and brazing. It also discusses powder consolidation, rolling, drawing and extrusion, and common forging methods.

There are several analytical methods available that can be used in-line on whole wafers as well as off-line on de-processed products that are returned from the field. These techniques are surface analytical techniques that can be used to characterize the bulk of the material. The main six methods used in semiconductor industry are: Auger spectroscopy, dynamic secondary ion mass spectroscopy, time of flight static secondary ion mass spectroscopy (ToF-SIMS), X-ray photoelectron spectroscopy, scanning electron microscope-energy dispersive X-ray spectroscopy (SEM-EDX), and transmission electron microscope-EDX. This review specifically addresses ToF-SIMS and describes some typical examples of the application of Auger and SEM-EDX.

Post-mortem analysis of photovoltaic modules that have degraded performance is essential for improving the long term durability of solar energy. This article focuses on a general procedure for analyzing a failed module. The procedure includes electrical characterization followed by thermal imaging such as forward bias, reverse bias, and lock-in, and emission imaging such as electroluminescence and photoluminescence imaging.

Weldments made by the various welding processes may contain discontinuities that are characteristic of that process. This chapter discusses the different welding processes as well as the discontinuities typical of each process. It provides a detailed discussion on the methods of nondestructive inspection of weldments including visual inspection, liquid penetrant inspection, magnetic particle inspection, radiographic inspection, ultrasonic inspection, leak testing, and eddy current and electric current perturbation inspection. The chapter also describes the properties of brazing filler metals and the types of flaws exhibited by brazed joints.

During fusion welding, the thermal cycles produced by the moving heat source causes physical state changes, metallurgical phase transformations, and transient thermal stresses and metal movement. This chapter begins by discussing weld metal solidification behavior and the solid-state transformations of the main classes of metals and alloys during fusion welding. The main classes include work- or strain-hardened metals and alloys, precipitation-hardened alloys, transformation-hardened steels and cast irons, stainless steels, and solid-solution and dispersion-hardened alloys. The following section provides information on the residual stresses and distortion that remain after welding. The focus then shifts to distortion control of weldments. Inclusions and cracking are discussed in detail. The chapter also discusses the causes for reduced fatigue strength of a component by a weld: stress concentration due to weld shape and joint geometry; stress concentration due to weld imperfections; and residual welding stresses. Inspection and characterization of welds are described in the final section of this chapter.

This chapter presents an overview of families of brazing alloys that one is likely to encounter in a manufacturing environment. It discusses the metallurgical aspects of brazing and includes a survey of brazing alloy systems. A discussion of deleterious and beneficial impurities is provided with examples. The chapter also describes the application of phase diagrams to brazing.