Brazing and soldering processes use a molten filler metal to wet the mating surfaces of a joint, with or without the aid of a fluxing agent, leading to the formation of a metallurgical bond between the filler and the respective components. This chapter discusses the characteristics, advantages, and disadvantages of brazing and soldering. The first part focuses on the fundamentals of the brazing process and provides information on filler metals and specific brazing methods. The soldering portion of the chapters provides information on solder alloys used, selection criteria for base metal, the processes involved in precleaning and surface preparation, types of fluxes used, solder joint design, and solder heating methods.

Joining comprises a large number of processes used to assemble individual parts into a larger, more complex component or assembly. The selection of an appropriate design to join parts is based on several considerations related to both the product and the joining process. Many product design departments now improve the ease with which products are assembled by using design for assembly (DFA) techniques, which seek to ensure ease of assembly by developing designs that are easy to assemble. This chapter discusses the general guidelines for DFA and concurrent engineering rules before examining the various joining processes, namely fusion welding, solid-state welding, brazing, soldering, mechanical fastening, and adhesive bonding. In addition, it provides information on several design considerations related to the joining process and selection of the appropriate process for joining.

Soldering and brazing represent one of several types of methods for joining solid materials. These methods may be classified as mechanical fastening, adhesive bonding, soldering and brazing, welding, and solid-state joining. This chapter summarizes the principal characteristics of these joining methods. It presents a comparison between solders and brazes. Further details on pressure welding and diffusion bonding are also provided. Key parameters of soldering are discussed, including surface energy and surface tension, wetting and contact angle, fluid flow, filler spreading characteristics, surface roughness of components, dissolution of parent materials and intermetallic growth, significance of the joint gap, and the strength of metals. The chapter also examines the principal aspects related to the design and application of soldering processes.

This chapter considers the materials and processing aspects of soldering and the manner in which these interrelate in the development of joining processes. It discusses the processes involved in eliminating or suppressing metallurgical and mechanical constraints as well as constraints imposed by the components.

This chapter describes the origins of solders and soldering, covering the composition of solders and applications of soldering.

Brazing and soldering jointly represent one of several methods for joining solid materials. This chapter summarizes the principal characteristics of the various joining methods. It then discusses key parameters of brazing including surface energy and tension, wetting and contact angle, fluid flow, filler spreading characteristics, surface roughness of components, dissolution of parent materials, new phase formations, significance of the joint gap, and the strength of metals. The chapter also describes issues in processing aspects that must be considered when designing a joint, and the health, safety, and environmental aspects of brazing.

This chapter presents several materials and processes related to soldering technology. It first provides information on lead-free solders, followed by sections devoted to flip-chip processes, diffusion soldering, and modeling. Scanning acoustic microscopy and fine-focus x-ray techniques are also discussed. The chapter describes several evaluation procedures and tests developed to measure solderability and standards for process calibration. The chapter also describes the characteristics of reinforced solders, amalgams used as solders, and other strategies to boost the strength of solders. Further, the chapter considers methods for quantifying the mechanical integrity of joints and predicting their dimensional stability under specified environmental conditions. It discusses the effects of rare earth elements on the properties of solders. The chapter concludes with information on advanced joint characterization techniques.

This chapter presents an overview and survey of solder alloy systems. Extensive reference is made to phase diagrams and their interpretation. The chapter describes the effect of metallic impurities on different solders. The chapter concludes with a review of the key characteristics of eutectic alloys and of the factors most effective at depressing the melting point of solders by eutectic alloying.

Beryllium has been successfully joined by fusion welding, brazing, solid-state bonding, and soldering. This chapter describes these processes in detail along with their advantages and disadvantages. It also addresses application considerations such as surface preparation, joint design, and testing.

Materials used in joining, whether solders, fluxes, or atmospheres, are becoming increasingly subjected to restrictions on the grounds of health, safety, and pollution concerns. These regulations can limit the choice of materials and processes that are deemed acceptable for industrial use. The chapter addresses this issue with a focus on soldering fluxes. The chapter also describes factors related to soldering under a protective atmosphere, provides information on chemical fluxes for soldering of various metals, and discusses the processes involved in fluxless soldering processes.

Brazes for carat gold jewelry must meet or exceed the fineness/caratage of the component piece parts of the assembly in order for it to meet the national fineness/caratage standards and marking or hallmarking regulations for jewelry. This chapter concentrates on brazes for gold jewelry. It provides understanding of the metallurgy of gold jewelry alloys and includes a discussion of brazes for carat gold jewelry. The chapter also provides information on traditional gold jewelry brazes, the target properties of filler metals for carat gold jewelry and describes the characteristics of novel 22 carat gold solders.

This article examines the role of alloying in the production and use of lead and tin. It describes the various categories and grades of lead and lead-base alloys along with their nominal compositions and corresponding UNS numbers. It also discusses the composition and properties of lead used in battery grids, type metals, and bearings. It, likewise, discusses the use of tin in various types of solder and in bearings and provides composition and property data for application-specific designations and grades. The article also discusses the effect of impurities in tin-lead solders and the amounts and combinations in which they are found.

Solid-state welding processes are those that produce coalescence of the faying surfaces at temperatures below the melting point of the base metals being joined without the addition of brazing or solder filler metal. This chapter discusses solid-state welding processes such as diffusion welding, forge welding, roll welding, coextrusion welding, cold welding, friction welding, friction stir welding, explosion welding, and ultrasonic welding.

This chapter discusses the various methods used to join titanium alloy assemblies, focusing on welding processes and procedures. It explains how welding alters the structure and properties of titanium and how it is influenced by composition, surface qualities, and other factors. It describes several welding processes, including arc welding, resistance welding, and friction stir welding, and addresses related issues such as welding defects, quality control, and stress relieving. The chapter also covers mechanical fastening techniques along with adhesive bonding and brazing.

This chapter focuses on common failure characteristics exhibited by mechanical and electrical components. The topic is considered from two perspectives: one possibility is that the system failed because parts were nonconforming to drawing requirements and another possibility is that the system failed even though all parts in the system met their drawing requirements. The common failures discussed in this chapter include those associated with metallic components, composite materials, plastic components, ceramic components, and electrical and electronic components.