Search Results for solder alloy systems

This chapter presents an overview and survey of solder alloy systems. Extensive reference is made to phase diagrams and their interpretation. The chapter describes the effect of metallic impurities on different solders. The chapter concludes with a review of the key characteristics of eutectic alloys and of the factors most effective at depressing the melting point of solders by eutectic alloying.

This chapter describes important aspects of the interrelationship between the workpiece and the inductor coil, an understanding of which is essential for achieving an efficient soldering process and a solder joint with the desired performance and reliability. It also discusses induction soldering machine operation parameters, including temperature measurement and control sensors. The chapter illustrates the equipment used in a fully automated induction heating system. Fully automated soldering systems include temperature monitoring devices to control the temperature-time profile, the movement of workpieces, the supply of solder filler metal and flux, and the provision of shielding gas in the solder joint area.

This chapter presents several materials and processes related to soldering technology. It first provides information on lead-free solders, followed by sections devoted to flip-chip processes, diffusion soldering, and modeling. Scanning acoustic microscopy and fine-focus x-ray techniques are also discussed. The chapter describes several evaluation procedures and tests developed to measure solderability and standards for process calibration. The chapter also describes the characteristics of reinforced solders, amalgams used as solders, and other strategies to boost the strength of solders. Further, the chapter considers methods for quantifying the mechanical integrity of joints and predicting their dimensional stability under specified environmental conditions. It discusses the effects of rare earth elements on the properties of solders. The chapter concludes with information on advanced joint characterization techniques.

Materials used in joining, whether solders, fluxes, or atmospheres, are becoming increasingly subjected to restrictions on the grounds of health, safety, and pollution concerns. These regulations can limit the choice of materials and processes that are deemed acceptable for industrial use. The chapter addresses this issue with a focus on soldering fluxes. The chapter also describes factors related to soldering under a protective atmosphere, provides information on chemical fluxes for soldering of various metals, and discusses the processes involved in fluxless soldering processes.

Brazing and soldering processes use a molten filler metal to wet the mating surfaces of a joint, with or without the aid of a fluxing agent, leading to the formation of a metallurgical bond between the filler and the respective components. This chapter discusses the characteristics, advantages, and disadvantages of brazing and soldering. The first part focuses on the fundamentals of the brazing process and provides information on filler metals and specific brazing methods. The soldering portion of the chapters provides information on solder alloys used, selection criteria for base metal, the processes involved in precleaning and surface preparation, types of fluxes used, solder joint design, and solder heating methods.

This article examines the role of alloying in the production and use of lead and tin. It describes the various categories and grades of lead and lead-base alloys along with their nominal compositions and corresponding UNS numbers. It also discusses the composition and properties of lead used in battery grids, type metals, and bearings. It, likewise, discusses the use of tin in various types of solder and in bearings and provides composition and property data for application-specific designations and grades. The article also discusses the effect of impurities in tin-lead solders and the amounts and combinations in which they are found.

Brazes for carat gold jewelry must meet or exceed the fineness/caratage of the component piece parts of the assembly in order for it to meet the national fineness/caratage standards and marking or hallmarking regulations for jewelry. This chapter concentrates on brazes for gold jewelry. It provides understanding of the metallurgy of gold jewelry alloys and includes a discussion of brazes for carat gold jewelry. The chapter also provides information on traditional gold jewelry brazes, the target properties of filler metals for carat gold jewelry and describes the characteristics of novel 22 carat gold solders.

Soldering and brazing represent one of several types of methods for joining solid materials. These methods may be classified as mechanical fastening, adhesive bonding, soldering and brazing, welding, and solid-state joining. This chapter summarizes the principal characteristics of these joining methods. It presents a comparison between solders and brazes. Further details on pressure welding and diffusion bonding are also provided. Key parameters of soldering are discussed, including surface energy and surface tension, wetting and contact angle, fluid flow, filler spreading characteristics, surface roughness of components, dissolution of parent materials and intermetallic growth, significance of the joint gap, and the strength of metals. The chapter also examines the principal aspects related to the design and application of soldering processes.

This chapter considers the materials and processing aspects of soldering and the manner in which these interrelate in the development of joining processes. It discusses the processes involved in eliminating or suppressing metallurgical and mechanical constraints as well as constraints imposed by the components.

Phase diagrams are graphical representations that show the phases present in the material at various compositions, temperatures, and pressures. This chapter begins with a section describing the construction of phase diagrams for the simple binary isomorphous system. A binary phase diagram can be used to determine three important types of information: the phases that are present, the composition of the phases, and the percentages or fractions of the phases. The chapter then describes the construction of one common type of binary phase diagram i.e., the eutectic alloy system. The major eutectic systems include the aluminum-silicon eutectic system and the lead-tin eutectic system. The chapter discusses the construction of eutectic phase diagrams from free energy curves. It also provides information on peritectic, monotectic, and solid-state reactions in alloy systems. The presence of intermediate phases is also described. Finally, a brief section provides some information on ternary phase diagrams.

This chapter presents the following groupings of metals and alloys that are soldered together: steel and iron-base alloys, aluminum and aluminum alloys, and copper and copper alloys. It also presents the ancillary materials and process methods that assist the solder filler metal in completing the solder joint through induction heating. The chapter focuses on the selection of fluxes and the use of inert gases or even vacuum to realize an oxide-free base material surface both before and during the soldering process.

This chapter begins by presenting a generic eutectic phase diagram and identifying critical points, lines, and features. It then describes the composition and properties of aluminum-silicon and lead-tin eutectic systems, the characteristics of eutectic morphologies, the solidification and scale of eutectic structures, and the competitive growth of dendrites and eutectic colonies or cells. It also examines the different types of precipitation structures that form during slow cooling cycles.

This article discusses the composition, structures, properties, and behaviors of aluminum alloys and explains how they correspond to specific alloying elements. It begins with an overview of the general characteristics of wrought and cast aluminum alloys, the four-digit classification system by which they are defined, and the applications for which they are suited. It then explains how primary alloying elements, second-phase constituents, and impurities affect yield strength, phase formation, and grain size and how they induce structural changes that help refine certain alloys. The article also explains how primary alloying elements affect corrosion and wear behaviors and how they influence fabrication processes such as forming, forging, welding, brazing, and soldering.

Brazing and soldering jointly represent one of several methods for joining solid materials. This chapter summarizes the principal characteristics of the various joining methods. It then discusses key parameters of brazing including surface energy and tension, wetting and contact angle, fluid flow, filler spreading characteristics, surface roughness of components, dissolution of parent materials, new phase formations, significance of the joint gap, and the strength of metals. The chapter also describes issues in processing aspects that must be considered when designing a joint, and the health, safety, and environmental aspects of brazing.

This chapter explores case studies on using induction heating for joining applications, encompassing both soldering and brazing to demonstrate versatility. Each study focuses on inductor coil design, workpiece geometry, and production quantities, emphasizing optimization due to the interplay between material geometry, coil configuration, and process parameters like generator frequency and power. The case studies provide real-world data on effectively implementing induction heating in joining processes.