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Image
Published: 01 November 2019
Figure 4 3D X-Ray tomography of the failing solder bump interface. Missing solder observed between the interposer and the laminate at the fail location. More
Image
Published: 01 December 2009
Fig. 12.8 Defective solder joints. Note the poor solder joints on the left side of the component. Such defects can induce open circuits or create a short circuit if the solder forms a bridge between components. Solder spatter of the type shown here can also be induced by excess energy More
Image
Published: 01 April 2004
Fig. 5.21 (a) Solder spread sample on a gold-plated substrate. The solder is Pb-60Sn, and the substrate is copper plated with 5 μm (200 μin.) of nickel and then 5 μm (200 μin.) of gold. At least three distinct microstructural bands are visible. (b) Micrograph of a joint made using the same More
Image
Published: 01 December 2006
Fig. 2.1 Soft solder with one or more flux cores (tube solder), extruded and drawn to the finished dimensions and coiled on plastic spools. Source: Collin More
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2011
DOI: 10.31399/asm.tb.jub.t53290165
EISBN: 978-1-62708-306-5
... Abstract Brazing and soldering processes use a molten filler metal to wet the mating surfaces of a joint, with or without the aid of a fluxing agent, leading to the formation of a metallurgical bond between the filler and the respective components. This chapter discusses the characteristics...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 April 2004
DOI: 10.31399/asm.tb.ps.t62440049
EISBN: 978-1-62708-352-2
... Abstract This chapter presents an overview and survey of solder alloy systems. Extensive reference is made to phase diagrams and their interpretation. The chapter describes the effect of metallic impurities on different solders. The chapter concludes with a review of the key characteristics...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 April 2004
DOI: 10.31399/asm.tb.ps.9781627083522
EISBN: 978-1-62708-352-2
Image
Published: 01 November 2019
Figure 4 Four 28nm FPGA are micro Cu-pillar solder bumped on a TSV interposer with four RDLs on its topside. The interposer is C4 solder bumped onto a package substrate having at least 12 (6-2-6) build-up layers [14] . More
Image
Published: 01 November 2019
Fig 28 Solder bump cracks from metal fatigue induced by cycling of high lateral stress forces. More
Image
Published: 01 November 2019
Figure 19 3D tomography of the solder bumps connecting the laminate to the interposer along with micropillars connecting the HBM modules to each other and to the interposer More
Image
Published: 01 November 2019
Figure 20 Solder bridging noted at the suspect location. Virtual cross sections taken at various z heights (a, b, c & d), show solder bridging localized close to the interposer-solder bump connection. More
Image
Published: 01 November 2019
Figure 28 High magnification SEM image of a solder bump close to the interposer corner. Cracking across the solder bump top was noted. Crack propagation observed in the underfill parallel and below the interposer More
Image
Published: 01 November 2019
Figure 12 Scanning electron micrograph of a cracked solder bump; ion beam milling was used to clean up the smear caused by manual cross sectioning and reveal the details of the failure. This device was subject to a temperature cycle stress. More
Image
Published: 01 August 2005
Fig. 1.4 Principal solder alloy families and their melting ranges More
Image
Published: 01 December 2006
Fig. 5.5 Modern fully automatic extrusion plant for the production of soft solder with casting oven, chill mold billet casting plant, hot-billet shear, and oil hydraulic 2500 kN extrusion press. The extrusion press is fitted with a fixed dummy block on the stem. (Source: Collin) More
Image
Published: 01 December 2006
Fig. 5.6 Extrusion tooling for the extrusion of hollow solder. 1, connection to the flux container; 2, hollow mandrel; 3, extrusion die; 4, extrusion die holder; 5, pressure nut; 6, one-piece die head with the container; 7, front nut; 8, hollow mandrel screw adjustment; 9, extrusion stem More
Image
Published: 01 December 2006
Fig. 5.8 Oil-operated 2500 kN solder wire extrusion press as shown in Fig. 5.5 with extruded hollow solder emerging transverse to the press longitudinal axis. The vessel on the left-hand side is filled with flux and linked by a tube to connection 1 on the hollow mandrel 2 in the extrusion More
Image
Published: 01 April 2004
Fig. 1.3 Principal solder alloy families and their melting ranges More
Image
Published: 01 April 2004
Fig. 1.9 Wetting angle of lead-tin solder on copper at 10 °C above the melting point, 1 min after reflow using rosin mildly activated (RMA) flux, as a function of lead concentration. Adapted from Liu and Tu [1998] More
Image
Published: 01 April 2004
Fig. 1.13 Effect of nonwettable surface features on the contact angle of solder on copper. Data of Yost, Hosking, and Frear [1993] augmented by the authors. Lead-tin solder wetted onto a copper surface containing embedded nonwettable particles 10–20 μm (400–800 μin.) in diameter (RMA flux More