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Book Chapter
Solder Feeder
Available to PurchaseSeries: ASM Technical Books
Publisher: ASM International
Published: 31 December 2024
DOI: 10.31399/asm.tb.hisppa.t56110113
EISBN: 978-1-62708-483-3
... Abstract This chapter details various induction soldering processes, including soldering with manually fed solder, soldering with filler metal (preplaced) preforms, soldering with solder coating, and soldering with an automated solder wire feeder. induction soldering solder filler metals...
Abstract
This chapter details various induction soldering processes, including soldering with manually fed solder, soldering with filler metal (preplaced) preforms, soldering with solder coating, and soldering with an automated solder wire feeder.
Book Chapter
Soldering Faults—Inspection of Solder Connections
Available to PurchaseSeries: ASM Technical Books
Publisher: ASM International
Published: 31 December 2024
DOI: 10.31399/asm.tb.hisppa.t56110245
EISBN: 978-1-62708-483-3
... Abstract This chapter discusses the critical soldering faults that lead to quality degradation and potential failure of a soldered connection. It then describes the types of nondestructive evaluations used to inspect soldered and brazed joints, including dimensional and visual inspection...
Abstract
This chapter discusses the critical soldering faults that lead to quality degradation and potential failure of a soldered connection. It then describes the types of nondestructive evaluations used to inspect soldered and brazed joints, including dimensional and visual inspection, ultrasonic testing, radiographic examination, dye penetrant inspection, and leak testing, including overpressure tests. The chapter also provides an overview of destructive physical analysis.
Image
3D X-Ray tomography of the failing solder bump interface. Missing solder ob...
Available to Purchase
in 2.5D and 3D Packaging Failure Analysis Techniques
> Microelectronics Failure Analysis: Desk Reference
Published: 01 November 2019
Figure 4 3D X-Ray tomography of the failing solder bump interface. Missing solder observed between the interposer and the laminate at the fail location.
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Image
(a) Solder spread sample on a gold-plated substrate. The solder is Pb-60Sn,...
Available to PurchasePublished: 01 April 2004
Fig. 5.21 (a) Solder spread sample on a gold-plated substrate. The solder is Pb-60Sn, and the substrate is copper plated with 5 μm (200 μin.) of nickel and then 5 μm (200 μin.) of gold. At least three distinct microstructural bands are visible. (b) Micrograph of a joint made using the same
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Image
Soft solder with one or more flux cores (tube solder), extruded and drawn t...
Available to PurchasePublished: 01 December 2006
Fig. 2.1 Soft solder with one or more flux cores (tube solder), extruded and drawn to the finished dimensions and coiled on plastic spools. Source: Collin
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Image
Defective solder joints. Note the poor solder joints on the left side of th...
Available to PurchasePublished: 01 December 2009
Fig. 12.8 Defective solder joints. Note the poor solder joints on the left side of the component. Such defects can induce open circuits or create a short circuit if the solder forms a bridge between components. Solder spatter of the type shown here can also be induced by excess energy
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Image
Manual feeding of a solder rod onto the solder zone of a small slider in wh...
Available to Purchase
in Solder Feeder
> Handbook of Induction Soldering<subtitle>Principles, Processing, and Applications</subtitle>
Published: 31 December 2024
Fig. 8.1 Manual feeding of a solder rod onto the solder zone of a small slider in which short-circuit rods are soldered into place
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Image
in Solder Feeder
> Handbook of Induction Soldering<subtitle>Principles, Processing, and Applications</subtitle>
Published: 31 December 2024
Book Chapter
Brazing and Soldering
Available to PurchaseSeries: ASM Technical Books
Publisher: ASM International
Published: 01 November 2011
DOI: 10.31399/asm.tb.jub.t53290165
EISBN: 978-1-62708-306-5
... Abstract Brazing and soldering processes use a molten filler metal to wet the mating surfaces of a joint, with or without the aid of a fluxing agent, leading to the formation of a metallurgical bond between the filler and the respective components. This chapter discusses the characteristics...
Abstract
Brazing and soldering processes use a molten filler metal to wet the mating surfaces of a joint, with or without the aid of a fluxing agent, leading to the formation of a metallurgical bond between the filler and the respective components. This chapter discusses the characteristics, advantages, and disadvantages of brazing and soldering. The first part focuses on the fundamentals of the brazing process and provides information on filler metals and specific brazing methods. The soldering portion of the chapters provides information on solder alloys used, selection criteria for base metal, the processes involved in precleaning and surface preparation, types of fluxes used, solder joint design, and solder heating methods.
Book Chapter
Solders and Their Metallurgy
Available to PurchaseBook: Principles of Soldering
Series: ASM Technical Books
Publisher: ASM International
Published: 01 April 2004
DOI: 10.31399/asm.tb.ps.t62440049
EISBN: 978-1-62708-352-2
... Abstract This chapter presents an overview and survey of solder alloy systems. Extensive reference is made to phase diagrams and their interpretation. The chapter describes the effect of metallic impurities on different solders. The chapter concludes with a review of the key characteristics...
Abstract
This chapter presents an overview and survey of solder alloy systems. Extensive reference is made to phase diagrams and their interpretation. The chapter describes the effect of metallic impurities on different solders. The chapter concludes with a review of the key characteristics of eutectic alloys and of the factors most effective at depressing the melting point of solders by eutectic alloying.
Series: ASM Technical Books
Publisher: ASM International
Published: 01 April 2004
DOI: 10.31399/asm.tb.ps.9781627083522
EISBN: 978-1-62708-352-2
Image
Four 28nm FPGA are micro Cu-pillar solder bumped on a TSV interposer with f...
Available to Purchase
in X-Ray Imaging Tools for Electronic Device Failure Analysis[1]
> Microelectronics Failure Analysis: Desk Reference
Published: 01 November 2019
Figure 4 Four 28nm FPGA are micro Cu-pillar solder bumped on a TSV interposer with four RDLs on its topside. The interposer is C4 solder bumped onto a package substrate having at least 12 (6-2-6) build-up layers [14] .
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Image
Solder bump cracks from metal fatigue induced by cycling of high lateral st...
Available to Purchase
in Failure Analysis and Reliability of Optoelectronic Devices[1]
> Microelectronics Failure Analysis: Desk Reference
Published: 01 November 2019
Fig 28 Solder bump cracks from metal fatigue induced by cycling of high lateral stress forces.
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Image
3D tomography of the solder bumps connecting the laminate to the interposer...
Available to Purchase
in 2.5D and 3D Packaging Failure Analysis Techniques
> Microelectronics Failure Analysis: Desk Reference
Published: 01 November 2019
Figure 19 3D tomography of the solder bumps connecting the laminate to the interposer along with micropillars connecting the HBM modules to each other and to the interposer
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Image
Solder bridging noted at the suspect location. Virtual cross sections taken...
Available to Purchase
in 2.5D and 3D Packaging Failure Analysis Techniques
> Microelectronics Failure Analysis: Desk Reference
Published: 01 November 2019
Figure 20 Solder bridging noted at the suspect location. Virtual cross sections taken at various z heights (a, b, c & d), show solder bridging localized close to the interposer-solder bump connection.
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Image
High magnification SEM image of a solder bump close to the interposer corne...
Available to Purchase
in 2.5D and 3D Packaging Failure Analysis Techniques
> Microelectronics Failure Analysis: Desk Reference
Published: 01 November 2019
Figure 28 High magnification SEM image of a solder bump close to the interposer corner. Cracking across the solder bump top was noted. Crack propagation observed in the underfill parallel and below the interposer
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Image
Scanning electron micrograph of a cracked solder bump; ion beam milling was...
Available to PurchasePublished: 01 November 2019
Figure 12 Scanning electron micrograph of a cracked solder bump; ion beam milling was used to clean up the smear caused by manual cross sectioning and reveal the details of the failure. This device was subject to a temperature cycle stress.
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Image
Published: 01 April 2004
Fig. 1.3 Principal solder alloy families and their melting ranges
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Image
Wetting angle of lead-tin solder on copper at 10 °C above the melting point...
Available to PurchasePublished: 01 April 2004
Fig. 1.9 Wetting angle of lead-tin solder on copper at 10 °C above the melting point, 1 min after reflow using rosin mildly activated (RMA) flux, as a function of lead concentration. Adapted from Liu and Tu [1998]
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Image
Effect of nonwettable surface features on the contact angle of solder on co...
Available to PurchasePublished: 01 April 2004
Fig. 1.13 Effect of nonwettable surface features on the contact angle of solder on copper. Data of Yost, Hosking, and Frear [1993] augmented by the authors. Lead-tin solder wetted onto a copper surface containing embedded nonwettable particles 10–20 μm (400–800 μin.) in diameter (RMA flux
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