This chapter familiarizes readers with the basic theory of molecular dynamics and its application in the study of materials. It explains how material properties and behaviors are determined through the iterative calculation of motion equations for a collection of atoms under a given set of conditions. It also provides a walk-through on the use of LAMMPS, an open-source molecular dynamics simulator, discussing the selections and inputs of relevance to practical materials problems.

Hot stamping is a forming process for ultrahigh-strength steels (UHSS) that maximizes formability while minimizing springback. This chapter covers several aspects of hot stamping, including the methods used, the effect of process variables, and the role of finite-element analysis in process development and die design. It also discusses heating methods, cooling mechanisms, and the role of coatings in preventing oxidation.

This chapter sheds light on the challenges involved in diagnosing faults in analog, mixed-signal, and RF circuits. It describes some of the work being done to leverage the benefits of standardization, improve fault simulation tools, and overcome limitations on optical fault isolation techniques. One of the solutions being considered is to integrate LEDs throughout the analog circuit, thereby using light to report the status of internal signals.

A typical mobile processor die may contain, among other things, a variety of high-performance as well as low-power processing cores along with 5G modems, Wi-Fi modules, image processors, GPUs, and security modules, with a total transistor count exceeding 10 billion. Such designs pose many challenges for yield ramp and diagnostics. This chapter examines these challenges and the growing demand for innovative solutions to help failure analysts quickly and accurately isolate faults. It also assesses the capabilities and future potential of ATPG scan diagnostics, streaming scan networks, and advanced fault models for diagnosing embedded memory.

This chapter discusses the use of finite-element methods for modeling cold forging processes. The discussion covers process modeling inputs, such as geometric parameters, material properties, and interface conditions, and includes several application examples.

This chapter describes incremental sheet forming processes, including single-point, two-point, and kinematic (two tool) techniques. It provides information on the tooling and equipment used, work flow and forming parameters, process mechanics and forming limits. It also discusses multistage forming strategies, process modeling and simulation, and advanced hybrid forming processes.

Tube hydroforming is a material-forming process that uses pressurized fluid to plastically deform tubular materials into desired shapes. It is widely used in the automotive industry for making exhaust manifolds, catalytic converters, shock absorber housings, and other parts. This chapter discusses the basic methods of tube hydroforming and the underlying process mechanics. It explains how to determine if a material is a viable candidate and whether it can withstand preforming or bending operations. It describes critical process parameters, such as interface pressure, surface expansion and contraction, and sliding velocity, and how they influence friction, lubrication, and wear. The chapter also provides information on forming presses and tooling, tube hydropiercing, and the use of finite elements to determine optimal processing conditions and loading paths.

This chapter discusses the factors that influence temperature in forging operations and presents equations that can be used to predict and control it. The discussion covers heat generation and transfer, the effect of metal flow, temperature measurement, testing methods, and the influence of equipment-related parameters such as press speed, contact time, and tooling geometries.

In the Semiconductor I/C industry, it has been well documented that the proportion of factory and customer field returns attributed to device damage resulting from electrical over-stress (EOS) and electro-static discharge (ESD) can amount to 40 to 50%. This study entailed EOS and ESD simulation using a variety of models, namely the Human Body Model (HBM), the Charged Device Model (CDM) and the so-called Machine Model (MM), and then conducting electrical and physical failure analysis and comparing the results with documented analyses performed on customer field returns and factory failures. It is shown that a distinction can be made between EOS and ESD failures and between the characteristic failure signatures produced by the ESD models. The CDM physical failure location is at the input buffer and in the gate oxide, where as both HBM and MM failures occur mostly in the contacts at the input protection structures.

This article introduces the wafer-level fault localization failure analysis (FA) process flow for an accelerated yield ramp-up of integrated circuits. It discusses the primary design considerations of a fault localization system with an emphasis on complex tester-based applications. The article presents examples that demonstrate the benefits of the enhanced wafer-level FA process. It also introduces the setup of the wafer-level fault localization system. The application of the wafer-level FA process on a 22 nm technology device failing memory test is studied and some common design limitations and their implications are discussed. The article presents a case study and finally introduces a different value-add application flow capitalizing on the wafer-level fault localization system.

This chapter provides a detailed analysis of the deep drawing process. It begins by explaining that different areas of the workpiece are subjected to different types of forces and loads, equating to five deformation zones. After describing the various zones, it discusses the effect of key process parameters including the draw ratio, material properties, geometry, interface conditions, equipment operating speed, and tooling. It then walks through the steps involved in predicting stress, strain, and punch force using the slab method and finite element analysis and presents the results of simulations conducted to assess the influence of blank diameter, thickness, and holding force as well as strain-hardening and strength coefficients. It also discusses the cause of defects in deep drawn rectangular cups and presents the case study of a deep drawn rectangular cup made from an aluminum blank.

This article provides an introduction to the dynamic random access memory (DRAM) operation with a focus to localization techniques of the defects combined with some physical failure analysis examples and case studies for memory array failures. It discusses the electrical measurement techniques for array failure analysis. The article then presents know-how-based analysis techniques of array failures by bitmap classification. The limits of bitmapping that lead to well-known localization techniques like thermally induced voltage alteration and optical beam induced resistance change are also discussed. The article concludes by providing information on soft defect localization techniques.

This article describes the weldability tests that are used to evaluate the effects of welding on such properties and characteristics as base-metal and weld-metal cracking; base-metal and weld-metal ductility; weld penetration; and weld pool shape and fluid flow. It also describes several weldability tests for evaluating cracking susceptibility, classified as self-restraint or externally loaded tests. The article discusses the processes, advantages, and disadvantages of the weld pool shape tests, the weld penetration tests, and the Gleeble test.

This appendix provides practical information on induction coils and how they are made. It discusses soldering methods, preferred materials, design challenges, and best practices and procedures. It also discusses the design, construction, and application of magnetic flux concentrators and the growing use of computer simulation.

Roll forming is a process in which flat strip or sheet material is progressively bent as it passes through a series of contoured rollers. This chapter describes the basic configuration and operating principles of a roll forming line and the cross-sectional profiles that can be achieved. It explains how to determine strip width and bending sequences and identifies the cause of common roll-forming defects. It also discusses the selection of roll materials and explains how software helps simplify the design of roll forming lines.

This chapter describes a sheet metal forming method, called hydroforming, that uses pressurized liquid and a shaped punch or die. It discusses the advantages and disadvantages of the two approaches, the effect of process variations, and tooling modifications intended to reduce sheet bulging. It identifies the factors that influence part quality and explains how finite-element analysis can be used to optimize hydroforming operations. It also discusses the economics of sheet hydroforming and presents several application examples.

Separation of billets by shearing avoids material loss and is considerably faster than sawing or cutting. This chapter discusses the billet shearing process, the characteristics of sheared surfaces, and the effect of various operating parameters on surface quality. It also includes formulas for calculating shearing force, work, and power and describes various ways to increase production rates.

There are numerous approximate methods, both analytical and numerical, for analyzing forging processes. None are perfect because of the assumptions made to simplify the mathematical approach, but all have merit. This chapter discusses the slab, upperbound, and finite element methods, covering basic principles, implementation, and advantages and disadvantages in various applications.