This chapter presents an overview of families of brazing alloys that one is likely to encounter in a manufacturing environment. It discusses the metallurgical aspects of brazing and includes a survey of brazing alloy systems. A discussion of deleterious and beneficial impurities is provided with examples. The chapter also describes the application of phase diagrams to brazing.

This chapter presents an overview and survey of solder alloy systems. Extensive reference is made to phase diagrams and their interpretation. The chapter describes the effect of metallic impurities on different solders. The chapter concludes with a review of the key characteristics of eutectic alloys and of the factors most effective at depressing the melting point of solders by eutectic alloying.

Brazes for carat gold jewelry must meet or exceed the fineness/caratage of the component piece parts of the assembly in order for it to meet the national fineness/caratage standards and marking or hallmarking regulations for jewelry. This chapter concentrates on brazes for gold jewelry. It provides understanding of the metallurgy of gold jewelry alloys and includes a discussion of brazes for carat gold jewelry. The chapter also provides information on traditional gold jewelry brazes, the target properties of filler metals for carat gold jewelry and describes the characteristics of novel 22 carat gold solders.

This article explains how alloying elements affect the properties and behaviors of electrical contacts. It describes the composition, strength, hardness, and conductivity of a wide range of contact alloys and composites based on silver, copper, gold, platinum, palladium, tungsten, and molybdenum, and related oxides and carbides.

This chapter describes the structures, phases, and phase transformations observed in metals and alloys as they solidify and cool to lower temperatures. It begins with a review of the solidification process, covering nucleation, grain growth, and the factors that influence grain morphology. It then discusses the concept of solid solutions, the difference between substitutional and interstitial solid solubility, the effect of alloying elements, and the development of intermetallic phases. The chapter also covers the construction and use of binary and ternary phase diagrams and describes the helpful information they contain.

Phase diagrams are graphical representations that show the phases present in the material at various compositions, temperatures, and pressures. This chapter begins with a section describing the construction of phase diagrams for the simple binary isomorphous system. A binary phase diagram can be used to determine three important types of information: the phases that are present, the composition of the phases, and the percentages or fractions of the phases. The chapter then describes the construction of one common type of binary phase diagram i.e., the eutectic alloy system. The major eutectic systems include the aluminum-silicon eutectic system and the lead-tin eutectic system. The chapter discusses the construction of eutectic phase diagrams from free energy curves. It also provides information on peritectic, monotectic, and solid-state reactions in alloy systems. The presence of intermediate phases is also described. Finally, a brief section provides some information on ternary phase diagrams.

This chapter is a compilation of beryllium phase diagrams, representing more than 25 binary alloy systems from beryllium-aluminum to beryllium-zirconium. Each diagram is presented along with a summary and source reference.

This chapter presents several materials and processes related to soldering technology. It first provides information on lead-free solders, followed by sections devoted to flip-chip processes, diffusion soldering, and modeling. Scanning acoustic microscopy and fine-focus x-ray techniques are also discussed. The chapter describes several evaluation procedures and tests developed to measure solderability and standards for process calibration. The chapter also describes the characteristics of reinforced solders, amalgams used as solders, and other strategies to boost the strength of solders. Further, the chapter considers methods for quantifying the mechanical integrity of joints and predicting their dimensional stability under specified environmental conditions. It discusses the effects of rare earth elements on the properties of solders. The chapter concludes with information on advanced joint characterization techniques.

This article examines the role of alloying in the production and use of lead and tin. It describes the various categories and grades of lead and lead-base alloys along with their nominal compositions and corresponding UNS numbers. It also discusses the composition and properties of lead used in battery grids, type metals, and bearings. It, likewise, discusses the use of tin in various types of solder and in bearings and provides composition and property data for application-specific designations and grades. The article also discusses the effect of impurities in tin-lead solders and the amounts and combinations in which they are found.

This chapter discusses the process, principles, and modeling of the diffusion brazing system. The applications of diffusion brazing to wide-gap joining and layer manufacturing are also discussed.

This chapter discusses the compositions, properties, and applications of nonferrous metals, including zirconium, hafnium, beryllium, lead, tin, gold, silver, and platinum group metals. It also addresses fusible alloys and provides melting temperatures for several compositions.

This chapter discusses the processes involved in the wetting, spreading, and chemical interaction of a braze on a nonmetal. The chapter reviews the key materials and process issues relating to the joining of nonmetals using active brazing. Emphasis is placed on the differences in brazing to metals by established methods. The chapter also describes the designing process and properties of metal/nonmetal joints.

This chapter provides an overview of the physical metallurgy of beryllium, discussing phases and phase transformations, physical and mechanical properties, heat treatment, and alloying. It explains how the atomic structure of beryllium, particularly its sp hybrid state, contributes to the anisotropy of elastic constants and slip properties, resulting in a specific stiffness, or modulus-to-density ratio, six times higher than that of any other structural material.

The term heat treatable alloys is used in reference to alloys that can be hardened by heat treatment, and this chapter briefly describes the major types of heat treatable nonferrous alloys. The discussion provides a general description of annealing cold-worked metals and describes some of the common nonferrous alloys that can be hardened through heat treatment. The nonferrous alloys covered include aluminum alloys, cobalt alloys, copper alloys, magnesium alloys, nickel alloys, and titanium alloys.

Nonferrous alloys are heat treated for a variety of reasons. Heat treating can reduce internal stresses, redistribute alloying elements, promote grain formation and growth, produce new phases, and alter surface chemistry. This chapter describes heat treatment processes and how nonferrous alloys respond to them. It provides information on aluminum, cobalt, copper, magnesium, nickel, and titanium alloys and their composition, microstructure, properties, and processing characteristics.

Nonferrous metals are of commercial interest both as engineering materials and as alloying agents. This chapter addresses both roles, discussing the properties, processing characteristics, and applications of several categories of nonferrous metals, including light metals, corrosion-resistance alloys, superalloys, refractory metals, low-melting-point metals, reactive metals, precious metals, rare earth metals, and metalloids or semimetals. It also provides a brief summary on special-purpose materials, including uranium, vanadium, magnetic alloys, and thermocouple materials.

Beryllium has been successfully joined by fusion welding, brazing, solid-state bonding, and soldering. This chapter describes these processes in detail along with their advantages and disadvantages. It also addresses application considerations such as surface preparation, joint design, and testing.

Copper is often used in the unalloyed form because pure copper is more conductive than copper alloys. Alloying elements are added to optimize strength, ductility, and thermal stability, with little negative effect on other properties such as conductivity, fabricability, and corrosion resistance. This chapter covers the classification, composition, properties, and applications of copper alloys, including brasses, bronzes, copper-nickel, beryllium-copper, and casting alloys. It also examines wrought copper alloys and pure coppers. The chapter begins with an overview of the copper production process and concludes with a discussion on corrosion resistance.

This article discusses the composition, properties, and behaviors of copper and its alloys. It begins with an overview of the characteristics, applications, and commercial grades of wrought and cast copper. It then discusses the role of alloying, explaining how zinc, tin, aluminum, silicon, and nickel affect the physical and mechanical properties of coppers and high-copper alloys as well as brasses, bronzes, copper-nickels, and nickel silvers. It also explains how alloying affects electrical conductivity, corrosion resistance, stress-corrosion cracking, and processing characteristics.