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silicon based integrated circuits

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Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110180
EISBN: 978-1-62708-247-1
... Abstract Photon emission (PE) is one of the major optical techniques for contactless isolation of functional faults in integrated circuits (ICs) in full electrical operation. This article describes the fundamental mechanisms of PE in silicon based ICs. It presents the opportunities of...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110244
EISBN: 978-1-62708-247-1
.... References [1] Patent US 4758092 , A Method and Means for Optical Detection of Charge Density Modulation in a Semiconductor ( 1988 ) [2] Heinrich Harley K. , “ A Noninvasive Optical Probe for Detecting Electrical Signals in Silicon Integrated Circuits ”, Ph.D. Dissertation, Stanford University...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110634
EISBN: 978-1-62708-247-1
... discussed have driven the development of novel focus areas in test and the chapter discusses several of those areas, including test data volume containment, test power containment, and novel methods of defect-based test. analog circuit testing built-in self-testing functional testing integrated...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110351
EISBN: 978-1-62708-247-1
... silicon via (TSV) stacked die. This has led to exploration work on package level editing of the signals, with gallium-based FIB tools [11] , laser systems [12] or improved plasma source FIB tools [13] . Another key circuit debug capability is adjusting circuit level timing in complex logic. FIB...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110196
EISBN: 978-1-62708-247-1
... Imaging of Silicon Integrated-Circuits Using Pupil-Function Engineering , Applied Physics Letters , 94 , 073113 ( 2009 ). 10.1063/1.3081108 28. Beutler J. et al. , Visible Light LVP on Ultra-Thinned Substrates , ISTFA pp. 110 - 114 , ( 2014 ). 29. Eiles T. and Pardy P...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110323
EISBN: 978-1-62708-247-1
... identification, and circuit editing. The article also presents methods to prepare electron beam probing samples where some remaining silicon is required for the transistor functions and transmission electron microscope samples from units where the substrate silicon has been partially or completely removed...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110262
EISBN: 978-1-62708-247-1
... Abstract Over the revolutionary era of semiconductor technology, Computer-Aided Design Navigation (CADNav) tools have played an increasingly critical role in silicon debug and failure analysis (FA) in efforts to improve manufacturing yield while reducing time-to-market for integrated circuit...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110067
EISBN: 978-1-62708-247-1
... - 53 . 10.1109/ECTC.2015.7159570 [59] Phommahaxay A. et al. , “ High frequency scanning acoustic microscopy applied to 3D integrated process: void detection in through silicon vias ,” in 2013 IEEE 63rd Electronic Components and Technology Conference , 2013 : IEEE, pp. 227 - 231...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110032
EISBN: 978-1-62708-247-1
..., revenue and profit growth will increasingly come from non-US sources. The demand for 5G communications is worldwide as the cost for developing economies to build huge landline infrastructure will be exorbitant as compared to the cost for wireless relay stations. Silicon foundries and build, assembly, and...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110001
EISBN: 978-1-62708-247-1
... – 136 . [6] Mentor Graphics Tessent Silicon Insight Datasheet, http://s3.mentor.com/public_documents/datasheet/products/silicon-yield/tessent-siliconinsight-ds.pdf , 2016 . [7] Crowell G. , “ Using Scan Based Techniques for Fault Isolation in Logic Devices ”, Microelectronics Failure...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110062
EISBN: 978-1-62708-247-1
... them uniquely well suited for non-destructive evaluation and testing: Allows large penetration depth of up to many mm within silicon substrate for hard X-ray radiation [1] ( Figure 1 ) to image complete packaged integrated circuits devices and circuit board without destructive de-processing...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110379
EISBN: 978-1-62708-247-1
... surface of silicon being etched is closer to the active transistors. When the OBIC current reaches a threshold value known for the specific device the laser process is stopped. [1] Another alternate backside deprocessing technique being developed which is based on plasma FIB with gas assisted etching...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110413
EISBN: 978-1-62708-247-1
... electron images. In many cases plasma, wet etch, and mechanical polish can be combined to produce the desired result. For example, commonly found silicon nitride passivation layers are impervious to most wet etches. But after the passivation is removed by plasma or mechanical polishing, the circuit can be...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 March 2002
DOI: 10.31399/asm.tb.stg2.t61280149
EISBN: 978-1-62708-267-9
... alloys are usually formed by additions to nickel of chromium, cobalt, molybdenum, iron, and sometimes small amounts of aluminum, silicon, and niobium. Under moderate loading, alloys of this group can be used up to temperatures approaching 2100 °F (1150 °C). Typical applications are welded containers and...
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 October 2012
DOI: 10.31399/asm.tb.lmub.t53550511
EISBN: 978-1-62708-307-2
.... This chapter describes the applications, properties, and behaviors of some of the more widely used structural ceramics, including alumina, aluminum titanate, silicon carbide, silicon nitride, zirconia, zirconia-toughened alumina (ZTA), magnesia-partially stabilized zirconia (Mg-PSZ), and yttria...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110563
EISBN: 978-1-62708-247-1
... technology.ihs.com [2] Sedky S. , Post-Processing Techniques for Integrated MEMS , Artech House, Inc. ( Norwood, MA , 2006 ). [3] Tilli M. , Motooka T. , Airaksinen V-M. , Franssila S. , Paulasto-Krockel M. , and Lindroos V. , eds. Handbook of Silicon Based MEMS...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2011
DOI: 10.31399/asm.tb.jub.t53290279
EISBN: 978-1-62708-306-5
... methods are covered. The factors influencing joint integrity and the main considerations in welding dissimilar metal combinations are also discussed. adhesive bonding brazing ceramics dissimilar metal welding mechanical fastening plastics welding A NUMBER OF materials and material...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 March 2006
DOI: 10.31399/asm.tb.pht2.t51440085
EISBN: 978-1-62708-262-4
..., chromium, silicon-nickel, silicon, magnesium 0–275 275–1260 32–530 30–2300 ±2 °C (±4 °F) ±0.75% ±1 °C (±2 °F) ±0.38% T Copper and constantan –185 to –60 –300 to –75 … ±1% –100 to –60 –60 to 95 95–370 –150 to –75 –75 to 200 200–700 ±2% ±1 °C (±1.5 °F) ±0.75% ±1% ±0.5 °C (±0.75 °F) ±0.38...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2018
DOI: 10.31399/asm.tb.aceg.t68410151
EISBN: 978-1-62708-280-8
... silicon content of 6.5 to 7.5%, allows for T6 heat treating in the A356 alloy to provide the high yield and fatigue strengths required. A yield strength of 207 MPa (30 ksi) on test bars is specified for designated areas of the casting. Fatigue applications are designed for yield strengths not to exceed...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110042
EISBN: 978-1-62708-247-1
..... A skilled optical designer can correct spherical aberration provided he controls all the refractive media. However when inspecting circuits from the backside of the wafer, the intervening silicon becomes part of the optical path. The silicon introduces spherical aberration whose severity depends on...