The refractory metals include niobium, tantalum, molybdenum, tungsten, and rhenium. These metals are considered refractory because of their high melting points, high-temperature mechanical stability, and resistance to softening at elevated temperatures. This article discusses the composition, properties, fabrication procedures, advantages and disadvantages, and applications of these refractory metals and their alloys. A comparison of some of the properties of the refractory metals with those of iron, copper, and aluminum is given in a table. The article concludes with a brief section on refractory metal protective coatings.

The ultimate goal of the failure analysis process is to find physical evidence that can identify the root cause of the failure. Transmission electron microscopy (TEM) has emerged as a powerful tool to characterize subtle defects. This article discusses the sample preparation procedures based on focused ion beam milling used for TEM sample preparation. It describes the principles behind commonly used imaging modes in semiconductor failure analysis and how these operation modes can be utilized to selectively maximize signal from specific beam-specimen interactions to generate useful information about the defect. Various elemental analysis techniques, namely energy dispersive spectroscopy, electron energy loss spectroscopy, and energy-filtered TEM, are described using examples encountered in failure analysis. The origin of different image contrast mechanisms, their interpretation, and analytical techniques for composition analysis are discussed. The article also provides information on the use of off-axis electron holography technique in failure analysis.

This chapter discusses the use of coating methods and materials and their impact on corrosion and wear behaviors. It provides detailed engineering information on a wide range of processes, including organic, ceramic, and hot dip coating, metal plating and cladding, and the use of weld overlays, thermal spraying, and various deposition technologies.

Scanning Probe Microscope (SPM) has an increasing important role in the development of nanoscale semiconductor technologies. This article presents a detailed discussion on various SPM techniques including Atomic Force Microscopy (AFM), Scanning Kelvin Probe Microscopy, Scanning Capacitance Microscopy, Scanning Spreading Resistance Microscopy, Conductive-AFM, Magnetic Force Microscopy, Scanning Surface Photo Voltage Microscopy, and Scanning Microwave Impedance Microscopy. An overview of each SPM technique is given along with examples of how each is used in the development of novel technologies, the monitoring of manufacturing processes, and the failure analysis of nanoscale semiconductor devices.

This article explains how malleable iron is produced and how its microstructure and properties differ from those of gray and ductile iron. Malleable iron is first cast as white iron then annealed to convert the iron carbide into irregularly shaped graphite particles called temper carbon. Although malleable iron has largely been replaced by ductile iron, the article explains that it is still sometimes preferred for thin-section castings that require maximum machinability and wear resistance. The article also discusses the annealing and alloying processes by which these properties are achieved.

This chapter traces the history of steelmaking over three millennia, from the discovery of martensite in a mining tool dating from the twelfth century B.C. to the nineteenth century development of the Bessemer and Siemens processes. It also describes the work of early metallographers who discovered many phases and microstructures associated with steel and gave them their now familiar names. The chapter concludes with a brief discussion on the emergence of continuous casting and the subsequent development of strip casting production techniques.

This chapter covers a wide range of finishing and coating operations, including cleaning, honing, polishing and buffing, and lapping. It discusses the use of rust-preventative compounds, conversion coatings, and plating metals as well as weld overlay, thermal spray, and ceramic coatings and various pack cementation and deposition processes. It also discusses the selection and use of industrial paints and paint application methods.

This chapter discusses some of the promising developments in the use of titanium, including titanium aluminides, titanium matrix composites, superplastic forming, spray forming, nanotechnology, and rapid solidification rate processing. It also reports on efforts to increase the operating temperature range of conventional titanium alloys and reduce costs.

This chapter addresses the general effects of composition, mechanical treatment, surface treatment, processing, and fabrication operations on the corrosion resistance of aluminum and its alloys. Different types of surface treatments covered include claddings, anodizing, and conversion coatings. The processing steps that can have relatively significant impact on corrosion resistance are homogenization, rolling, extrusion, quenching, aging, and annealing.

This chapter discusses the processes involved in the wetting, spreading, and chemical interaction of a braze on a nonmetal. The chapter reviews the key materials and process issues relating to the joining of nonmetals using active brazing. Emphasis is placed on the differences in brazing to metals by established methods. The chapter also describes the designing process and properties of metal/nonmetal joints.

This chapter presents the theory and practice associated with the application of thin films. The first half of the chapter describes physical deposition processes in which functional coatings are deposited on component surfaces using mechanical, electromechanical, or thermodynamic techniques. Physical vapor deposition (PVD) techniques include sputtering, e-beam evaporation, arc-PVD, and ion plating and are best suited for elements and compounds with moderate melting points or when a high-purity film is required. The remainder of the chapter covers chemical vapor deposition (CVD) processes, including atomic layer deposition, plasma-enhanced and plasma-assisted CVD, and various forms of vapor-phase epitaxy, which are commonly used for compound films or when deposit purity is less critical. A brief application overview is also presented.

The practical application of metals and alloys is guided largely by information obtained through the study of their microstructure. This chapter examines a wide range of titanium microstructures, identifying characteristic features and explaining what they reveal about processing, properties, and performance. It includes images of elongated and equiaxed structures, primary alpha, transformed beta, and metastable phases as well as spheroidal and intergranular beta, alpha case, and intermetallic compounds. It also defines important terms and provides step-by-step procedures for preparing titanium for metallographic analysis.

This chapter discusses the process, principles, and modeling of the diffusion brazing system. The applications of diffusion brazing to wide-gap joining and layer manufacturing are also discussed.

Titanium aluminides are lightweight materials that have relatively high melting points and good high-temperature strength. They also tend to be stronger and lighter than conventional titanium alloys, but considerably less ductile. This chapter begins with a review of the titanium-aluminum phase diagram, focusing on the properties, compositions, and microstructures of alpha-2 Ti3Al alloys. It then describes the properties, microstructures, and compositions of orthorhombic, gamma, and near-gamma alloys as well as the processing methods and procedures normally used in their production.