Search Results for senior

This chapter gives a brief overview of the role of fatigue in component failures. It presents examples of fatigue failures along with statistics on the causes and costs of fatigue damage in various industries. It also includes a chapter-by-chapter summary of the content in the book, noting that the book deals primarily with fatigue at temperatures below the creep range with high-temperature fatigue being treated in a companion publication.

The first step in die-level failure analysis is to narrow the search to a specific circuit or transistor group. Then begins the post-isolation process which entails further localizing the defect, determining its electrical, physical, and chemical properties, and examining its microstructure in order to identify the root cause of failure. This chapter assesses the tools and techniques used for those purposes and the challenges brought on by continued transistor scaling, advanced 3D packages, and new IC architectures. The areas covered include sample preparation, nanoprobing, microscopy, FIB circuit edit, and scanning probe microscopy.

This chapter sheds light on the challenges involved in diagnosing faults in analog, mixed-signal, and RF circuits. It describes some of the work being done to leverage the benefits of standardization, improve fault simulation tools, and overcome limitations on optical fault isolation techniques. One of the solutions being considered is to integrate LEDs throughout the analog circuit, thereby using light to report the status of internal signals.

This chapter assesses the potential impact of neural networks on package-level failure analysis, the challenges presented by next-generation semiconductor packages, and the measures that can be taken to maximize FA equipment uptime and throughput. It presents examples showing how neural networks have been trained to detect and classify PCB defects, improve signal-to-noise ratios in SEM images, recognize wafer failure patterns, and predict failure modes. It explains how new packaging strategies, particularly stacking and disintegration, complicate fault isolation and evaluates the ability of various imaging methods to locate defects in die stacks. It also presents best practices for sample preparation, inspection, and navigation and offers suggestions for improving the reliability and service life of tools.

This chapter provides an introduction to statistical process control and the concept of total quality management. It begins with a review of quality improvement efforts in the extrusion industry and the considerations involved in developing sampling plans and interpreting control charts. It then lays out the steps that would be followed in order to implement statistical testing for billet casting, die performance, or any other process or variable that impacts extrusion quality. The chapter concludes with an overview of the fundamentals of total quality management.

To ensure consistency, quality of results, and documentation compliance, audits are required when heat treating. This chapter introduces basic parts of the ISO certification program.

A typical mobile processor die may contain, among other things, a variety of high-performance as well as low-power processing cores along with 5G modems, Wi-Fi modules, image processors, GPUs, and security modules, with a total transistor count exceeding 10 billion. Such designs pose many challenges for yield ramp and diagnostics. This chapter examines these challenges and the growing demand for innovative solutions to help failure analysts quickly and accurately isolate faults. It also assesses the capabilities and future potential of ATPG scan diagnostics, streaming scan networks, and advanced fault models for diagnosing embedded memory.

This chapter describes the making of iconic structures such as the Chrysler Building. It also describes the discoveries of the Nirosta (18-8) stainless steel that was used for the construction of the Chrysler Building. The chapter presents William Van Alen's description of 18-8 stainless steel for the Chrysler Building. It provides information on the opening ceremonies for the Chrysler Building, Van Alen's vision, and the exterior of the building.

The management of a failure analysis (FA) laboratory requires a broad range of activities to optimize the efficiency of the operation. The purpose of this article is to stimulate readers to consider the various aspects of FA laboratory operations and their respective business management requirements. The various aspects include: staffing, laboratory organization, lab design and operations, strategic development, financial management, and metrics and measurements. References for further reading and examples of resource materials are also included.

This article provides details on several of the classifications of polymer wear mechanisms, using wear data and micrographs from published works. The primary goals are to present the mechanisms of polymer wear and to quantify wear in terms of wear rate. The discussion begins by providing information on the processes involved in interfacial and cohesive wear. This is followed by sections describing the wear process and applications of elastomers, thermosets, glassy thermoplastics, and semicrystalline thermoplastics. The effects of environmental and lubricant on the wear failures of polymers are then discussed. The article further includes a case study describing the tribological performance of nylon. It ends by presenting some examples of wear failures of plastics.

This appendix is a compilation of tables helpful to metallographers in characterizing irons and steels. The tables include AISI/SAE designations and specific composition ranges for various steels and irons, listings of companies that sell metallographic equipment and supplies, and compositions and usage guidance for etchants, chemical polishing solutions, and coatings.

This appendix provides supplemental information on the metallurgical aspects of atomic structure, the use of dislocation theory, heat treatment processes and procedures, important engineering materials and strengthening mechanisms, and the nature of elastic, plastic, and creep strain components. It also provides information on mechanical property and fatigue testing, the use of hysteresis energy to analyze fatigue, a procedure for inverting equations to solve for dependent variables, and a method for dealing with the statistical nature of failure.

This chapter discusses material-related problems associated with coal-fired burners. It explains how high temperatures affect heat-absorbing surfaces in furnace combustion areas and in the convection pass of superheaters and reheaters. It describes how low-NOx combustion technology, intended to reduce NOx emissions, accelerates tube wall wastage. It also covers circumferential cracking in furnace waterwalls, thermal fatigue cracking induced by waterlances and water cannons, superheater-reheater corrosion, and erosion in fluidized-bed boilers.

This chapter provides a detailed review of creep-fatigue analysis techniques, including the 10% rule, strain-range partitioning, several variants of the frequency-modified life equation, damage assessment based on tensile hysteresis energy, the OCTF (oxidation, creep, and thermomechanical fatigue) damage model, and numerous methods that make use of creep-rupture, crack-growth, and void-growth data. It also discusses the use of continuum damage mechanics and includes examples demonstrating the accuracy of each method as well as the procedures involved.

This chapter discusses the effect of fatigue on polymers, ceramics, composites, and bone. It begins with a general comparison of polymers and metals, noting important differences in microstructure and cyclic loading response. It then presents the results of several studies that shed light on the fatigue behavior and crack growth mechanisms of common structural polymers and moves on from there to discuss the fatigue behavior of bone and how it compares to stable and cyclically softening metals. It also discusses the fatigue characteristics of engineered and composited ceramics and ceramic fiber-reinforced metal-matrix composites.

This chapter is a detailed study of the localized corrosion behavior of steel, copper, and aluminum alloys. It applies the basic principles of electrochemistry, as well as materials science and solid and fluid mechanics, to explain the causes and effects of pitting, crevice corrosion, stress corrosion cracking, and corrosion fatigue. It describes the underlying mechanisms associated with each process and how they relate to the microstructure of the metal or alloy, the physical condition of the surface, and other factors such as the coupling of the metal to a dissimilar metal or surface film.

This chapter is largely a compendium of best practices and procedures for minimizing the effects of fatigue. It explains how to make products more resistant to fatigue by choosing the right materials and manufacturing processes, avoiding geometries and features that concentrate strains, preventing or removing surface damage, and by inducing compressive mean stresses that prolong fatigue life. It also discusses the use of property conditioning and restoration treatments, the benefits of interference fits and processes such as coaxing, the effects of assembly damage and operating overload, the importance of surface cleanliness and finish, and the role of inspection, testing, replacement, and repair in safe-life and fail-safe designs. Examples highlighting the benefits and potential pitfalls of proof loading tests are included as well.